• Nuclear Engineering and Technology
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• v.53 no.7
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• pp.2151-2161
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• 2021

Nuclear data (ND) sensitivity and uncertainty (S/U) quantification in shielding applications is performed using deterministic and probabilistic approaches. In this paper the validation of the newly developed deterministic program package ASUSD (ADVANTG + SUSD3D) is presented. ASUSD was developed with the aim of automating the process of ND S/U while retaining the computational efficiency of the deterministic approach to ND S/U analysis. The paper includes a detailed description of each of the programs contained within ASUSD, the computational workflow and validation results. ASUSD was validated on two shielding benchmark experiments from the Shielding Integral Benchmark Archive and Database (SINBAD) - the fission relevant ASPIS Iron 88 experiment and the fusion relevant Frascati Neutron Generator (FNG) Helium Cooled Pebble Bed (HCPB) Test Blanket Module (TBM) mock-up experiment. The validation process was performed in two stages. Firstly, the Denovo discrete ordinates transport solver was validated as a standalone solver. Secondly, the ASUSD program package as a whole was validated as a ND S/U analysis tool. Both stages of the validation process yielded excellent results, with a maximum difference of 17% in final uncertainties due to ND between ASUSD and the stochastic ND S/U approach. Based on these results, ASUSD has proven to be a user friendly and computationally efficient tool for deterministic ND S/U analysis of shielding geometries.

• Journal of Advanced Navigation Technology
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• v.5 no.2
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• pp.141-148
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• 2001

This paper describe the development of narrow-band passband filter with small package and low loss, high selectivity performance. This filter is placed between power amplifier and frequency mixer of IMT-2000 mobile equipment. The elliptic-function narrow-band passband filter is designed with new architecture using the microstrip line. This package is very small by $3.2cm{\times}1.25cm$ and have the 3 % 3 dB bandwidth. Also in the passband the insertion loss is about 2.5 dB and is better than older RF SAW filter(insertion loss: 3.2 dB). In the stop-band it has the two deep notch under the -56 dB.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.12
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• pp.18-22
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• 2009

• Journal of Surface Science and Engineering
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• v.43 no.3
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• pp.142-147
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• 2010

We evaluated characteristics of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface treatment for mobile equipment that requires high reliability, in addition to investigating surface treatment processes for semiconductor boards that require high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc and application for semiconductor package board of SIP, BOC. As a result, it appeared that ENEPIG has superior properties compared to ENIG surface treatment in corrosion resistance, solder junction, wetting, etc. We anticipate that these results will be able to lend credibility to ENEPIG as a low-cost alternative for producing mobile devices such as the cell phones, especially when applied to mass production.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.857-863
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• 2014

In this work, we introduce various bonding technologies for 3D package and suggest Insert-Bump bonding (ISB) process newly to stack multi-layer chips successively. Microstructure of Insert-Bump bonding (ISB) specimens is investigated with respect to bonding parameters. Through experiments, we study on find optimal bonding conditions such as bonding temperature and bonding pressure and also evaluate in the case of fluxing and no-fluxing condition. Although no-fluxing bonding process is applied to ISB bonding process, good bonding interface at $270^{\circ}C$ is formed due to the effect of oxide layer breakage.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.147-164
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• 2001

1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

• International Journal of Industrial Entomology and Biomaterials
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• v.3 no.2
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• pp.135-139
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• 2001

Experiments were held in Egypt to test a new Package of practices for commercial cocoon production, including adding secondary macro and micronutrients to the mulberry garden, disease free rearing regime, low temperature rearing in young instars and natural mounting fur silkworms. This package for seed silkworm rearing lead to increase in fecundity by 67-121eggs (15.12-26.22%) and yield of standard boxes per 1 parent egg boxes by 57-58 egg boxes(48.33-51.66%) respectively in comparison th the traditional cocoon production technology.

• Fashion Information and Technology
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• v.13
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• pp.34-41
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• 2016

• 한국전산유체공학회:학술대회논문집
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• 2002.05a
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• pp.94-101
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• 2002

The steam turbine rotor blade is designed using the Turbine Rotor Design Package developed by the authors. It can quickly accomplish blade shape design in the power plant industry. The quasi-3d code is employed for analysis of passage flow in the blade sections. Iterative change of each blade shape is made by moving position of control points in the Bezier curve under GUI(graphic user interface) environment. The full 3-D blade shape is obtained by stacking of the section blades.