• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.134-141
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• 2001

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.65-89
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• 2003

Next Highly sophisticated communication generation of the Advanced Electronics and Imaging processing society will require a vast information volume and super high speed signal transport and information instruction. This means that super high technology should be created for satisfying the demand. It's also required the high reliability of the communication system itself, It will be supported the new advanced packaging technology of the 3 Dimensional structured system and system integration technology. Here is introduced the new 3 Dimensional technology for IC nnd LSI packaging and Opt-electronics Packaging of ASET activity in Japan.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.6
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• pp.923-931
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• 2013

RFID (Radio Frequency Identification), which is a kind of the electronic tag, is a wireless access device using the radio frequency for recognizing the ID information. It has a variety of application such as the bus card, gate access card, distribution industry, and management of construction materials. The performance and size of RFID depend on the penetrability, recognition ratio, memory size, multi tag recognition, external pollution dust, and exterior impact, and RFID requires the packaging to protect itself considered above factors. Recently, RFID is diversely employed to effectively manage construction materials and the RFID packaging, which is robust to the external impact, is required to attach RFID on construction materials. In this paper, we propose the construction material RFID packaging designed to be robust for the external impact and to be practicable for change of the broken RFID. For the change of RFID, we separate the cast and body of the packaging. Also, we present the detail drawing for the proposed construction material RFID packaging and implement the performance evaluation of the packaging manufactured using 3D printer.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.169-170
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• 2006

A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• Food Science of Animal Resources
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• v.35 no.2
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• pp.248-257
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• 2015

Effects of double packaging (combinational use of aerobic and vacuum conditions) and antioxidants on physicochemical properties in irradiated restructured chicken rolls were determined. Chicken breast treated with antioxidants (none, sesamol+a-tocopherol) was used to process restructured chicken breast rolls. The sliced rolls were vacuum, aerobic, or double packaged (vacuum for 7 d then aerobic for 3 d) and electron beam irradiated at 2.5 kGy. Color, 2-thiobarbituric acid reactive substances (TBARS), oxidation reduction potentials (ORP), and volatile profiles of the samples were determined at 0 and 10 d. Irradiation made restructured chicken rolls redder (p<0.05), and the increased redness was more distinct in irradiated vacuum-packaged than irradiated aerobic or double packaged meats. TBARS values of antioxidant-treated double packaged rolls were lower than even nonirradiated vacuum-packaged meat, and those were distinct at 10 d (p<0.05). ORP and lipid oxidation values were lower in irradiated vacuum and double packaged samples than those in irradiated aerobic packaged ones at 0 d (p<0.05). Irradiation of restructured chicken rolls increased the amount of total volatiles. Considerable amounts of off-odor volatiles were reduced or not detected by double packaging and antioxidant treatment at 10 d. Therefore, the combined use of antioxidants and double packaging would be useful to reduce redness and control the oxidative quality changes of irradiated restructured chicken rolls

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• Corrugated packaging logistics
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• v.9 no.43
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• pp.64-66
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• 2002

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.47-66
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.35-49
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• 2005