• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(5)
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• International Journal of Industrial Entomology and Biomaterials
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• 제3권2호
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• pp.117-120
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• 2001

In India, mulberry (Morus spp.), the sole food plant of the silkworm, Bombyx mori (Linn.), is prone to infestation by the pink mealybug, Maconellicoccus hirsutus (Green). Infestation by this pest causes apical shoot malformation, popularly known as 'tukra'. Occurrence of tukra causes an appreciable reduction in leaf yield and quality, leading to low silkworm cocoon productivity. For management of M. hirsutus (Tukra), an IPM package comprising mechanical, chemical and biological measures was demonstrated in the mulberry gardens of five Government Silk Farms in Mysore District (Karnataka, India) during 1995-96. A suppression of 76.0% in tukra incidence and 90.19% in mealybug population was recorded by employ the IPM package which led to an estimated 4,000 kg recovery in leaf yield/ha/year. The impact of IPM package in the management of M. hirsutus, the role of biocontrol agent (Cryptolaemus montrouzieri Muls.) in pest suppression and the cost-benefit analysis of the IPM package are discussed.

• 한국IT서비스학회지
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• 제15권3호
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• pp.71-95
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• 2016

In recent years, text mining has been used to extract meaningful insights from the large volume of unstructured text data sets of various domains. As one of the most representative text mining applications, topic modeling has been widely used to extract main topics in the form of a set of keywords extracted from a large collection of documents. In general, topic modeling is performed according to the weighted frequency of words in a document corpus. However, general topic modeling cannot discover the relation between documents if the documents share only a few terms, although the documents are in fact strongly related from a particular perspective. For instance, a document about "sexual offense" and another document about "silver industry for aged persons" might not be classified into the same topic because they may not share many key terms. However, these two documents can be strongly related from the R&D perspective because some technologies, such as "RF Tag," "CCTV," and "Heart Rate Sensor," are core components of both "sexual offense" and "silver industry." Thus, in this study, we attempted to discover the differences between the results of general topic modeling and R&D perspective topic modeling. Furthermore, we package social issues from the R&D perspective and present a prototype system, which provides a package of news articles for each R&D issue. Finally, we analyze the quality of R&D perspective topic modeling and provide the results of inter- and intra-topic analysis.

• 한국통신학회논문지
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• 제28권7A호
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• pp.563-568
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• 2003

본 논문에서는 무선 통신 시스템의 SOP(System-On-Package)를 위하여 LTCC(Low Temperature Co-fired Ceramic)를 이용하여 다층구조의 초소형 병렬결합 대역통과 여파기를 제안하였다. 제작된 대역통과 여파기는 106 $\mu\textrm{m}$의 두께인 LTCC sheet가 5층으로 구성되었고 크기는 5.24mm x 4.3mm x 0.53mm이다. 측정된 대역통과 여파기는 중심주파수 5.8GHz에서 200MHz의 대역폭을 가지며, 통과대역에서 13.679dB의 반사손실과 2.326dB의 삽입손실, 그리고 4.7GHz에서 28.052dB의 감쇄특성을 갖는다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.76-81
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• 1998

The purpose of this study is the generation of B-spline surface by the 3D measurement data. The hardware of the system comprises PC and digitizing machine, machining center. There are three steps, (1) physical model measuring on the 3D laser digitizing machine, (2) B-spline surface modeling and Fairing, (3) CNC machining by the NC code. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• 한국표면공학회지
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• 제54권3호
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• 한국콘텐츠학회논문지
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• 제7권12호
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• pp.1-12
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• 2007

문헌과 풍속도를 통해 보자기의 용도와 쓰임새를 알아보고, 민보와 상용보를 중심으로 그 가치와 기능을 분석 하였다. 산업사회 가방문화의 단일성과는 달리 보자기는 다양성과 역동성, 가변적수용성, 2차원과 3차원이 동시에 공존하고 있다는 것을 발견했고, 보자기를 만드는 과정에 있어서 짜투리 천조각의 재활용성은 세계 어느 전통 운반기구의 문화 에서도 찾아볼 수 없는 친환경적요소를 내재하고 있다. 이런 다의적 요소들은 기술과 재료의 발달로 다양한 기능으로 컨버전스 되어 새로운 관점의 포장디자인이 가능해진다. 이를 현대 포장디자인 관점에서 분석하여 복합적이고, 융합적인 다양한 기능의 현대 포장디자인 방향을 제시한다.

• 대한전자공학회논문지SD
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• 제43권9호
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• pp.64-68
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• 2006

본 연구에서는 Si bump를 이용해 기판의 기계적, 열적 특성을 개선한 MCM-D 기판공정을 개발하였고, 이를 system-on-package(SOP)-D개념의 system 구현에 적용하고자 하였다. 이 과정에서 밀리미터파 대역에 적용될 수 있는 필터를 설계하고 구현하여 그 특성을 관찰하였다. 두 가지 형태의 필터를 구현하였는데 첫 번째는 공진기간의 커플링을 이용한 구조로서 2층의 금속층과 3층의 유전체(BCB)를 이용하였다. 구현된 필터 특성은 중심주파수 55 GHz에서의 삽입손실이 2.6 dB이고 군지연이 0.06 ns정도로 우수한 특성을 나타내었다. 또한 일반적으로 알려진coupled line 형태의 필터를 구현하였는데 삽입손실이 3 dB, 군지연이 0.1 ns정도의 특성을 나타내었다. 이렇게 내장형 필터를 포함한 MCM-D 기판은 MMIC를 flip-chip 방법으로 실장 할 수 있어서 집적화된 밀리미터파 대역 초소형 system 구현에 적용되어 우수한 특성을 나타낼 것으로 기대된다.