• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2000년도 춘계 학술발표회 논문집
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• pp.181-188
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• 2000

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.93-93
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• 2005

• 대한기계학회논문집 C: 기술과 교육
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• 제4권1호
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• pp.19-26
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• 2016

하이브리드 지열 히트펌프 시스템은 열원을 안정적으로 유지하기 위해 보조 히트싱크나 보조 열원을 활용한다. 본 연구에서는 병원 건물에 설치한 지열-냉각탑 하이브리드 시스템의 냉난방 성능을 분석하였다. 시스템에 각종 센서와 계측 장비를 설치하였으며, 2014년 2월부터 2015년 2월까지 측정한 데이터를 이용하여 성능을 분석하였다. 냉방 기간 중, 냉수 공급 온도는 평균 $11.7^{\circ}C$이었으며, 설계 온도인 $12^{\circ}C$를 넘지 않았다. 또한 난방 기간 중에는 일평균 $39^{\circ}C{\sim}40^{\circ}C$의 온수를 공급하였다. 지열 히트펌프만의 월 평균 성능지수는 3.8에서 8.4의 범위에서 변하였다. 반면 냉각탑을 포함한 하이브리드 지열시스템의 월 평균 성능지수는 2.6에서 6.6 사이에서 변하였다.

• 마이크로전자및패키징학회지
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• 제11권2호
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• pp.11-16
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• 2004

전자칩의 고집적화에 의해 전자기기들은 점점 소형화 되어가고 있으며, 이들 기기들에서 발생되는 열은 기기의 성능 저하뿐 아니라 수명을 단축시킨다. 본 연구에서는 효율적인 방열 위한 마이크로 히트싱크 제조를 위하여 멤브레인에 금속(금, 니켈, 구리)은 도금하는 무전해 도금 방법을 이용하였다. 무전해 도금은 폴리카보네이트 멤브레인을 sensitization과 activation 등의 전처리 후, 도금하고자 하는 금속염 수용액에 침적시켜 실행하였다. 무전해 도금에 의하여 제조된 각각의 마이크로피브릴의 열전달 특성과 방열량은 표면적이 가장 큰 니켈 마이크로피브릴에서 가장 우수하게 나타났다.

• 대한기계학회논문집B
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• 제31권3호
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• pp.256-263
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• 2007

The purpose of this study is to investigate the cooling performance of heat sinks for an electronic telecommunication system by adequate natural convection. Heat generation rates of electronic components and the temperature distributions of heat sinks and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system a program is developed. The program used the graphic user interface environment to determine the arrangement of heat sources, interior fan capacity, and heat sink configuration. The simulation results showed that the heat sinks were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $19^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared. The design program gave good prediction of the effects of various parameters involved in the design of a heat sinks for an electronic telecommunication system.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2008년도 하계학술발표대회 논문집
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• pp.1167-1171
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• 2008

The flow and thermal performance of the skiving and louver fin type heat sinks for the cooling system of the small LED projector were experimentally evaluated. A small fan tester based on AMCA standards was used to control and measure the air flow rate into the heat sink. Three heat blocks were used to simulate the heat and light sources(red, green and blue) of the small LED projector. We measured the pressure drop, temperatures and input power at the specific air flow rate and discussed those results. As a result, it is found that the louver fin type heat sink has higher pressure drop and lower thermal resistance than the skiving type. From the comparison of the temperature of the heat block between skiving and louver fin type, the louver fin type heat sink was found to be more suitable for cooling the high power heat source than skiving type. The thermal performance of the fan-sink(louver fin type) system was discussed with the picture taken by a thermal video.

• 전자공학회논문지 IE
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• 제48권2호
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• pp.12-18
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• 2011

본 논문은 조명용 LED 모듈과 히트싱크 장치의 방열 특성을 확인하기 위한 수치 시뮬레이션을 하였다. 해석 케이스는 200 W급의 가로등 또는 보안등용 조명장치이며 용도에 따라 장치의 자세가 달라짐을 고려하여 발광면이 정상부를 향하는 경우와 정하부를 향하는 경우로 나누어서 해석이 진행되었고, 또한 발열소자의 체적이 큰 경우와 작은 경우로 나누어 해석하였다. 해석 결과 현재의 히트싱크 형상으로 충분히 LED의 발열량을 외부로 배출시킬 수 있음을 확인하였고, 장치의 자세와 발열소자의 크기에 따라 방열 성능의 차이가 나타남을 조사하였다.

• 한국기계가공학회지
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• 제16권5호
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

• 한국정밀공학회지
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• 제29권7호
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• pp.778-784
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• 2012

In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

• 한국기계가공학회지
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• 제18권8호
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• pp.24-30
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• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. The results of the empirical test showed that the best temperature intensification was found at 90 with 15-fins, and the heatsink installed perpendicular to the direction of the flow of air was directly connected to the air in the largest heat shield area, leading to the best cooling, and the number of fin also resulted increase in the heat discharge area, resulting in the largest cooling action with 15 fins. It was found that the rate of air flow changed in the range of 1.5m/s to 2.5m/s, but only by a deviation of about $2^{\circ}C$ to $3^{\circ}C$ from the current state of 15 fins at 2.5m/s, and the rate of air flow increased, but the performance of the heat release was not significantly increased. As a result wind speed with minimum air flow conditions of 1.5m/s can greatly contribute to the heat dissipation performance.