• Food Science and Preservation
• /
• v.16 no.1
• /
• pp.128-133
• /
• 2009

We performed an experiment of keeping the extension of raw and semi-dried flounder (Pleuronectes herzensteini). The effect of with (WG) or without gill (OG), drying degree (20% drying: 20D, 40% drying: 40D) and storage temperature($5^{\circ}C$) and 0.1% chitosan-ascorbate (CA) treatment of vacuum packaging flounder on the growth of contaminated microorganism during storage for 10 days were investigated. Total aerobacter (TA) in the OG-treated raw flounder was $0.29{\sim}0.44$ log cycle lower than that of WG-treated flounder. Also, the number of Staphylococcus aureus (SA) and E. coli (EO) in OG were lower compared with WG. The number of TA, SA and EO in 20 D among 0 D, 20 D and 40 D stored at $5^{\circ}C$ were lowest. Especially, the SA and EO was $0.13{\sim}0.53$, 0.3-0.88, and 0.13-0.74 log cycle lower compared with raw flounder. The growth of TA, SA and EO separated from raw flounder in tryptic soy broth were completely inhibited by 0.1% CA. The anti-biotical effect of CA of two microorganisms SA and EO that separated from flounder, and the growth of all of them were 90% (SA), 96% (EO) inhibited at the 0.1% CA. The inhibition times at $37^{\circ}C$ in soy broth was 36 hr. However when CA was added directly to flounder, it appeared inhibition effect to 0.88 log cycle. The effect of CA was better when gills removed and 20% drying.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.3
• /
• pp.47-52
• /
• 2008

This investigation was performed in order to study the properties of deposition and layers by Silicon Dioxide, SiO2, as dielectric onto Via and Trench which have high Aspect Ratio (AR). Thus, in order to confirm these properties, three types of CVD, which were PECVD, PETEOS, and ALD, were selected. On the experiment each of the property sections was estimated that step overage of PECVD: <30%, PETEOS: 45%, ALD: 75% and the RSM of PECVD: 27.8 nm, PETEOS: 2.1 nm, ALD: <2.0 nm. As a result of this experiment for the property of electric film, ALD was valuated to be the most favorable outcome. However, ALD was valuated to have the least quality for the deposition rate. ALD deposition rate, $10\;\AA/min$ by $1\;\AA$/1cycle, was prominently lower than PETEOS, which had the deposition rate of $5000\;\AA$/min. Since electric film requires at least $1000\;\AA$ thicknesses, ALD was not suitable for the deposition rate. which is the most important component in a practical use. Therefore, in this particular study, PETEOS was evaluated to be the most suitable recipe.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.23 no.3
• /
• pp.183-190
• /
• 2017

Carton clamp truck is widely perceived as the high-efficient handling equipment of factory premises and warehouse by its capability of palletless handling. Therefore, the significance of a lab-based handling simulation is becoming higher with the growth of clamp truck usage. In this study, preliminary FEA and design of handling test courses for the lab-based simulation of carton clamp truck handling were performed, and the PSD analyses were performed for the modified one for the test course proposed by Park et al. (2017) as well as ASTM D 6055 and ISTA 3B standards. For the vibration in all directions, the vibration energy intensity analyzed by ISTA 3B standard showed higher than that by the other two cases. A FEA was performed for the handling operation of the sudden stop of the clamps after lifting the target HCP (heavyweight refrigerator corrugated package, w=180 kgf) up to the specified height. The slip distance between the clamp arm and the target HCP was 0.85 mm. The simulation result of 0.85 mm was 3.7 times lower than the experimental result (3.2 mm) obtained by Park et al. (2017), and it was estimated that the deviation comes from both the experimental error by weight imbalance of target HCP, and excessive simplification during the FE modelling of target HCP.

• Journal of Welding and Joining
• /
• v.24 no.2
• /
• pp.64-70
• /
• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Asian-Australasian Journal of Animal Sciences
• /
• v.26 no.1
• /
• pp.134-142
• /
• 2013

The effect of modified atmosphere packaging (MAP; 30% $CO_2$+70% $N_2$ or 100% $N_2$) and an additive mixture (500 ppm rosemary extract, 3,000 ppm sodium acetate and 1,500 ppm calcium lactate) on the quality of pre-cooked hamburger patties during storage at $5^{\circ}C$ for 14 d was evaluated. The addition of the additive mixture reduced aerobic and anaerobic bacteria counts in both 30% $CO_2$-MAP (30% $CO_2$+70% $N_2$) and 100% $N_2$-MAP (p<0.05). The 30% $CO_2$-MAP was more effective to suppress the microbial growth than 100% $N_2$-MAP, moreover the 30% $CO_2$-MAP combined with additive mixture resulted in the lowest bacterial counts. The hamburger patties with additive mixture showed lower CIE $L^*$ and CIE $a^*$, and higher CIE $b^*$ than those with no additive mixture. The 30% $CO_2$-MAP tended to decrease the TBARS during storage regardless of the addition of additives. The use of 30% $CO_2$-MAP in combination with additives mixture was effective for maintaining the quality and extending the shelf-life of pre-cooked hamburger patties.

