• Clean Technology
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• v.6 no.1
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• pp.79-84
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• 2000

In this study, to reduce the consumption of chemicals in cleaning processes, Si-wafers contaiminated with metallic impurities were cleaned with electrolyzed water(EW), which was generated by the electrolysis of a diluted electrolyte solution or ultra pure water(UPW). Electrolyzed water could be controlled for obtaining wide ranges of pH and ORP(oxidation-reduction potential). The pH and oxidation-reduction potential of anode water and cathode water were measured to be 4.7 and +1000mV, and 6.3 and -550mV, respectively. To analyze the amount of metallic impurities on Si-wafer surfaces, ICP-MS was introduced. Anode water was effective for Cu removal, while cathode water was more effective for Fe removal.

• Applied Chemistry for Engineering
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• v.5 no.5
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• pp.795-800
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• 1994

The detergencies of these new functional anionic surfactants, sodium monoglycerol ${\alpha}$-sulfonated alkanoates, were investigated and compared with those of two commercial surfactants, that is, sodium ${\alpha}$-sulfonated alkanoic acid methyl ester and sodium alkyl benzene sulfonate. According to the variation of the hydrophobic alkyl chain length, the order of detergency was shown to be $C_{16}$>$C_{18}$>$C_{14}$>$C_{12}$. From the comparision experiment for the detergency and the various fundamental properties of two other surfactants, it was found that sodium monoglycerol ${\alpha}$-sulfonated hexadecanonate has the most outstanding characteristics of detergency. Possibly this result shows light on its industrial application as a nonpolluting detergent.

• Korean Chemical Engineering Research
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• v.60 no.3
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• pp.452-458
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• 2022

Three types of gas-liquid hybrid horizontal, vertical and needle-to-cylinder plasma reactors were fabricated. Through these reactors, a high-efficiency, eco-friendly cleaning concept that generates reactive active species generated in atmospheric plasma discharge and gas-liquid activation reaction of cleaning components through the potential difference within the electrode was presented. As a result of comparing the efficiency for cleaning performance, the needle-to-cylinder type reactor had the best characteristics. Through this study, it was confirmed that the gas-liquid hybrid atmospheric pressure plasma reactor has the potential to be applied to ultra-precision cleaning processes such as semiconductor processes.

• Korean Chemical Engineering Research
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• v.59 no.4
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• pp.632-638
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• 2021

With the copper interconnection in the semiconductor process, complex residues including copper oxide, fluoride, and polymeric fluorocarbon are formed by plasma etching. In this study, a cleaning solution was prepared with a component having an amine group (-NH₂) and a carboxyl group (-COOH), and the characteristics of removing post-etch residues in the copper wiring process were analyzed. In the cleaning solution containing an amine group, the length of the component substituted with nitrogen and the length of the carbon chain influenced the cleaning effect, and the etching rate of copper oxide increased as the pH of the cleaning solution increased. The activity of the amine group is in the basic region, and the activity of the carboxyl group is in the acidic region, and the cleaning process proceeds through complex formation with copper or copper oxide in each region.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.533-541
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• 2005

Non-aqueous cleaning agents were formulated with 2,2,2-trifluoroethanol (TFEA) and hydrofluoroether (HFE), and their physical properties and cleaning abilities were examined. TFEA-based aqueous cleaning agents were also formulated with nonionic surfactants, hydrotropes and builders, and their cleaning abilities were compared. Possibilities of these cleaning agents as substitutes for CFC-113 and 1,1,1-TCE were finally evaluated. In this work, fluxes, cutting oils, greases, and fluoric oils were selected as model contaminants for cleaning experiments. These contaminants have different properties of water-solubility or hydrophilicity, and fat-solubility or lypophilicity. Cleaning abilities of TFEA-based cleaning agents were analyzed and compared through the measurement of contaminant weight changes as a function of cleaning time, and their possibilities as alternative cleaning agents were evaluated. As a result, it was shown that TFEA and HFE-based non-aqueous cleaning agents have quite a good cleaning power for fluxes and fluorine soils but low one for greases. And TFEA-based agueous cleaning agents which consisted of nonionic surfactants, hydrotrope, and builders were very effective for cleaning fluxes and greases under certain formulation conditions. Thus, it was revealed that the TFEA-based cleaning agents were very effective for cleaning specific contaminants and can be used as substitutes for CFC-113 and 1,1,1-TCE in some industrial applications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.4
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• pp.2043-2048
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• 2013

