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http://dx.doi.org/10.6117/kmeps.2021.28.4.019

Statistical Approach to 3-Dimensional Shape Inspection of Micro Solder Balls  

Kim, Jee Hong (Department of Display Engineering, Pukyong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.28, no.4, 2021 , pp. 19-23 More about this Journal
Abstract
A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED's in the image. Also, the statistics of displacements for the solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.
Keywords
Micro Solder Ball; 3-D Shape Inspection; Vision;
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