Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.07a
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- Pages.134-141
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- 2001
Effects of Cu or Bi Additions on the Creep Properties of the Sn-3.5Ag Solder Alloys
- Shin, S.W. (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST) ;
- Joo, D.K. (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST) ;
- Yu, Jin (Center for Electronic Packaging Materials Department of Mater, Sci. & Eng. KAIST)
- Published : 2001.07.01
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