• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• International Journal of Industrial Entomology and Biomaterials
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• v.3 no.2
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• pp.117-120
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• 2001

In India, mulberry (Morus spp.), the sole food plant of the silkworm, Bombyx mori (Linn.), is prone to infestation by the pink mealybug, Maconellicoccus hirsutus (Green). Infestation by this pest causes apical shoot malformation, popularly known as 'tukra'. Occurrence of tukra causes an appreciable reduction in leaf yield and quality, leading to low silkworm cocoon productivity. For management of M. hirsutus (Tukra), an IPM package comprising mechanical, chemical and biological measures was demonstrated in the mulberry gardens of five Government Silk Farms in Mysore District (Karnataka, India) during 1995-96. A suppression of 76.0% in tukra incidence and 90.19% in mealybug population was recorded by employ the IPM package which led to an estimated 4,000 kg recovery in leaf yield/ha/year. The impact of IPM package in the management of M. hirsutus, the role of biocontrol agent (Cryptolaemus montrouzieri Muls.) in pest suppression and the cost-benefit analysis of the IPM package are discussed.

• Journal of Information Technology Services
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• v.15 no.3
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• pp.71-95
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• 2016

In recent years, text mining has been used to extract meaningful insights from the large volume of unstructured text data sets of various domains. As one of the most representative text mining applications, topic modeling has been widely used to extract main topics in the form of a set of keywords extracted from a large collection of documents. In general, topic modeling is performed according to the weighted frequency of words in a document corpus. However, general topic modeling cannot discover the relation between documents if the documents share only a few terms, although the documents are in fact strongly related from a particular perspective. For instance, a document about "sexual offense" and another document about "silver industry for aged persons" might not be classified into the same topic because they may not share many key terms. However, these two documents can be strongly related from the R&D perspective because some technologies, such as "RF Tag," "CCTV," and "Heart Rate Sensor," are core components of both "sexual offense" and "silver industry." Thus, in this study, we attempted to discover the differences between the results of general topic modeling and R&D perspective topic modeling. Furthermore, we package social issues from the R&D perspective and present a prototype system, which provides a package of news articles for each R&D issue. Finally, we analyze the quality of R&D perspective topic modeling and provide the results of inter- and intra-topic analysis.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.76-81
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• 1998

The purpose of this study is the generation of B-spline surface by the 3D measurement data. The hardware of the system comprises PC and digitizing machine, machining center. There are three steps, (1) physical model measuring on the 3D laser digitizing machine, (2) B-spline surface modeling and Fairing, (3) CNC machining by the NC code. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• The Journal of the Korea Contents Association
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• v.7 no.12
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• pp.1-12
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• 2007

In this study, the use of wrapping cloth was studied by examining documents and drawings from the past that reflect the life of people of the time with a focus on "minbo" (a wrapping cloth used by civilians) and "gungbo" (a wrapping cloth used by the ruling class). Unlike the bag culture of industrialized society, wrapping cloth has diversity, dynamic and receptiveness to changes as well as coexistence of 2 and 3-dimension. Environment-friendliness of recyclability of the cloth used for making wrapping cloth is not found in any other traditional transportation device cultures of the world. Such polysemous elements converge into a various functions with the development of technology and raw material and allow a package design from a new perspective. This study analyzes the above factors from a package design perspective to suggest an innovative modern package design that has fusional, diverse features.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.