References

1. J. C. Eloy, et al., "Advanced Packaging", Yole Development, Lyon, France (2006)
2. Bio Kim. "3D integration with TSV technology" SEMI Technology Symposium (STS) (2009)
3. C.V Thompson Materials Research Society (2007)
4. C.S Tan, et. al. Electrochemical and solid-state Letters, 8 G147-G149 (2005) https://doi.org/10.1149/1.1904506
5. K.N Chen et. al. Journal of electronic materials Vol. 35, (2006)
6. K.N Chen et.al. Journal of ELECTRONIC MATERIALS, 34-12, 1464 (2005) https://doi.org/10.1007/s11664-005-0151-0
7. C.S. TAN et. al, Journal of ELECTRONIC MATERIALS, 34-12, 1598, (2005) https://doi.org/10.1007/s11664-005-0171-9
8. Paul Enquist and Chris Sanders, "3D IC Technology:Interconnect for the 21st centry" Advanced Packaging online article
9. Klumpp, A. Merkel, R., Ramm,P. Japanese Journal of Applied Physics, 43, (L829-L830) https://doi.org/10.1143/JJAP.43.L829
10. Wolf, M, Ramm P., Klumpp A., Fraundofer IZM, EMC 3D symposium)
11. F. Niklaus et. al. Journal of Applied Physics, 99, 031101 (2006)
12. Y. Kwon et.al. MRS symp. Proc. Vol. 766 (2003)
13. Bio Kim et. al SEMI Technology Symposium (2008)