• International journal of advanced smart convergence
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• v.8 no.3
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• pp.39-45
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• 2019

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.1
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• pp.54-59
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• 2004

We suggest a 3D vision inspection algorithm which is based on the external shape feature. Because many electronic parts have the regular shape, if we have the database of pattern and can recognize the object using the database of the object s pattern, we can inspect many types of electronic parts. Our proposed algorithm uses the geometrical pattern matching method and 3D database on the electronic parts. We applied our suggested algorithm fer inspecting several objects including typical IC and capacitor. Through the experiments, we could find that our suggested algorithm is more effective and more robust to the inspection environment(rotation angle, light source, etc.) than conventional 2D inspection methods. We also compared our suggested algorithm with the feature space trajectory method.

• Proceedings of the IEEK Conference
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• 2003.07c
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• pp.2533-2536
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• 2003

In this paper, we suggest the 3D Vision Inspection Algorithm which is based on the external shape feature, and is able to recognize the object. Because many objects made by human have the regular shape, if we posses the database of pattern and we recognize the object using the database of the object's pattern, we could inspect the objects of many fields. Thus, this paper suggest the 3D Vision inspection Algorithm using the Geometrical Pattern Matching by making the 3D database.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.1
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• pp.59-65
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• 2016

As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under ${\pm}20um$ in standard deviation, which is suitable for most 3-D shape measurements of BGAs.

• Journal of Institute of Control, Robotics and Systems
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• v.17 no.11
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• pp.1159-1167
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• 2011

A novel 3D tube scanning technique is proposed. The proposed tube scanning technique is developed for a special tube inspection module which consists of four line-lasers and one camera. Using the scanning module, we can reconstruct the 360 degree shapes of the inner surfaces of a cylindrical tube. From an image frame captured by the camera, we reconstruct a partial tube model based on four laser triangulations. Then by aligning such partial models with respect to a reference tube axis, a complete 3D shape of the tube is reconstructed. The tube axis in each reconstructed frame is aligned with a 3D Euclidean transformation to the reference axis. Several experiments show that the proposed method can align multiple tube axes very accurately and reconstruct 3D shapes of a tube with very low shape distortion.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.41 no.1
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• pp.19-26
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• 2004

In this paper, we suggest a 3D vision inspection method which use only one camera. If we have the database of pattern and can recognize the object, and also estimate the rotated shape of the parts, we can inspect the parts using only one image. We used the 3D database and the 2D geometrical pattern matching, and the rotation transition theory about the algorithm. As the results, we could have the capability of the recognition and inspection of the rotated object through the estimation of rotation an81e. We applied our suggested algorithm to the inspection of typical IC and capacitor, and compared our suggested algorithm with the conventional 2D inspection method and the feature space trajectory method.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.8
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• pp.2043-2050
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• 2014

As most the scanning systems developed until now provide radiation scan plane images of the inspected objects, there has been a limitation in judging exactly the shape of the objects inside a logistics container exactly with only 2-D radiation image information. As a radiation image is just the density information of the scanned object, the direct application of general stereo image processing techniques is inefficient. So we propose that a new volume-based 3-D reconstruction algorithm. Experimental results show the proposed new volume based reconstruction technique can provide more efficient visualization for X-ray inspection. For validation of the proposed shape reconstruction algorithm using volume, 15 samples were scanned and reconstructed to restore the shape using an X-ray stereo inspection system. Reconstruction results of the objects show a high degree of accuracy compared to the width (2.56%), height (6.15%) and depth (7.12%) of the measured value for a real object respectively. In addition, using a K-Mean clustering algorithm a detection efficiency of 97% is achieved. The results of the reconstructed shape information using the volume based shape reconstruction algorithm provide the depth information of the inspected object with stereo X-ray inspection. Depth information used as an identifier for an automated search is possible and additional studies will proceed to retrieve an X-ray inspection system that can greatly improve the efficiency of an inspection.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.55-59
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• 2017

An optical method to inspect the 3-D shape of surface of Micro BGA is proposed, where spatially arranged LED light sources and specular reflection are considered. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics for all BGA's contained in a captured image are used together to find out the criteria for the detection of existing defects, and the usefulness of the proposed method is shown via experiments.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.19-23
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• 2021

A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.