• 제목/요약/키워드: 2-step deposition

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Enhancement in electrical and optical properties of ITO thin films grown by 2-step process at room temperature (2-step 공정법에 의해 상온 증착된 ITO박막의 전기 광학적 특성 향상)

  • Kim, Jong-Hoon;Ahn, Byung-Du;Jeon, Kyung-Ah;Kang, Hong-Seong;Lee, Sang-Yeol
    • Proceedings of the KIEE Conference
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    • 2005.11a
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    • pp.6-8
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    • 2005
  • The optical and electrical properties of indium tin oxide (ITO) thin films deposited at room temperature can be substantially enhanced by adopting a two-step process. In the first step, the films (50 nm thick) were grown by pulsed laser deposition (PLD) on glass substrate at room temperature and quickly annealed at $400^{\circ}C$ in nitrogen ambient for 1 minute by using rapid thermal annealing method. The process was completed by additional deposition (150 nm thick) on annealed film at room temperature. High quality ITO films grown by two-step process at room temperature could be obtained with the resistivity of $3.02{\times}10^{-4}{\Omega}cm$, the carrier mobility of 32.07 $cm^2/Vs$, and the transparency above 90 % in visible region mainly due to the enhancement of the film crystallinity and the increase of grain size.

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전해도금을 위한 ALD Cu seed와 PVD Cu seed의 특성 비교

  • Kim, Jae-Gyeong;Park, Gwang-Min;Han, Byeol;Lee, Won-Jun;Jo, Seong-Gi;Kim, Jae-Jeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.231-231
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    • 2010
  • 현재 Cu배선 제조공정에서 전해도금은 Damascene pattern의 Cu filling에 사용되고 있는데, 우수한 특성의 전해도금을 위해서는 step coverage가 우수한 Cu seed layer가 필수적이다. 현재까지 Cu seed layer를 형성하는 방법으로는 ionized physical vapor deposition(I-PVD)이 사용되고 있는데, 22 nm 이후의 소자에서는 step coverage의 한계로 인해 완벽한 Cu filling 어려울 것으로 예상된다. 본 연구에서는 step coverage가 매우 우수한 atomic layer deposition(ALD) 방법으로 Cu seed layer를 증착하고 그 특성을 기존의 PVD 박막과 비교하였다. Ketoiminate 계열의 +2가 Cu 전구체와 $H_2$를 이용하여 ALD Cu 박막을 증착하였는데 exposure, 기판의 온도를 변화시키면서 기판별로 ALD Cu의 최적공정조건을 도출하였다. ALD Cu seed와 PVD Cu seed 위에 약 $1{\mu}m$의 Cu 박막을 전해도금한 후 박막의 두께, 비저항, 미세구조와 함께 pattern filling 특성을 비교하였다.

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A Kinetic Study on the Growth of Nanocrystalline Diamond Particles to Thin Film on Silicon Substrate

  • Jung, Doo-Young;Kang, Chan-Hyoung
    • Journal of the Korean institute of surface engineering
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    • v.44 no.4
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    • pp.131-136
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    • 2011
  • A kinetic study has been made for the growth of nanocrystalline diamond (NCD) particles to a continuous thin film on silicon substrate in a microwave plasma chemical vapor deposition reactor. Parameters of deposition have been microwave power of 1.2 kW, the chamber pressure of 110 Torr, and the Ar/$CH_4$ ratio of 200/2 sccm. The deposition has been carried out at temperatures in the range of $400\sim700^{\circ}C$ for the times of 0.5~16 h. It has been revealed that a continuous diamond film evolves from the growth and coalescence of diamond crystallites (or particles), which have been heterogeneously nucleated at the previously scratched sites. The diamond particles grow following an $h^2$ = k't relationship, where h is the height of particles, k' is the particle growth rate constant, and t is the deposition time. The k' values at the different deposition temperatures satisfy an Arrhenius equation with the apparent activation energy of 4.37 kcal/mol or 0.19 eV/ atom. The rate limiting step should be the diffusion of carbon species over the Si substrate surface. The growth of diamond film thickness (H) shows an H = kt relationship with deposition time, t. The film growth rate constant, k, values at the different deposition temperatures show another Arrhenius-type expression with the apparent activation energy of 3.89 kcal/mol or 0.17 eV/atom. In this case, the rate limiting step might be the incorporation reaction of carbon species from the plasma on the film surface.

