• Title/Summary/Keyword: 3D Thermal Information

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Proposal of Potted Inductor with Enhanced Thermal Transfer for High Power Boost Converter in HEVs

  • You, Bong-Gi;Ko, Jeong-Min;Kim, Jun-Hyung;Lee, Byoung-Kuk
    • Journal of Electrical Engineering and Technology
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    • v.10 no.3
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    • pp.1075-1080
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    • 2015
  • A hybrid electric vehicle (HEV) powertrain has more than one energy source including a high-voltage electric battery. However, for a high voltage electric battery, the average current is relatively low for a given power level. Introduced to increase the voltage of a HEV battery, a compact, high-efficiency boost converter, sometimes called a step-up converter, is a dc-dc converter with an output voltage greater than its input voltage. The inductor occupies more than 30% of the total converter volume making it difficult to get high power density. The inductor should have the characteristics of good thermal stability, low weight, low losses and low EMI. In this paper, Mega Flux® was selected as the core material among potential core candidates. Different structured inductors with Mega Flux® were fabricated to compare the performance between the conventional air cooled and proposed potting structure. The proposed inductor has reduced the weight by 75% from 8.8kg to 2.18kg and the power density was increased from 15.6W/cc to 56.4W/cc compared with conventional inductor. To optimize the performance of proposed inductor, the potting materials with various thermal conductivities were investigated. Silicone with alumina was chosen as potting materials due to the high thermo-stable properties. The proposed inductors used potting material with thermal conductivities of 0.7W/m·K, 1.0W/m·K and 1.6W/m·K to analyze the thermal performance. Simulations of the proposed inductor were fulfilled in terms of magnetic flux saturation, leakage flux and temperature rise. The temperature rise and power efficiency were measured with the 40kW boost converter. Experimental results show that the proposed inductor reached the temperature saturation of 107℃ in 20 minutes. On the other hand, the temperature of conventional inductor rose by 138℃ without saturation. And the effect of thermal conductivity was verified as the highest thermal conductivity of potting materials leads to the lowest temperature saturations.

Application case for phase III of UAM-LWR benchmark: Uncertainty propagation of thermal-hydraulic macroscopic parameters

  • Mesado, C.;Miro, R.;Verdu, G.
    • Nuclear Engineering and Technology
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    • v.52 no.8
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    • pp.1626-1637
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    • 2020
  • This work covers an important point of the benchmark released by the expert group on Uncertainty Analysis in Modeling of Light Water Reactors. This ambitious benchmark aims to determine the uncertainty in light water reactors systems and processes in all stages of calculation, with emphasis on multi-physics (coupled) and multi-scale simulations. The Gesellschaft für Anlagen und Reaktorsicherheit methodology is used to propagate the thermal-hydraulic uncertainty of macroscopic parameters through TRACE5.0p3/PARCSv3.0 coupled code. The main innovative points achieved in this work are i) a new thermal-hydraulic model is developed with a highly-accurate 3D core discretization plus an iterative process is presented to adjust the 3D bypass flow, ii) a control rod insertion occurrence -which data is obtained from a real PWR test- is used as a transient simulation, iii) two approaches are used for the propagation process: maximum response where the uncertainty and sensitivity analysis is performed for the maximum absolute response and index dependent where the uncertainty and sensitivity analysis is performed at each time step, and iv) RESTING MATLAB code is developed to automate the model generation process and, then, propagate the thermal-hydraulic uncertainty. The input uncertainty information is found in related literature or, if not found, defined based on expert judgment. This paper, first, presents the Gesellschaft für Anlagen und Reaktorsicherheit methodology to propagate the uncertainty in thermal-hydraulic macroscopic parameters and, then, shows the results when the methodology is applied to a PWR reactor.

Highly Linear 1 W Power Amplifier MMIC for the 900 MHz Band Using InGaP/GaAs HBT (InGaP/GaAs HBT를 이용한 900 MHz 대역 1 W급 고선형 전력 증폭기 MMIC 설계)

  • Joo, So-Yeon;Han, Su-Yeon;Song, Min-Geun;Kim, Hyung-Chul;Kim, Min-Su;Noh, Sang-Youn;Yoo, Hyung-Mo;Yang, Youn-Goo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.9
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    • pp.897-903
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    • 2011
  • This paper presents a highly linear power amplifier MMIC, having an output power level of about 1 watt, based on InGaP/GaAs hetero-junction bipolar transistor(HBT) technology for the 900 MHz band. The active bias circuit is applied to minimize the effect of temperature variation. Ballast resistors are optimized to prevent a current collapse and a thermal runaway. The fabricated power amplifier exhibited a gain of 17.6 dB, an output P1dB of 30 dBm, and a PAE of 44.9 % at an output P1dB from the one-tone excitation. It also showed a very high OIP3 of 47.3 dBm at an average output power of 20 dBm from the two-tone excitation.

Characteristics of Polysilicon Resistors with High Thermal Stability Fabricated by POCl$_{3}$ Doping and Arsenic Implantation (POCl$_{3}$ 도핑 및 비소 이온주입공정으로 제작한 높은 안정성을 갖는 다결정실리콘 저항소자 특성)

  • 이대우;노태문;구진근;남기수
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.7
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    • pp.56-62
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    • 1998
  • Polysilicon resistors with high thermal stability have been fabricated by a new mixed process using POCl$_{3}$ doping and arsenic implantation. Varous temeprature coefficients, which range form 510 ppm/.deg. C to -302 ppm/.deg. C, were shown from the fabricated polysilicon resistors with sheet resistance of 58~107 .ohm./sq in the operating temeprature of 27~150.deg. C. The temperature coefficient of the polysilicon resistor by the mixed technology was about 4.3 times as low compared to the conventional polysilicon resistor using POCl$_{3}$ doped single process with the same sheet resistance of 75.ohm./sq. In addition, the mixed technology can be applied to obtain nearly zero temperature coefficient for polysilicon resistors which are reliable and insensitive to temperature.