OPR-1000 CE Steam Generator, of which tube material is composed of Alloy-600 HTMA in nuclear power plant, secondary side is generated ODSCC(Outside Diameter Stress Corrosion Cracking) due to the accumulated sludge. ODSCC is centered around the tube sheet and is being affected depending on the height of the sludge. Chemical cleaning was carried out for a top-of-the-tube sheet(TTS) of Steam Generator in order to decrease corrosive condition of the secondary side of Steam Generator tubes and suppress the occurrence of stress corrosion cracking. The amount of sludge removal was 259.2kg. The height of the accumulated sludge was reduced from 0.71 to 0.34 inches. Corrosion rate as the maximum 2.34 mils was satisfied to within EPRI (Electric Power Research Institute) recommendation(10 mils).

• Journal of Korean Society of Environmental Engineers
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• v.37 no.3
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• pp.152-158
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• 2015

This paper investigated the membrane fouling potential at the state of passive adsorption which is no permeation with the test modules on COD (Chemical oxygen demand) loading rates, examined the recovery rate and resistance on membrane fouling by three cleaning manners of hydrophobic membrane in a bioreactor. The results showed that high COD loading led to the increase of extra-cellular polymeric substances and filtration resistance. The permeability resistance from 1st day to 63rd day was getting increased, however, the value of permeability resistance after 63th day during the operation period was almost same level at three COD loading rates, it was due that the biomass adhesion on membrane surface at the state of passive adsorption reached to the critical state. Also, the final recovery rates after three cleaning manners were 78%, 72% and 69% at the COD loading concentrations of 250 mg/L, 500 mg/L and 750 mg/L respectively, and then recovery rate by physical cleaning at Run 2 and Run 3 was decreased after 40th day, it proved that biomass cake, which is not easily removed, was formed on the membrane surface because of high COD loading rate and EPS concentration.

• Korean Chemical Engineering Research
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• v.47 no.6
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• pp.688-694
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• 2009

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.

• Applied Chemistry for Engineering
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• v.8 no.4
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• pp.624-630
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• 1997

Zeolite A helps an increase of detergency performance according to showing the ion exchange effect for polyvalant ions and it's detergency performance could be calculated quantitatively by using the disperse stabilization theory because it is water-insoluble material and is as colloid particles in aqueous solution. In this study, zeta potential of carbon black, cellulose, and Zeolite A were measured in each inorganic salt solutions and applied to the theory of Heterocoagulation in order to evaluate the detergency performance of Zeolite A about the particulate soil at the view point of interaction potential energy. Zeolite A was shown help an increase of detergency performance according to the increasing of the steric repulsion between Zeolite A and cellulose in $Na2CO_3$ solution and the decrease of re-deposition of carbon black on the fabric by rapid coagulation with carbon black in $Na_2SO_4$ solution.

• Journal of the Korean Vacuum Society
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• v.6 no.1
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• pp.9-19
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• 1997

The reaction mechanisms of dry cleaning with UV-excited chlorine radical for Zn, Fe and Ti trace contaminants on the Si wafer have been studied by SEM, AFM and XPS analyses in this work. The patterned Zn, Fe and Ti films were deposited on the Si wafer surface by thermal evaporation and changes in the surface morphology after dry cleaning with $Cl_2$and UV/$Cl_2$at $200^{\circ}C$ were studied by optical microscopy and SEM. In addition, changes in the surface roughness of Si wafer with the cleaning was observed by AFM. The chemical bonding states of the Zn, Fe and Ti deposited silicon surface were observed with in-line XPS analysis. Zn and Fe were easily cleaned in the form of volatile zinc-chloride and iron-chloride as verified by the surface morphology changes. Ti which forms involatile oxides was not easily removed at room temperature but was slightly removed by UV/$Cl_2$at elevated temperature of $200^{\circ}C$. It was also found that the surface roughness of the Si wafer increased after $Cl_2$and UV/$Cl_2$cleaning. Therefore, the metallic contaminants on the Si wafer can be easily removed at lower temperature without surface damage by a continuous process using wet cleaning followed by UV/$Cl_2$dry cleaning.