• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2000.04a
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• pp.181-188
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• 2000

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.93-93
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• 2005

• Transactions of the KSME C: Technology and Education
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• v.4 no.1
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• pp.19-26
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• 2016

This paper presents the measurement and analysis results for the performance of HGCHP system using a cooling tower as a supplemental heat rejector. In order to demonstrate the performance of the hybrid approach, we installed the monitoring equipments including sensors for measuring temperature and power consumption, and measured operation parameters from February 1, 2014 to February 28, 2015. Leaving load temperatures to building showed an average value of $11.7^{\circ}C$ for cooling and $39.5^{\circ}C$ for heating, respectively. From the analysis, the daily PF of hybrid GCHP system varied from 2.6 to 6.6 over the measurement period.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.3 s.258
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• pp.256-263
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• 2007

The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.1167-1171
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• 2008

The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

• 전자공학회논문지 IE
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• v.48 no.2
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• pp.12-18
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• 2011

In this paper, did numerical simulation to confirm LED module for lighting and protection against heat special quality of heat sink device. Analysis was gone dividing on case that emitting light side turns normalcy department considering that eat of device according to usage and case that turn down looking being street lamp of 200 W or security appointment lighting device analysis case, and also, volume of thermal element divides on big case and small case and analyzed. Confirmed that can do so that may discharge LED's thermal value to outside enough in analysis wave and current heat sink shape, and investigated that difference of protection against heat performance according to position of device and size of thermal element appears.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.7
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• pp.778-784
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• 2012

In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.8
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• pp.24-30
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• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. The results of the empirical test showed that the best temperature intensification was found at 90 with 15-fins, and the heatsink installed perpendicular to the direction of the flow of air was directly connected to the air in the largest heat shield area, leading to the best cooling, and the number of fin also resulted increase in the heat discharge area, resulting in the largest cooling action with 15 fins. It was found that the rate of air flow changed in the range of 1.5m/s to 2.5m/s, but only by a deviation of about $2^{\circ}C$ to $3^{\circ}C$ from the current state of 15 fins at 2.5m/s, and the rate of air flow increased, but the performance of the heat release was not significantly increased. As a result wind speed with minimum air flow conditions of 1.5m/s can greatly contribute to the heat dissipation performance.