• 제목/요약/키워드: 3D Vision Inspection

검색결과 46건 처리시간 0.046초

Compensation of Installation Errors in a Laser Vision System and Dimensional Inspection of Automobile Chassis

  • Barkovski Igor Dunin;Samuel G.L.;Yang Seung-Han
    • Journal of Mechanical Science and Technology
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    • 제20권4호
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    • pp.437-446
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    • 2006
  • Laser vision inspection systems are becoming popular for automated inspection of manufactured components. The performance of such systems can be enhanced by improving accuracy of the hardware and robustness of the software used in the system. This paper presents a new approach for enhancing the capability of a laser vision system by applying hardware compensation and using efficient analysis software. A 3D geometrical model is developed to study and compensate for possible distortions in installation of gantry robot on which the vision system is mounted. Appropriate compensation is applied to the inspection data obtained from the laser vision system based on the parameters in 3D model. The present laser vision system is used for dimensional inspection of car chassis sub frame and lower arm assembly module. An algorithm based on simplex search techniques is used for analyzing the compensated inspection data. The details of 3D model, parameters used for compensation and the measurement data obtained from the system are presented in this paper. The details of search algorithm used for analyzing the measurement data and the results obtained are also presented in the paper. It is observed from the results that, by applying compensation and using appropriate algorithms for analyzing, the error in evaluation of the inspection data can be significantly minimized, thus reducing the risk of rejecting good parts.

자동 표면 결함검사 시스템에서 Retro 광학계를 이용한 3D 깊이정보 측정방법 (Linear System Depth Detection using Retro Reflector for Automatic Vision Inspection System)

  • 주영복
    • 반도체디스플레이기술학회지
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    • 제21권4호
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    • pp.77-80
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    • 2022
  • Automatic Vision Inspection (AVI) systems automatically detect defect features and measure their sizes via camera vision. It has been populated because of the accuracy and consistency in terms of QC (Quality Control) of inspection processes. Also, it is important to predict the performance of an AVI to meet customer's specification in advance. AVI are usually suffered from false negative and positives. It can be overcome by providing extra information such as 3D depth information. Stereo vision processing has been popular for depth extraction of the 3D images from 2D images. However, stereo vision methods usually take long time to process. In this paper, retro optical system using reflectors is proposed and experimented to overcome the problem. The optical system extracts the depth without special SW processes. The vision sensor and optical components such as illumination and depth detecting module are integrated as a unit. The depth information can be extracted on real-time basis and utilized and can improve the performance of an AVI system.

반도체 칩의 높이 측정을 위한 스테레오 비전의 측정값 조정 알고리즘 (Adjustment Algorithms for the Measured Data of Stereo Vision Methods for Measuring the Height of Semiconductor Chips)

  • 김영두;조태훈
    • 반도체디스플레이기술학회지
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    • 제10권2호
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    • pp.97-102
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    • 2011
  • Lots of 2D vision algorithms have been applied for inspection. However, these 2D vision algorithms have limitation in inspection applications which require 3D information data such as the height of semiconductor chips. Stereo vision is a well known method to measure the distance from the camera to the object to be measured. But it is difficult to apply for inspection directly because of its measurement error. In this paper, we propose two adjustment methods to reduce the error of the measured height data for stereo vision. The weight value based model is used to minimize the mean squared error. The average value based model is used with simple concept to reduce the measured error. The effect of these algorithms has been proved through the experiments which measure the height of semiconductor chips.

기하학적 패턴 매칭을 이용한 3차원 비전 검사 알고리즘 (3D Vision Inspection Algorithm Using the Geometrical Pattern Matching)

  • 정철진;허경무
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 V
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    • pp.2533-2536
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    • 2003
  • In this paper, we suggest the 3D Vision Inspection Algorithm which is based on the external shape feature, and is able to recognize the object. Because many objects made by human have the regular shape, if we posses the database of pattern and we recognize the object using the database of the object's pattern, we could inspect the objects of many fields. Thus, this paper suggest the 3D Vision inspection Algorithm using the Geometrical Pattern Matching by making the 3D database.