A study on $CeO_2$ buffer layer on biaxially textured Ni-3%W substrate deposited by electron beam evaporation with high deposition rate (전자빔 증착법으로 이축배향된 Ni-3%W 기판 위에 높은 증착률로 제조된 $CeO_2$ 완충층에 대한 연구)

  • Kim, H.J.;Lee, J.B.;Kim, B.J.;Hong, S.K.;Lee, H.J.;Kwon, B.G.;Lee, H.G.;Hong, G.W.
    • Progress in Superconductivity and Cryogenics
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    • v.13 no.1
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    • pp.1-5
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    • 2011
  • [ $CeO_2$ ]has been widely used for single buffer layer of coated conductor because of superior chemical and structural compatibility with $ReBa_2Cu_3O_{7-{\delta}}$(Re=Y, Nd, Sm, Gd, Dy, Ho, etc.). But, the surface of $CeO_2$ layer showed cracks because of the large difference in thermal expansion coefficient between metal substrate and deposited $CeO_2$ layer, when thickness of $CeO_2$ layer exceeds 100 nm on the biaxially textured Ni-3%W substrate. The deposition rate has been limited to be less than 6 $\AA$/sec in order to get a good epitaxy. In this research, we deposited $CeO_2$ single buffer layers on biaxially textured Ni-3%W substrate with 2-step process such as thin nucleation layer(>10 nm) with low deposition rate(3 $\AA$/sec) and thick homo epitaxial layer(>240 nm) with high deposition rate(30 $\AA$/sec). Effect of deposition temperature on degree of texture development was tested. Thick homo epitaxial $CeO_2$ layer with good texture without crack was obtained at $600^{\circ}C$, which has ${\Delta}{\phi}$ value of $6.2^{\circ}$, ${\Delta}{\omega}$ value of $4.3^{\circ}$ and average surface roughness(Ra) of 7.2 nm within $10{\mu}m{\times}10{\mu}m$ area. This result shows the possibility of preparing advanced Ni substrate with simplified architecture of single $CeO_2$ layer for low cost coated conductor.

Studies on the Properties of the Plasma TEOS $SiO_2$ Film (PECVD TEOS $SiO_2$막의 특성에 관한 연구)

  • 이수천;이종무
    • Journal of the Korean Ceramic Society
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    • v.31 no.2
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    • pp.206-212
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    • 1994
  • Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.

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Development and Application of Anti-Corrosive Steel Using Electro-Deposition of Sea Water (1) -Development of Electro-Deposition System Using Sea Water (해수전착 코팅을 이용한 내부식성 철근의 개발 및 적용성에 대한 연구 (1) -해수전착 코팅 시스템 개발)

  • Kwon, Seung Jun;Lee, Myeong Hoon;Park, Sang Soon
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.16 no.5
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    • pp.78-87
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    • 2012
  • This study is for developing a system for electro-deposition utilizing sea water containing various ions like calcium and magnesium. This is the first step research for the final goal which is a development of anti-corrosive steel for RC structure, so that this paper is mainly focused on the development for electro-deposition system. Optimum conditions for steel coating is obtained through various tests considering anode type, temperature, duration time, and current density. The composition of electro-deposition is analyzed through SEM, EDS, and XRD and it is evaluated to be $CaCO_3$ and $Mg(OH)_2$. Through measuring polarization potential and current density in the coated steel, the coating layer from the developed system is evaluated to have high resistance to steel corrosion. Additional tests and discussions on durability and structural performance in the coated steel from this work will be performed for the second step research.

