• Journal of Environmental Science International
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• v.16 no.10
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• pp.1169-1177
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• 2007

The main objective of this research was to evaluate the effects of process variables which were forming ability, flow displacement, effective stress, effective strain, fluid vector and products defects on manufactured artificial lightweight aggregate made of both incinerated sewage sludge ash and clay by means of the numerical analysis of a rigid-plastic finite element method. CATIA (3D CAD program) was used for an extrusion metal mold design that was widely used in designing aircraft, automobile and metallic molds. A metal forming analysis program (ATES Co.) had a function of a rigid-plastic finite element method was used to analyze the program. The result of extrusion forming analysis indicated clearly that a shape retention of the manufactured artificial light-weight aggregate could be maintained by increasing the extrusion ratio (increasing compressive strength inside of extrusion die) and decreasing the die angle. The stress concentration of metal mold was increased by increasing an extrusion ratio, and it was higher in a junction of punch and materials, friction parts between a bottom of the punch and inside of a container, a place of die angle and a place of die of metal mold. Therefore, a heat treatment as well as a rounding treatment for stress distribution in the higher stress concentration regions were necessary to extend a lifetime of the metallic mold. A deformity of the products could have made from several factors which were a surface crack, a lack of the shape retention and a crack of inside of the products. Specially, the surface crack in the products was the most notably affected by the extrusion ratio.

• Proceedings of the KAIS Fall Conference
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• 2012.05b
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• pp.781-784
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• 2012

본 논문은 하이브리드 자동차 및 전기자동차의 고주파 발생시 전자파를 차단하는 역할을 하는 인버터 실드쉘의 프로그레시브 금형의 스트립 레이아웃과 금형설계 및 제작에 관한 연구이다. 총 11공정으로 블랭크 레이아웃을 구성하였고, 3D 금형설계를 하였다. 이와 같이 제작한 금형을 2차에 의한 트라이아웃을 하여 일본에서 수입하던 단발 금형을 프로그레시브 금형으로 인버터 실드쉘을 양산하여 원가절감, 생산성 향상에 기여하였다.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Design & Manufacturing
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• v.15 no.3
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• pp.7-12
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• 2021

Plastic injection molds used for rapid heating and cooling must minimize surface damage due to friction and maintain excellent thermal and low electrical conductivity. Accordingly, various surface treatments are being applied. The properties of Al₂O₃ coating and DLC coating were compared to find the optimal surface treatment method. Al₂O₃ coating was deposited by thermal spray method. DLC films were deposited by sputtering process in room temperature and high temperature PECVD (Plasma enhanced chemical vapor deposition) process in 723 K temperature. For the evaluation of physical properties, the electrical and thermal conductivity including surface hardness, adhesion and wear resistance were analyzed. The electrical resistance of the all coated samples was showed insulation properties of 24 MΩ/sq or more. Especially, the friction coefficient of high temp. DLC coating was the lowest at 0.134.

• Design & Manufacturing
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• v.12 no.3
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• pp.5-12
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• 2018

Plastic containers which provides the opportunity to reduce transportation costs are lighter and less brittle than glass containers. As a results, efforts to replace glass with plastic are ongoing. The blow molding method is a typical approach in producing plastic containers. Single-stage injection blow molding (ISBM) is one of the blow molding methods. However, the difficulty in controlling the temperature during the injection molding process is considered its main disadvantage. In this study, ISBM process analysis of relatively thick walled containers such as cosmetic containers is carried out. The initial temperature distribution of the preform is deemed to be the most influential factor in the accuracy of blow molding for the thick vessel. In order to accurately predict this, all heat transfer processes of the preform are considered. The validity of this analytical procedure is verified by comparing the cross-sectional thickness with the actual product. Finally, the validated analytical method is used to evaluate the factors affecting the thickness of the final molded part. The ISBM analysis technique for thick walled vessels developed through this study can be used as an effective predictor for preform design and blow process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.3 s.357
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• pp.26-34
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• 2007