• Journal of Biosystems Engineering
• /
• v.40 no.4
• /
• pp.409-416
• /
• 2015

Purpose: This study evaluates a new banana bulk packaging method under the real transport conditions of Sri Lanka. Methods: A field evaluation of optimized 8-mm thick Styrofoam sheets used as the cushioning material was applied. A trial transport was conducted from Thambuttegama to Colombo using a medium-sized open truck, with banana leaves as the control material. Data were recorded at the farmer, transporter, retailer, and consumer stages of the supply chain. Mechanical damage, physiological loss in weight, fruit firmness, total soluble solids, ripeness index, visual quality ratings, and the physical damage index of the bananas were measured at each stage. A cost-benefit analysis was also conducted for both packaging methods. Results: The 8-mm styrofoam sheets significantly reduced (p < 0.05) the mechanical damage from 26.3% to 12.9% compared to the conventional method for long-distance transport, and the physiological loss in weight showed a decrease of 2.88%. The loss of firmness of the fruits followed a simmilar pattern for both methods until reaching the retailer, but at the consumer was significantly higher (p < 0.05) for the control. However, the physical damage index at the retail stage for the control showed symptoms of physical injury, whereas the bananas transported using the cushioning materials exhibited only minor symptoms. Further, the visual quality of the fruits after transport from the farmer to the consumer was preserved, which is one of the main factors affecting consumer preference and retail price. The proposed method increases the profit margin by 51.2% for Embul bananas owing to the reduced postharvest losses. Conclusion: The 8-mm thick Styrofoam sheets reduced the physical damage to the bananas, with the quality parameters maintained at the prefered level. Moreover, profits may be increased.

• Journal of Biosystems Engineering
• /
• v.19 no.4
• /
• pp.358-368
• /
• 1994

Major factors in reducing the stacking strength of corrugated fiberboard boxes in cold storage or transport conditions are high relative humidity, causing elevated moisture absorption by the boxes. The bottom boxes in a stack will deform to the critical deflection causing agricultural products damage there, and eventually additional deflection will cause box collapse and finally toppling of the stack. The study was conducted to determine the water absorption characteristics and the compressive strength of the corrugated fiberboard boxes being widely used in packaging agricultural products in Korea. The sample boxes for the study were selected from the regular slotted containers (RSC) types, and one was the box used in apple packaging (Box A), another one was the box used in pear packaging (Box B). The corrugated shipping containers were made from a large portion of recycled fibers in Korea, and comparing with Box B, Box A was fabricated from fiberboard which contained more percentage of old corrugated containers (OCC) imported from foreign countries than domestic waste paper. The results obtained from the study were summarized as follows ; 1. Equilibrium moisture content (EMC) of the sample boxes was established after about 20 hours, and the EMC by absorption was lower than that by desorption. The EMC increased with the increasing of relative humidity and with the decreasing of temperature, and the rate of increasing was much higher above the relative humidity of 50%. 2. The maximum compressive strength of Box A was about 100 kgf greater than that of Box B on the same enviromental conditions. The strength of the sample boxes decreased rapidly with the increasing of relative humidity. The effect of relative humidity on the strength was a little higher than that of temperature. 3. As the applied load was progressively increased and a level was reached, the vertical side panels ($L{\times}D$) deflected laterally inwards or outwards. The panels deflected laterally inwards at higher relative humidity. 4. The maximum compressive deflection ratio and the critical deflection ratio of the sample boxes were increased linearly with the increasing of relative hunidity, but trends for its ratios showed inconsistant response to temperature.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.4
• /
• pp.42-45
• /
• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• Electronics and Telecommunications Trends
• /
• v.38 no.6
• /
• pp.41-51
• /
• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.21 no.1
• /
• pp.35-40
• /
• 2015

Effect of packaging and storage methods for enhancing the shelf life and improving the postharvest quality of lettuce (Lactuca sativa L.) was studied during high temperature period. Lettuces were packed using four packaging and storage types: (A) plastic box container (control); (B) plastic box container covered with high density polyethylene (HDPE) film; (C) plastic box container with lettuce wrapped in linear low-density polyethylene (LLD-PE) film; and (D) plastic box container with lettuce with its stem. The quality parameters, such as fresh weight loss, SPAD value, and appearance of lettuce were investigated. The lettuce wrapped with LLD-PE film inside the plastic box container showed the lowest weight loss, highest SPAD value and best appearance compared to those exposed to the other packaging and storage methods during the three-week storage at $2^{\circ}C$. The results indicate that the marketability of lettuce can be optimized if proper packaging and storing is adopted. Prolonging the freshness even on low temperature storage will increase the potential of its sale ability in the domestic market even during summer season.