1 |
C. Perabo, "How is a high quality solder sphere made? : Solder Ball Diameter & Spheroid Tolerance", CAPLINQ blog. https://www.caplinq.com/blog/solder-sphere-diameter-and-spheroid-tolerance_830/ (2014).
|
2 |
Z. Feng, J. C. Gonzalez, S. Tang, M. Kurwa and E. Krastev, "Non-destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX, and Cross-section/SEM Comparison", Proc. SMTA International Conference, Orlando, USA (2008).
|
3 |
G. Fontana, S. Ruggeri, I. Fassi, G. Legnani, "Strategies for micro-handling of solder balls for the automated reballing of BGA packages", 4M/IWMF 4th congress on Micro and Nano Manufacturing No.731 (2016).
|
4 |
L. Bai, X. Yang, H. Gao, "A Novel Coarse-Fine Method for Ball Grid Array Component Positioning and Defect Inspection" Transactions On Industrial Electronics, Vol. 65, No. 6 (2018).
|
5 |
박영순, 김준식, "A Study on the Vision Inspection System for the Defects Detection of Micro-BGA Device", J. Korean Precision Engineering, 24, pp.44 (2007).
|
6 |
X. Zhou, J. Zhou, G. Tian and Y. Wang, "Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography", Sensors, 15 (2015).
|
7 |
허경무, "정확도를 향상시킨 BGA 솔더볼 외관검사 기법 개발" 전자공학회 논문지 제47권 SC편 제6호 (2010).
|
8 |
Z. Zhang, S. Huang, N. Gao1, F. Gao, X. Jiang, "Full-Field 3D Shape Measurement of Specular Object Having Discontinuous Surfaces", Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104490T (2017).
|
9 |
김민영, "마이크로 BGA 패키지의 볼 형상 시각검사를 위한 모아레 간섭계 기반 3차원 머신 비젼 시스템", 마이크로전자및패키징학회지, v.19, no.1, pp.81 (2012).
DOI
|
10 |
K. W. Ko, H. S. Cho, "Solder Joint Inspection Using a Neural Network and Fuzzy Rule-Based Classification Method", IEEE Tr. Electronic Packaging Manufacturing, 23, pp.93 (2000).
DOI
|
11 |
김지홍, "LED 반사영상을 이용한 마이크로 BGA 3차원형상 검사", J. Microelectron. Packag. Soc., 24(2), 1-5 (2017).
DOI
|
12 |
S. F. Chen,"An Optical Inspection System for the Solder Balls of BGA using Support Vector Machine Classification", Proceedings of the Sixth International Conference on Machine Learning and Cybernetics, IEEE, (19-22). Hong Kong (2007).
|
13 |
J. H. Kim, C. D. Nguyen, "Shape Recognition of a BGA Ball using Ring Illumination", Journal of Institute of Control, Robotics and Systems, 19, 960-967 (2013).
|
14 |
M. Klammer and D. Durhammer, "Measuring 17,360 solder balls per second" Imaging & Machine Vision Europe 11 (2020).
|
15 |
Y. C. Lin, K. Wang, "Position Determination of A Ball Grid Array by Automated Optical Inspection Method", Proceedings of the 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (pp. 97-101), Hawaii (2014).
|
16 |
"Solder Ball Issues of BGA Components and How to Avoid Them", PCBCART Article https://www.pcbcart.com/article/content/solder-ball-issues-of-bga-components.html (2005).
|