This Paper describes a chip design technique for body composition analyzer based on the BIA (Bioelectrical Impedance Analysis) method. All the functions of signal forcing circuits to the body, signal detecting circuits from the body, Micom, SRAM and EEPROMS are integrated in one chip. Especially, multi-frequency detecting method can be applied with selective band pass filter (BPF), which is designed in weak inversion region for low power consumption. In addition new full wave rectifier (FWR) is also proposed with differential difference amplifier (DDA) for high performance (small die area low power consumption, rail-to-rail output swing). The prototype chip is implemented with 0.35um CMOS technology and shows the power dissipation of 6 mW at the supply voltage of 3.3V. The die area of prototype chip is $5mm\times5mm$.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.8
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• pp.38-48
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• 2014

In this paper, a design of Signal Processing Analog Front-End IC for Automotive Piezo-Resistive Type Pressure Sensor is presented. In modern society, as the car turns to go from mechanical to electronic technology, the accuracy and reliability of electronic parts required importantly. In order to improve these points, Programmable Gain Amplifier (PGA) amplifies the received signal in accordance with gain for increasing the accuracy after PRT Sensor is operated to change physical pressure signals to electrical signals. The signal amplified from PGA is processed by Digital blocks like ADC, CMC and DAC. After going through this process, it is possible to determine the electrical signal to physical pressure signal. As processing analog signal to digital signal, reliability and accuracy in Analog Front-End IC is increased. The current consumption of IC is 5.32mA. The die area of the fabricated IC is $1.94mm{\times}1.94mm$.

• Journal of IKEEE
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• v.11 no.1 s.20
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• pp.15-23
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• 2007

This paper describes a dual frequency synthesizer designed in a 0.2$\mu$m CMOS technology for wireless LAN applications. The design is focused mainly on low-power characteristics. Power dissipation is minimized especially in VCO and prescaler design. The designed synthesizer includes all building blocks for elimination of external components, other than the crystal. Its operating frequency can be programmed by external data. It operates in the frequency range of 2.3GHz to 2.7GHz (RF) and 250MHz to 800MHz (IF) and consumes 5.14mA at 2.5GHz and 1.08mA at 0.5GHz from a 2.5V supply. The measured phase noise is -85dBc/Hz in-band and -105dBc/Hz at 1MHz offset at IF band. The die area is 1.7mm$\times$1.7mm.

• Transactions of Materials Processing
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• v.9 no.3
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• pp.233-241
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• 2000

It is well known that the quality and efficiency of the design of metal forming processes can be significantly improved with the aid of effective numerical simulations. In the present study, a two-and three-dimensional finite element simulation system, CAMP form, was developed for the analysis of metal forming processes in the PC environment. It is composed of a solver based on the thermo-rigid-viscoplastic approach and graphic user interface (GUI) based pre-and post-processors to be used for the effective description of forming conditions and graphic display of simulation results, respectively. In particular, in the case of CAMPform 2D (two-dimensional), as the solver contains an automatic remeshing module which determines the deformation step when remeshing is required and reconstructs the new mesh system, it is possible to carry out simulations automatically without any user intervention. Also, the forming analysis considers ductile fracture of the workpiece and wear of dies for better usage of the system. In the case of CAMPform 3D, general three-dimensional problems that involve complex die geometries and require remeshing can be analyzed, but full automation of simulations has yet to be achieved. In this paper, the overall structure and computational background of CAMPform will be briefly explained and analysis results of several forming processes will be shown. From the current results, it is construed that CAMPform can be used in providing useful information to assist the design of forming processes.

• Transactions of Materials Processing
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• v.3 no.1
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• pp.110-119
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• 1994

In this paper, a new forming process of large-size forgings of converged nozzle-shape is developed by the experimental study using the incremental forging method and combined forming method. The development of the forming process is focused on the manufacturing of large-size forgings by the press with medium load capacity. Various related processes are proposed and modelling experiments using plasticine are carried out. Thus, the incremental forging method for expanding is recommanded from the study of formability and forming load, etc. The selected process is then subjected to modelling experiments of lead and the design parameters such as preform for final process, die-width of the upper die and reduction amount of each stroke are determined. In order to verify the effectiveness of the selected process, 1/7 scale prototype experiment of the real material is carried out. Forgings of converged nozzle shape can be produced by the developed process within the limit loads and with the simple tools.