• Title/Summary/Keyword: 2-step sputtering

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Properties of AZO Thin Film deposited on the PES Substrate (PES 기판상에 증착된 AZO 박막의 특성)

  • Kim, Sang-Mo;Kim, Kyung-Hwan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.12
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    • pp.1072-1076
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    • 2007
  • We prepared the Al doped ZnO (AZO) thin film on polyethersulfon (PES) without any substrate heating by Facing Targets Sputtering (FTS) system. FTS system has two different facing targets. One is ZnO doped the content of Al 2 wt% and the other is Zn in order to decrease resistivity. The electrical, structural and optical properties of AZO thin films were investigated. To evaluate the as-deposited thin film properties, we employed four-point probe (CMT-R100nw, Changmin), Surface profiler (Alpha-step, Tencor), UV/VIS spectrometer (HP), X-ray diffractometer (XRD, Rigaku) and Field Emission Scanning Electron Microscopy (FESEM, Hitachi S-4700). As a result, We obtained that AZO thin film deposited on PES substrate at a DC Power of 150 W, working pressure of 1 mTorr and $O_2$ gas flow ratio of 0.2 exhibited the resistivity of $4.2{\times}10^{-4}\;[{\Omega}cm]$ and the optical transmittance of about 85 % in the visible range.

Water vapor permeation properties of $Al_2O_3/TiO_2$ passivation layer on a poly (ether sulfon) substrate

  • Gwon, Tae-Seok;Mun, Yeon-Geon;Kim, Ung-Seon;Mun, Dae-Yong;Kim, Gyeong-Taek;Han, Dong-Seok;Sin, Sae-Yeong;Park, Jong-Wan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.160-160
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    • 2010
  • Organic electronic devices require a passivation layer to ensure sufficient lifetime. Specifically, flexible organic electronic devices need a barrier layer that transmits less than $10^{-6}\;g/m^2/day$ of water and $10^{-5}\;g/m^2/day$ of oxygen. To increase the lifetime of organic electronic device, therefore, it is indispensable to protect the organic materials from water and oxygen. Severe groups have reported on multi-layerd barriers consisting inorganic thin films deposited by plasma enhenced chemical deposition (PECVD) or sputtering. However, it is difficult to control the formation of granular-type morphology and microscopic pinholes in PECVD and sputtering. On the contrary, atomic layer deoposition (ALD) is free of pinhole, highly uniform, conformal films and show good step coverage. In this study, the passivation layer was deposited using single-process PEALD. The passivation layer, in our case, was a bilayer system consisting of $Al_2O_3$ films and a $TiO_2$ buffer layer on a poly (ether sulfon) (PES) substrate. Because the deposition temperature and plasma power have a significant effect on the properties of the passivation layer, the characteristics of the $Al_2O_3$ films were investigated in terms of density under different deposition temperatures and plasma powers. The effect of the $TiO_2$ buffer layer also was also addressed. In addition, the water vapor transmission rate (WVTR) and organic light-emitting diode (OLEDs) lifetime were measured after forming a bilayer composed of $Al_2O_3/TiO_2$ on a PES substrate.

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Growth mechanism of three dimensionally structured TiO2 thin film for gas sensors (가스 감응용 3차원 구조체 TiO2 박막 성장기구)

  • Moon, Hi-Gyu;Yoon, Seok-Jin;Park, Hyung-Ho;Kim, Jin-Sang
    • Journal of Sensor Science and Technology
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    • v.18 no.2
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    • pp.110-115
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    • 2009
  • Polystyrene (PS) microspheres were used to good advantage as a template material to prepare macroporous $TiO_2$ thin films. This is enabled to run the thermal decomposition of the PS without the collapsing of the 3-D macroporous framework during the calcination step. $TiO_2$ thin films were deposited onto the colloidal templated substrates at room temperature by RF sputtering, and then samples were thermally treated at $450^{\circ}C$ for 40.min in air to remove the organic colloidal template and induce crystallization of the $TiO_2$ film. The macroporous $TiO_2$ thin film exhibited a quasi-ordered partially hexagonal close-packed structure. Burst holes, estimated to be formed during PS thermal decomposition, are seen as the hemisphere walls. the inner as well as the outer surfaces of the hollow hemispheres formed by the method of thermal decomposition can be easily accessed by the diffusing gas species. As a consequence, the active surface area interacting with the gas species is expected to be enlarged about by a factor of fourth as large as compared to that of a planar films. Also the thickness at neighboring hemisphere could be controlled a few nm thickness. If the acceptor density becomes as large that depletion width reaches those thickness, the device is in the pinch off-situation and a strong resistance change should be observed.

