• Laser Solutions
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• v.9 no.3
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• pp.1-5
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• 2006

Diffraction grating is the optical device which has periodic pattern. Decorative logotypes is the one of application of diffraction grating. In this paper diffraction grating for decorative logotype is fabricated by dot pattern in stead of line pattern. A metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps Nd:YVO4 laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate dot patterns. In order to minimize the dot diameter, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.307-307
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• 2012

현재 태양전지 시장은 결정질 태양전지가 주류를 차지하고 있으며 이중 상대적으로 재료비가 저렴한 다결정 실리콘 기반의 고효율 태양전지 제작에 대한 연구가 활발히 진행되고 있다. 이에 본 실험에서는 표면 텍스처링 방법에 따른 태양전지 소자의 특성 변화에 대한 실험을 진행하였다. 일반적으로 다결정 태양전지의 경우 산성용액을 이용한 표면 텍스처링을 실시하는데 이 경우 표면에 형성된 텍스처 구조는 산성용액의 등방성 식각으로 인해 반구(Hemisphere) 형태의 구조를 띄게 된다. 이는 표면에서의 광흡수율을 떨어뜨려 태양전지 소자의 효율을 저해하는 원인이 된다. 따라서 본 연구에서는 다결정 실리콘 태양전지의 효율 향상을 위해 레이저를 이용한 차세대 텍스처링 방법에 대한 연구를 진행하였다. 우선 355 nm 파장의 Ultra-Violet (UV) 레이저를 소자 표면에 조사함으로써 $10{\mu}m$의 dot diameter와 depth를 갖는 honey comb 배열의 hole을 형성하였다. 이후 산성용액에 담가 레이저 공정 후의 slag를 제거해 최종적으로 피라미드 형태의 구조를 형성하였다. Suns_Voc 효율 측정 결과 산성용액을 이용한 텍스처링의 경우 개방 전압이 611 mV, 곡선인자가 81%, 효율이 17.32%로 각각 측정되었다. 반면, 레이저 텍스처링의 경우에서는 개방전압이 631 mV, 곡선인자가 83%, 효율이 18.33%로 용액 텍스처링 방법보다 우수한 특성을 보였다. 이는 UV 레이저 텍스처링을 통해 형성된 피라미드 형태의 표면 구조에서의 광흡수율이 산성용액을 이용한 방법보다 우수함을 말하며, 따라서 태양전지의 주요 파라미터가 향상된 결과를 보였다. 본 실험에서는 레이저 텍스처링을 통한 태양전지 제작에 대한 방법을 제시하며, 향후 고효율의 다결정 태양전지 제작에 있어 기여 할 것으로 판단된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.1
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• pp.46-52
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• 2003

In this paper, we fabricated PRT(platinum resistance thermometers) with the trimming technology using high fine laser system. U. V.(wavelength： 355nm) laser was mainly used for adjusting Pt thin films resistors to 100Ω at 0$^{\circ}C$. Internationally, the accepted A-class tolerance of temperature sensor is ${\pm}$0.06Ω at 0$^{\circ}C$. according to DIN EN 60751. The width of trimmed lines was about 10$\mu\textrm{m}$ and the best trimming conditions of Pt thin films were power : 37mW, frequency : 200Hz and bite size：1.5$\mu\textrm{m}$. And 96 resistors, fabricated by photolithography and etching process, have 79∼90Ω and 91∼102Ω as the proportion of 45.7% and 57.3%, respectively. As result of sitting Pt thin films resistors to the target value(109.73Ω at 25$^{\circ}C$), 82.3% of all resistors had the tolerance within ${\pm}$0.03Ω and the others(17.7％) were within ${\pm}$0.06Ω of A-class tolerance. The PRTs which wore fabricated in this research had excellent characteristics as follows； high accuracy, international standard TCR(temperature coefficient of resistance) value, long-term stability, wide temperature range, good linearity and repeatability, rapid response time, etc.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.114-117
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• 2006

