• Macromolecular Research
• /
• v.11 no.6
• /
• pp.458-466
• /
• 2003

Several copolyimides have been synthesized with different combinations of comonomers in order to study the relationship between conductivity and water insolubility. m-Phenylenediamine (m-PDA), an angled comonomer, was introduced into the polymer backbone to increase water absorption, and resulted in higher proton conductivity. 2,2-bis(trifluoromethyl)benzidine (TFMB) was used as the comonomer to promote water insolubility. There is a good correlation between the water uptake and conductivity of the polyimides. The copolyimides that had high water uptake also generated high proton conductivity. Those polyimides had good mechanical properties. The copolyimides that have 27 mol% of TFMB and 9 mol% of m-PDA have reasonable conductivities and are insoluble in water at 90$^{\circ}C$, even though they have lower conductivities than those of the homopolymer.

• Applied Chemistry for Engineering
• /
• v.23 no.3
• /
• pp.266-270
• /
• 2012

A series of polyimide was prepared by reacting 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) as the anhydride monomer and 2,2'-bis(trifluoromethyl)benzidine (TFB), 2,2'-bis(3-aminophenyl)hexafluoropropane (BAFP), 2,2'-bis(3- amino- 4-methylphenyl) hexafluoropropane (BAMF), bis(3-aminophenyl)sulfone (APS), p-xylyenediamine (p-XDA), or m-xylyenediamine (m-XDA) as the amine monomer in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the poly(amic acid)s (PAAs) solution at various heat treatment temperatures. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) and the mechanical properties were investigated using universal tensile machine (UTM), Their optical transparencies were also investigated using ultraviolet-visible (UV-vis.) spectrophotometry and colorimetry. The yellow index (YI) and coefficient of thermal expansion (CTE) values of all PIs were in the range 0.98~2.76 and 25.73~55.23 $ppm/^{\circ}C$, respectively.

• Polymer(Korea)
• /
• v.34 no.5
• /
• pp.480-484
• /
• 2010

A series of poly(amic acid)s(PAAs) was prepared by reacting 4,4'-(4,4'-isopropylidenediphenoxy) bis(phthalic anhydride)(BPADA) as the anhydride monomer and 2,2'-bis(trifluoromethyl) benzidine (TFB), bis(3-aminophenyl)sulfone (APS), 4,4'-methylenebis-(2-methylcyclohexylamine) (MMCA), or bis[4-(3-aminophenoxy) phenyl] sulfone (BAPS) as the amine monomer with 5 mol% melamine in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the PAAs at various heat treatment temperatures. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA), and their optical transparency were measured by spectrophotometry. The coefficient of thermal expansion (CTE) and yellow index (YI) values of all samples were in the range of $48.53-64.24ppm/^{\circ}C$ and < 3.0, respectively.

• Polymer(Korea)
• /
• v.38 no.5
• /
• pp.632-639
• /
• 2014

2,7-Dihydroxynaphthalene bis(trimellitate anhydride) (2,7-TA) was synthesized from trimellitic anhydride chloride and 2,7-dihydroxynaphthalene. Copolyimides (Co-PI) containing ester group were synthesized from 2,7-TA, pxylylenediamine, and 2,2'-bis(trifluoromethyl)benzidine (TFB). The Co-PI films were obtained from poly(amic acid) by solution casting through thermal imidization on a glass plate. The thermal property, gas permeation, and optical transparency of the Co-PI films with various TFB monomer contents were investigated. These Co-PIs could be solution-cast into a flexible and tough film. The cast Co-PI films exhibited high optical transparency with a cut-off wavelength of 370~395 nm in UV-vis. absorption and a low yellow index value of 3.55~7.63. The thermal property of Co-PI films increased linearly with increasing TFB content. However, the oxygen permeation and optical transparency of the Co-PI films was found to worsen with increasing TFB content.

• Polymer(Korea)
• /
• v.39 no.2
• /
• pp.275-280
• /
• 2015

Two series of copolyimides (Co-PIs) were prepared by reacting 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 1,2,4,5-benzentetra carboxylic dianhydride (pyromellitic dianhydride) (PMDA), as dianhydrides based on 4,4'-biphthalic anhydride (BPA) and 2,2'-bis(trifluoromethyl)benzidine (TFB) by using thermal- and chemical imidizations. Co-PIs films with different dianhydride monomer compositions were compared in terms of their thermal properties and optical transparencies. The addition of PMDA was more effective than the addition of 6FDA for improving the thermal properties. Meanwhile, 6FDA is more effective in optical transparencies.

• Polymer(Korea)
• /
• v.38 no.4
• /
• pp.510-517
• /
• 2014

A series of polyimide (PI) was prepared by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) as the anhydride and bis(3-aminophenyl) sulfone (APS), bis[4-(3-aminophenoxy)-phenyl] sulfone (BAPS), 2,2-bis(4-aminophenyl)-hexafluoropropane (6FPD), 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane (6FBAPP), 2,2'-bis(trifluoromethyl)benzidine (TFDB), or 1,4-phenylenediamine (PDA) as the diamine. Residual stress behaviors were detected in-situ during thermal imidization of the polyimide precursors using a thin film stress analyzer (TFSA), and interpreted with respect to their morphology. According to the molecular orientation and packing order, the residual stress varied from 23.1 to 12.5 MPa, decreased with increasing chain rigidity. The thermal properties of the PI films were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA). Their optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis), and spectrophotometry. The properties of PI films were found to be strongly dependent upon the morphological structure. However, trade-offs between residual stress and optical properties were identified.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.633-636
• /
• 2008

A series novel films of polyimide (PI) and co-polyimide (Co-PI) containing fluorine with colorless, flexible properties was prepared by a two-step process from various commercial aromatic monomers such as 4,4'-(Hexafluoro iso propylidene) diphthalic anhydride (6FDA), 2,2'-Bis(Trifluoromethyl) benzidine (TFDB), 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (AH6FP) and Bis(4-(3-aminophenoxy)phenyl)sulfone (BAS). Furthermore, these obtained transparent and flexible Co-PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) around of $500^{\circ}C$ and the glass transition temperature ($T_g$) in the range of $275-350^{\circ}C$.

• Macromolecular Research
• /
• v.12 no.6
• /
• pp.545-552
• /
• 2004

The long-term stability of sulfonic acid-containing polyimides has been investigated. The hydrolytic degradation of homopolyimide and the block copolyimide comprising $27\;mol\%$ of 2,2'-bis(trifluoromethyl)benzidine and $9\;mol\%$ of m-phenylenediamine (BTFMB27mPl0[7/(3+1)]), was quantified through viscosity measurements and FT-IR spectroscopic analyses. The viscosity decrease with respect to time and the degradation rate were similar. The degrees of degradation with respect to time under ambient conditions and at elevated temperature in water were monitored by FT-IR spectroscopy. A new absorption peak was observed at $1786\;cm^{-1},$ which we corresponds to the presence of anhydride end groups formed by hydrolytic scission of the imide rings.

• Polymer(Korea)
• /
• v.38 no.6
• /
• pp.752-759
• /
• 2014

Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.