플렉시블 기판에 제작한 GAZO 박막의 특성

  • Choe, Myeong-Gyu
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.220-220
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    • 2010
  • 대향타겟식 스퍼터링 (Facing Target Sputtering, FTS) 장치를 이용하여 박막태양전지에 응용가능한 GAZO 박막을 플렉시블 기판 (PES) 위에 증착하였다 박막을 증착하는 데 쓰인 각각의 타겟은 AZO(ZnO:$Al_2O_3$=98:2w.t%) : GZO(ZnO:$Ga_2O_3$=97:3w.t%)이였으며, 다양한 스퍼터링 조건(공정압력, 입력 전력 및 박막의 두께)에서 증착 하였다. GAZO 박막의 전기적 특성은 Hall effect measurement, Four Point Probe, 광학적 특성은 UV-VIS spectrometer, 구조적 특성은 XRD, AFM, FE-SEM, 막의 두께는 $\alpha$-step profiler 장비를 이용하여 분석하였다. 가장 낮은 비저항은 작업 압력 1mTorr일 때 $5.123{\times}10^{-4}[\Omega-cm]$를 보였다. 또한 제작된 모든 박막은 (002)회절 피크로 우선성장함을 알 수 있었으며, 가시광선 영역(300nm-800nm)에서 80% 이상의 광 투과율을 나타냄을 알 수 있었다.

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Behavior of Implanted Dopants and Formation of Molybdenum Siliclde by Composite Sputtering (Composite target으로 증착된 Mo-silicide의 형성 및 불순물의 거동)

  • Cho, Hyun-Choon;Paek, Su-Hyon;Choi, Jin-Seog;Hwang, Yu-Sang;Kim, Ho-Suk;Kim, Dong-Won;Shim, Tae-Earn;Jung, Jae-Kyoung;Lee, Jong-Gil
    • Korean Journal of Materials Research
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    • v.2 no.5
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    • pp.375-382
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    • 1992
  • Molybdenum silicide films have been prepared by sputtering from a single composite MoS$i_2$ source on both P, B$F_2$respectively implanted (5${\times}10^{15}ions/cm^2$ single crystal and P implanted (5${\times}10^{15}ions/cm^2$) polycrystalline silicon substrates followed by rapid thermal annealing in the ambient of argon. The heat treatment temperatures have been varied in the range of 600-l20$0^{\circ}C$ for 20 seconds. The properties of Mo-silicide and the diffusion behaviors of dopant after the heat treatment are investigated using X-ray diffraction, scanning electron microscopy(SEM) , secondary ions mass spectrometry(SIMS), four-point probe and $\alpha-step.$ Annealing at 80$0^{\circ}C$ or higher resulted in conversion of the amorphous phase into predominantly MoS$i_2$and a lower sheet resistance. There was no significant out-diffusion of dopants from both single crystal and polycrystalline silicon substrate into molybdenum silicide layers during annealing.

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Characteristics of Cu-Doped Ge8Sb2Te11 Thin Films for PRAM (PRAM용 Cu-도핑된 Ge8Sb2Te11 박막의 특성)