Diffraction grating is the optical device which has periodic pattern. Decorative logotypes is the one of application of diffraction grating. In this paper diffraction grating for decorative logotype is fabricated by dot pattern in stead of line pattern. A metallic mold for diffraction gratings is fabricated with a mode-locked 12 ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate dot patterns. In order to minimize the dot diameter, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• Bulletin of the Korean Chemical Society
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• v.34 no.1
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• pp.207-210
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• 2013

We report the construction of a MALDI imaging mass spectrometer equipped with a specially designed laser focusing lens, a compact aspherical singlet lens, that obtains a high-lateral imaging resolution in the microprobe mode. The lens is specially designed to focus the ionization laser (${\lambda}$ = 355 nm) down to a $1{\mu}m$ diameter with a long working distance of 34.5 mm. With the lens being perpendicular to the sample surface and sharing the optical axis with the ion path, the imaging mass spectrometer achieved an imaging resolution of as good as $5{\mu}m$ along with a high detection sensitivity of 100 fmol for peptides. The mass resolution was about 900 (m/${\Delta}m$) in the linear TOF mode. The high-resolution capability of this instrument will provide a new research opportunity for label-free imaging studies of various samples including tissues and biochips, even for the study at a single cell level in the future.

• Journal of Information Display
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• v.12 no.2
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• pp.93-96
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• 2011

Single-phased $CaZrO_3:Dy^{3+}$, $Tm^{3+}$ series have been successfully synthesized by solid-state reaction, and their luminescence properties were investigated. Under 355 nm excitation, $CaZrO_3:Dy^{3+}$ series showed characteristic emission of $Dy^{3+}$, which exhibited yellowish white color. By introducing $Tm^{3+}$ into the matrix, the emitted hue of the $Dy^{3+}$-doped sample could be easily tailored to white, and simultaneously, energy transfer from $Tm^{3+}$ to $Dy^{3+}$ was observed. The color coordinates of the optimum white-emitting sample were (0.321, 0.323), which were very close to the data of the National Television Standard Committee (0.33, 0.33). The co-activated phosphors presented good match to ultraviolet light-emitting diodes (LEDs), which revealed that they could be novel promising phosphors utilized in white LED application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.355-358
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• 2000

Magnetoresistance changes of NiFe thin films were investigated as a function of deposition temperature. DC magnetron sputtering was employed to fabricate Ta/NiFe(t)/Ta thin films on Si(001) substrates with in-situ field or with no-field. The thickness(t) of NiFe films was a range of 4 to 15nm. Substrate temperature was a range of 30 to 400$^{\circ}C$. MR measurement was carried out as a function of angle $\theta$, between external field and current direction. MR ratio increased with increasing substrate temperature, also, max. MR ratio was observed in samples deposited at 300$^{\circ}C$. With increasing upto 400$^{\circ}C$, MR ratio was rapidly decreased in the case of thinner NiFe films. In non-field deposited NiFe films, both angle $\theta$=0, 90。, there was no significant change in MR curves. However, MR curves of in-situ field deposited NiFe films were different in both angles $\theta$=0 and 90。

• Proceedings of the KIEE Conference
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• 2007.11a
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• pp.88-89
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• 2007

ZnO thin films were deposited on $Al_2O_3$ (alumina) substrates by pulsed laser deposition (PLD) using Nd:YAG laser with a wavelength of 355nm, at room temperature and oxygen partial pressure of 1, 10, 30, 50, 100, and 200m Torr. Furthermore, deposited ZnO thin films were post-annealed at 400, 550, $600^{\circ}C$. The effects of oxygen partial pressure and post-annealing temperature on structural properties of the deposited films have been investigated by means of X-ray diffraction (XRD), and atomic force microscope (AFM), respectively. It has been found that ZnO thin films exhibit c-axis orientation, exhibiting an increased foil width at half maximum (FWHM) value of (002) diffraction peak at 30m Torr oxygen partial pressure and higher post-annealing temperature ($700^{\circ}C$).