Fabrication of the in-plane Aligned a-Axis Oriented $YBa_2Cu_3O_{7-x}$ Thin Films (평면배향된 a-축 수직 $YBa_2Cu_3O_{7-x}$ 고온초전도 박막의 제작)

  • 성건용;서정대
    • Journal of the Korean Ceramic Society
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    • v.33 no.3
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    • pp.313-320
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    • 1996
  • We have fabricated an in-plane aligned a-axis oriented YBa2Cu3O7-x (a-YBCO) thin film on a LaSrGaO4(100) substrate with a PrBa2Cu3O7-x(PBCO) template layer by two step plused laser deposition using 308 nm XeCl excimer laser. A YBCO layer and PBCO layer grown at low temperatures were used as template layers. We have investigated the effect of the deposition temperature of template layers on the superconducting and struc-tural properties of in-plane aligned a-YBCO thin films. An optimal deposition temperature of the PBCO template layers was 630. In-plane aligned a-YBCO thin films showed an anisotropy ratio in resistivity of 11.5 and a zero resistance temperature of 88 K.

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Growth and Characteristics of Near-UV LED Structures on Wet-etched Patterned Sapphire Substrate

  • Cheong, Hung-Seob;Hong, Chang-Hee
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.6 no.3
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    • pp.199-205
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    • 2006
  • Patterned sapphire substrates (PSS) were fabricated by a simple wet etching process with $SiO_2$ stripe masks and a mixed solution of $H_2SO_4$ and $H_3PO_4$. GaN layers were epitaxially grown on the PSS under the optimized 2-step growth condition of metalorganic vapor deposition. During the 1st growth step, GaN layers with triangular cross sections were grown on the selected area of the surface of the PSS, and in the 2nd growth step, the GaN layers were laterally grown and coalesced with neighboring GaN layers. The density of threading dislocations on the surface of the coalesced GaN layer was $2{\sim}4\;{\times}\;10^7\;cm^{-2}$ over the entire region. The epitaxial structure of near-UV light emitting diode (LED) was grown over the GaN layers on the PSS. The internal quantum efficiency and the extraction efficiency of the LED structure grown on the PSS were remarkably increased when compared to the conventional LED structure grown on the flat sapphire substrate. The reduction in TD density and the decrease in the number of times of total internal reflections of the light flux are mainly attributed due to high level of scattering on the PSS.

The Physical Properties of Silicon and Silicon-Oxide by Epitaxial Growth (1) (기상성장에 의한 Si단결정과 Si산화막의 특성( 1 ))

  • 성영권;오석주;김석기;이상수
    • 전기의세계
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    • v.22 no.2
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    • pp.11-18
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    • 1973
  • This paper reports some results of Si and SiO$_{2}$ films obtained from the expitaxial growth by hydrogen reduction of SiCI$_{4}$ with a hydrogen and carbon dioxide mixture in an epitaxial-deposition chamber. The deposited Si and SiO$_{2}$ are studied by observing the process parameters affecting the rate of deposition, and the quantitative properties at the interface of Si and SiO$_{2}$ are also considered briefly according to the results of the optical absorption and the voltage-current characteristic of MOS etc. using step etching procedure for oxide films.

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Properties of YBCO Step-edge Junction Fabricated on Different Crystal Orientation of Sapphire Substrate (사파이어 기판의 다른 결정방향 위에 제작된 YBCO step-edge 접합의 특성)

  • H. R. Lim;I-S Kim;Y. K. Park;J. C. Park
    • Progress in Superconductivity
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    • v.3 no.1
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    • pp.60-64
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    • 2001
  • We have studied properties of step-edge Junction prepared with crystal orientation of sapphire substrate. The Step on sapphire substrates fabricated by conventional photolithography method and Ar ion milling method. $CeO_2$ buffer layer and in-situ YBCO thin film were deposited on the stepped sapphire substrates by a pulsed laser deposition method with the predetermined optimized condition. The step angle was centre fled low angle of about $25^{\circ}$. The YBCO film thickness was varied to obtain various thickness ratios of the film to the step height in a range from 0.7 to 1.2. I-V curves of junction were showed RSJ-behavior, double junction structure, and hysteresis due to the crystal orientation of substrate.

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