  • Kim, Yeong-Mi;Kong, Heon;Kim, Byung-Cheul;Lee, Hyun-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.5
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    • pp.376-381
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    • 2019
  • In this work, we evaluated the structural, electrical and optical properties of $Ge_8Sb_2Te_{11}$ and Cu-doped $Ge_8Sb_2Te_{11}$ thin films prepared by rf-magnetron reactive sputtering. The 200-nm-thick deposited films were annealed in a range of $100{\sim}400^{\circ}C$ using a furnace in an $N_2$ atmosphere. The amorphous-to-crystalline phase changes of the thin films were investigated by X-ray diffraction (XRD), UV-Vis-IR spectrophotometry, a 4-point probe, and a source meter. A one-step phase transformation from amorphous to face-centered-cubic (fcc) and an increase of the crystallization temperature ($T_c$) was observed in the Cu-doped film, which indicates an enhanced thermal stability in the amorphous state. The difference in the optical energy band gap ($E_{op}$) between the amorphous and crystalline phases was relatively large, approximately 0.38~0.41 eV, which is beneficial for reducing the noise in the memory devices. The sheet resistance($R_s$) of the amorphous phase in the Cu-doped film was about 1.5 orders larger than that in undoped film. A large $R_s$ in the amorphous phase will reduce the programming current in the memory device. An increase of threshold voltage ($V_{th}$) was seen in the Cu-doped film, which implied a high thermal efficiency. This suggests that the Cu-doped $Ge_8Sb_2Te_{11}$ thin film is a good candidate for PRAM.

Structure and Photoluminescence Properties of SnO2/Zn Core-shell Nanowires

  • Kim, Hyoun Woo;Na, Han Gil;Kwon, Yong Jung;Cho, Hong Yeon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.241-241
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    • 2014
  • $SnO_2-core/Zn-shell$ heteronanowires were fabricated by a two-step process: thermal evaporation of Sn powders and employing a sputtering technique with a Zn target. X-ray diffraction, high-resolution transmission electron microscopy, and EDX spectra coincidentally indicated that the shell layer comprised the Zn phase. From Gaussian deconvolution studies, we observed that photoluminescence (PL) spectra consisted of yellow, green, and ultraviolet (UV) emission bands, regardless of shell-coating. We speculated the possible mechanisms of these emission peaks.

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A Study on Fabrication of ZnO Surface Acoustic Wave Filter for Communication Devices (통신기기용 ZnO 탄성표면파 필터의 제작에 관한 연구)

  • Lee, Dong-Yoon
    • Proceedings of the KIEE Conference
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    • 2007.10a
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    • pp.393-394
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    • 2007
  • In this study, to minimize the above effect Zinc Oxide(ZnO) thin films on Si(100) substrate were deposited by RF magnetron sputter with changing sputtering conditions such as Ar/$O_2$ gas ratios, RF power, substrate temperature, chamber prsssure and target-substrate distance. To analyze a crystallographic properties of the films, ${\Theta}/2{\Theta}$ mode X-ray diffraction, rocking curve and Alpha-step were performed. SAW filters were fabricated to evaluate the feasibility of ZnO thin film as a piezoelectrical materials and the processes of ZnO SAW filters using etch and lift-off were compared.

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Characteristic of Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate (Cu 금속과 Si 기판 사이에서 확산방지막으로 사용하기 위한 Zr(Si)N 박막의 특성)

  • 김좌연;조병철;채상훈;김헌창;박경순
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.6
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    • pp.283-287
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    • 2002
  • We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.

Characterization of Al-Doped ZnO Thin Film Grown on Buffer Layer with RF Magnetron Sputtering Method (버퍼 층을 이용한 RF 마그네트론 스퍼터 방법에 의한 Al:ZnO 박막의 성장)

  • No, Young-Soo;Park, Dong-Hee;Kim, Tae-Whan;Choi, Ji-Won;Choi, Won-Kook
    • Journal of the Korean Vacuum Society
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    • v.18 no.3
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    • pp.213-220
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    • 2009
  • The optimal condition of low temperature deposition of transparent conductive Al-doped zinc oxide (AZO) films is studied by RF magnetron sputtering method. To achieve enhanced-electrical property and good crystallites quality, we tried to deposit on glass using a two-step growth process. This process was to deposit AZO buffer layer with optimal growth condition on glass in-situ state. The AZO film grown at rf 120 W on buffer layer prepared at RF $50{\sim}60\;W$ shows the electrical resistivity $3.9{\times}10^{-4}{\Omega}cm$, Carrier concentration $1.22{\times}10^{21}/cm^3$, and mobility $9.9\;cm^2/Vs$ in these results, The crystallinity of AZO film on buffer layer was similar to that of AZO film on glass with no buffer later but the electrical properties of the AZO film were 30% improved than that of the AZO film with no buffer layer. Therefore, the cause of enhanced electrical properties was explained to be dependent on degree of crystallization and on buffer layer's compressive stress by variation of $Ar^+$ ion impinging energy.