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기하학적 패턴 매칭을 이용한 3차원 비전 검사 알고리즘 (3D Vision Inspection Algorithm using Geometrical Pattern Matching Method)

  • 정철진;허경무;김장기
    • 제어로봇시스템학회논문지
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    • 제10권1호
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    • pp.54-59
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    • 2004
  • We suggest a 3D vision inspection algorithm which is based on the external shape feature. Because many electronic parts have the regular shape, if we have the database of pattern and can recognize the object using the database of the object s pattern, we can inspect many types of electronic parts. Our proposed algorithm uses the geometrical pattern matching method and 3D database on the electronic parts. We applied our suggested algorithm fer inspecting several objects including typical IC and capacitor. Through the experiments, we could find that our suggested algorithm is more effective and more robust to the inspection environment(rotation angle, light source, etc.) than conventional 2D inspection methods. We also compared our suggested algorithm with the feature space trajectory method.

1대의 카메라를 이용한 3차원 비전 검사 방법 (A 3D Vision Inspection Method using One Camera)

  • 정철진;허경무
    • 전자공학회논문지CI
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    • 제41권1호
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    • pp.19-26
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    • 2004
  • 본 논문에서 우리는 기존의 2차원 비전검사 시스템에 적용시킬 수 있는 1대의 카메라를 이용한 3차원 비전검사 알고리즘을 제안한다. 부품의 패턴 데이터베이스를 보유하여 이를 토대로 회전되어진 물체의 형태를 예측 가능하다면 충분히 하나의 이미지로 3차원 비전검사가 가능하다. 우리는 제안된 알고리즘에 3차원 데이터베이스, 2차원 기하학적 패턴매칭 그리고 회전변환 이론을 사용하였으며, 그 결과 물체의 회전각도를 예측함으로써, 각도가 틀어진 물체의 검사 가능성이나 전반적인 물체의 인식 등을 해결하였다. 또한 우리는 알고리즘을 전형적인 IC와 커패시터에 적용시켰으며 기존의 2차원 비전검사 및 3차원비전 알고리즘인 특징공간궤적 방법과 비교하였다.

3-Dimensional Micro Solder Ball Inspection Using LED Reflection Image

  • Kim, Jee Hong
    • International journal of advanced smart convergence
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    • 제8권3호
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    • pp.39-45
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    • 2019
  • This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

${\mu}BGA$ 납볼 검사 알고리즘 개발 (Development of ${\mu}BGA$ Solder Ball Inspection Algorithm)

  • 박종욱;양진세;최태영
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 하계종합학술대회 논문집(4)
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    • pp.139-142
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    • 2000
  • $\mu$BGA(Ball Grid Array) is growing in response to a great demand for smaller and lighter packages for the use in laptop, mobile phones and other evolving products. However it is not easy to find its defect by human visual due to in very small dimension. From this point of view, we are interested its development of a vision based automated inspection algorithm. For this, first a 2D view of $\mu$BGA is described under a special blue illumination. Second, a notation-invariant 2D inspection algorithm is developed. Finally a 3D inspection algorithm is proposed for the case of stereo vision system. As a simulation result, it is shown that 3D defect not easy to find by 2D algorithm can be detected by the proposed inspection algorithm.

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레이저 비전을 이용한 2단 가변밸브 리프트 모듈의 3D 조립검사에 대한 연구 (Study on the 3D Assembly Inspection of Two-Step Variable Valve Lift Modules Using Laser-Vision Technology)

  • 웬후쿠옹;김도중;이병룡
    • 대한기계학회논문집A
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    • 제41권10호
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    • pp.949-957
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    • 2017
  • 본 논문에서는 2단 가변 밸브 리프트 모듈의 조립불량 검사를 수행하기 위하여, 레이저 비전 기반의 높이 측정 시스템을 개발하였다. 측정방식은 레이저 비전 센서 모듈을 이용하여 삼각 측량법의 원리에 기초하여 3차원 점군집(point cloud) 데이터를 수집하고, 이를 바탕으로 밸브 위치의 높이 차이를 계산하였다. 본 논문에서는 먼저, 측정 시스템의 구성과 제안된 높이 측정 알고리즘을 설명하였다. 그리고, 레이저 비전 기반의 3차원 측정을 위한 실험장치를 구성하였다. 마지막으로, 실험장치의 정확성과 반복성을 검증하기 위해서, 2단 가변 밸브 리프트 모듈에서의 래쉬조정기 및 밸브간의 고저 차이를 측정하는 실험들을 여러 번 수행하였다. 실험 수행결과, 제안된 레이저 비전 기반의 높이 측정 시스템은 2단 가변밸브 리프트 모듈 조립 검사에 대한 높은 정확성, 반복성 및 안정성을 확보하고 있음을 확인할 수 있었다.