Surface Roughness of the Electroplated Sn with Variations of Electrodeposition Parameters and Contact Resistance of the Flip-chip-bonded Sn Bumps (Electrodeposition 변수에 따른 Sn 도금의 표면 거칠기와 플립칩 접속된 Sn 범프의 접속저항)
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- Journal of the Microelectronics and Packaging Society
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- v.13 no.4
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- pp.37-43
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- 2006