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Effects of NH3 on the Growth of Oxide Film by Infrared-CVD Method (적외선 CVD 방법을 이용한 산화막 성장에 $NH_3$가 미치는 영향)

  • Lee, Chul-Seung;Chung, Kwan-Soo;Kim, Chul-Ju
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.25 no.11
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    • pp.1329-1334
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    • 1988
  • A new method was developed for growing oxidation film by thermal reaction of $NH_3$ and $O_2$. The growth rate increased with the increase of partial pressure of $NH_3$. Optical transparency of the growth film was 12% at the wave number 1100 $cm^{-1}$ compared with 17% by thermal dry oxidation method, and the quality was much better. In C-V characteristic curve, $Q_{OX}$ was almost equal to $Q_{SS}$ and no hysteresis phenomena was observed. n-MOS transistors fabricated with this new method showed $I_D$-$V_{DS}$ characteristics better than thermal dry oxidation method.

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Basic Implementation of Multi Input CNN for Face Recognition (얼굴인식을 위한 다중입력 CNN의 기본 구현)

  • Cheema, Usman;Moon, Seungbin
    • Proceedings of the Korea Information Processing Society Conference
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    • 2019.10a
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    • pp.1002-1003
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    • 2019
  • Face recognition is an extensively researched area of computer vision. Visible, infrared, thermal, and 3D modalities have been used against various challenges of face recognition such as illumination, pose, expression, partial information, and disguise. In this paper we present a multi-modal approach to face recognition using convolutional neural networks. We use visible and thermal face images as two separate inputs to a multi-input deep learning network for face recognition. The experiments are performed on IRIS visible and thermal face database and high face verification rates are achieved.

A Study of the Thermal Characteristics of a Photovoltaic Device with Surface Texturization (표면 Texturization을 가진 Photovoltaic Device 내부의 열 분포 특성에 관한 연구)

  • Jung, Ji-Chul;Moon, Kyoung-Sook;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.7
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    • pp.509-512
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    • 2010
  • The thermal distribution of 2D and 3D p-n photovoltaic diode structures with and without surface texturing has been studied. By analysis of the numerical simulation results of the I-V characteristics and lattice temperature distributions the effect of different texturing structures on the characteristics of silicon p-n photovoltaic devices has been studied systematically. The efficiency of the device having surface texturing shows more than ~2% enhancement compared to the reference devices which did not have texturing. In addition, the effect of the density of the texturing groove has been studied and it has been confirmed that the texturing structure not only improves the light trapping but also plays an important role in the heat radiation.

3D Modeling of a Fabric based on its 3D Microstructure Image and Application of the Model of the Numerical Simulation of Heat Transfer

  • Lee, Hyojeong;Lee, Heeran;Eom, Ran-i;Lee, Yejin
    • Journal of Fashion Business
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    • v.20 no.3
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    • pp.30-42
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    • 2016
  • The objective of this study was to perform 3D solid modeling from 3D scanned surface images of cotton and silk in order to calculate the thermal heat transfer responses using numerical simulations. Continuing from the previous methodology, which provided 3D surface data for a fabric through optical measurements of the fabric microstructure, a simplified 3D solid model, containing a defined unit cell, pattern unit and fabric structure, was prepared. The loft method was used for 3D solid-model generation, and heat transfer calculations, made for the fabric, were then carried out using the 3D solid model. As a result, comprehensive protocols for 3D solid-model generation were established based on the optical measurements of real fabric samples. This method provides an effective means of using 3D information for building 3D models of actual fabrics and applying the model in numerical simulations. The developed process can be used as the basis for other analogous research areas to investigate the physical characteristics of any fabrics.

IR signature modeling using an equivalent thermal circuit (등가 열회로를 이용한 물체의 적외선 특성 모델링)

  • 홍현기;한성현;홍경표;최종수
    • Journal of the Korean Institute of Telematics and Electronics S
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    • v.35S no.1
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    • pp.122-129
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    • 1998
  • For generation and analysis of the multi-sensory image, we propose a new three dimensional (3D) modeling method considering an iternal heat source. We represent the heat conduction process within th object as an equivalent thermal circuit. Therefore, without a complex computation, our modeling approach can obtain thermal features of the object. By using the faceted model, the proposed method can express the accurate visual signatures of the object. Comparing the estimates datum with the obtained surface temperatures, we have demonstrated that the proposed method can provide a precise thermal features. The thermal images by out model is applicable to simulate a tracking loop of an IR missile.

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VRML Database Access for 3D Real-time Data Visualization in MiWiTM Thermal Wireless Sensor Network (마이와이 표준의 열 센서망의 3차원 실시간 자료 시각화를 위한 가상 현실 모델링 언어 데이터베이스 액세스)

  • Wan, Xue-Fen;Yang, Yi;Cui, Jian;Zheng, Tao;Ma, Li
    • Journal of the Institute of Electronics and Information Engineers
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    • v.49 no.12
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    • pp.164-170
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    • 2012
  • A Virtual Reality Modeling Language (VRML) database access in remote virtual reality control platform for dyeing enterprise $MiWi^{TM}$ thermal sensor network is presented in this paper. The VRML-ASP framework is introduced for 3D real-time data plotting in this application. The activities of thermal sensor nodes and sensor area are analyzed. The database access framework is optimized for $MiWi^{TM}$ wireless sensor networks. The experimental results show that VRML-ASP database access framework could be a reliable and competitive data-manage candidate for targeted virtual reality remote industrial visualization application.