• Journal of Conservation Science
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• v.10 no.1 s.13
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• pp.10-20
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• 2001

Since the feasibility for the application of laser to the conservation of artworks had been demonstrated by John F. Asmus at 1972 it was known from many experiments that laser cleaning technology Provided superior characteristics over conventional cleaning methods based on mechanical and chemical actions. Then, the research and development of the cleaning technology was carried out strongly in Europe and many successful cleaning applications such as stone, painting, stained glass, paper, leather, and metal have been reported. However this is not familiar as a cleaning tool in the restoration of artworks in oriental countries including Korea. Therefore, this article aims to introduce a laser cleaning technology and its characteristics for the applications to art restoration. The contents in this article include general principles and characteristics of laser, the introduction of laser cleaning technology, and real laser applications for artwork restoration.

• Clean Technology
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• v.12 no.4
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• pp.250-258
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• 2006

CFC compounds such as CFC-113 and 1,1,1-TCE, etc. have been used in various industries due to their excellent chemical stability, thermodynamic characteristics, non-inflammability and anti-corrosiveness. However, in oder to protect the earth environment, "the Montreal Protocol on substances that deplete the ozone layer" was adopted in 1989 for prevention of production and utilization of these CFC compounds and alternative cleaning agent have been required in the industry. The objective of this study is to develop non-aqueous cleaning agents that do not require major change of cleaning system, have excellent cleaning efficiency, are favorable to the environment, are harmless to the human body, and are not generated corrosive materials. In this work, non-aqueous cleaning agents have been formulated with glycol ether series and paraffinic hydrocarbon series with siloxane, and their physical properties and cleaning efficiencies were analyzed and compared with those of regulated materials. As a result of physical properties measurement of the formulated cleaning agents, it is expected that they may have good penetration ability into contaminated materials due to their properties with low density and low surface tension. Measurement of flash point and vapor pressure of the cleaning agents will be helpful for evaluation of their safety and working environment. The experimental results of cleaning flux, solder and grease by the formulated cleaning agents show that their cleaning abilities of soils were good and that there were no residues on the substance after cleaning. Therefore, alternative cleaning agents which have equivalent cleaning ability to regulating materials, good penetration ability and low hazard to human body, have been developed in this work.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.837-842
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• 1998

As the size of the integrated circuit is scaled down the importance of Si cleaning has been emphasized. One of the major concerns is abut the removal of metallic impurities such as Cu and Fe on Si surface. In this study, we intentionally contaminated Cu and Fe on the Si wafers and cleaned the wafer by cleaning splits of the chemical mixture of $\textrm{H}_2\textrm{O}_2$ and HF and the combination of HF treatment with UV/$\textrm{O}_3$ treatment. The contamination level was monitored by TXRF. Surface microroughness of the Si wafers was measured by AFM. The Si wafer surface was examined by SEM. AES analysis was carried out to analyze the chemical composition of Cu impurities. The amount of Cu impurities after intentional contamination was abut the level of $\textrm{10}^{14}$ atoms/$\textrm{cm}^2$. The amount of Cu was decreased down to the level of $\textrm{10}^{10}$ atoms/$\textrm{cm}^2$ by cleaning splits. The repeated treatment exhibited better Cu removal efficiency. The surface roughness caused by contamination and removal of Cu was improved by repeated treatment of the cleaning splits. Cu were adsorbed on Si surface not in a thin film type but in a particle type and its diameter was abut 100-400${\AA}$ and its height was 30-100${\AA}$. Cu was contaminated on Si surface by chemical adsorption. In the case of Fe the contamination level was $\textrm{10}^{13}$ atoms/$\textrm{cm}^2$ and showed similar results of above Cu cleaning. Fe was contaminated on Si surface by physical adsorption and as a particle type.

• Journal of Korean Society of Water and Wastewater
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• v.25 no.2
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• pp.177-184
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• 2011

Membrane fouling is an unavoidable phenomenon in operation of seawater reverse osmosis (SWRO) and major obstacle for economic and efficient operation. When fouling occurs on the membrane surface, the permeate flux is decreased, on the contrary, the trans-membrane pressure (TMP) is increased, therefore operation and maintaining costs and potential damage of membranes are able to the pivotal risks of the process. Chemical cleaning process is essential to prevent interruptions for effective RO membrane filtration process. This study focused on proper chemical cleaning condition for polyamide RO membranes of 4 companies. Several chemical agents were applied for chemical cleaning under numbers of operating conditions. Additionally, a monitoring tool of FEEM as autopsy analysis method is adapted for the prediction of organic bio-fouling.

• Korean Chemical Engineering Research
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• v.54 no.4
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• pp.548-554
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• 2016

In this study, semi-aqueous solutions containing carboxylic acids such as oxalic acid (OA), lactic acid (LA) and citric acid (CA) were formulated for the removal of copper etching residues produced at the interconnection process, and their characteristics were analyzed. Carboxylic acids in the solutions were apt to form various copper complexes according to the value of pH. Semi-aqueous solution containing 10 wt% CA showed the lowest etching rate of copper in the range from pH2 to pH7 and the highest selectivity in the range of pH 2 to pH 4. However, the cleaning solution containing 10 wt% LA revealed the superior selectivity at the range from pH 5 to pH 7. Appropriate selection of carboxylic acid should be required to improve the performance of cleaning solution. In the case of CA, the etching selectivity of copper oxide complex to copper was increased with the concentration of CA in the solution, when the solutions contain over 5 wt% CA, the copper interconnection layer has a metallic copper surface more than 88% in the area. The result shows that CA contained semi-aqueous solution has a relatively good cleaning ability.

• Electrical & Electronic Materials
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• v.7 no.4
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• pp.294-299
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• 1994

CHF$_{3}$/CH$_{4}$Ar 플라즈마에 의해 형성된 산화막 식각 잔류물의 화학구조와 이 잔류물의 제거를 위한 세정방법을 x-ray photoelectron spectroscopy를 이용하여 조사하였다. 잔류무르이 구조는 CF$_{x}$-polymer와 Si-C, Si-O 결합으로 이루어진 SiO$_{y}$ C$_{z}$ 이었다. CF$_{4}$O$_{2}$ 플라즈마에 의한 silicon light etch는 산화막 식각 잔류물인 SiO$_{y}$ C$_{z}$ 층과 손상된 실리콘 표면을 제거하엿으며 NH$_{4}$OH-H$_{2}$O$_{2}$과 HF용액으로 완전히 제거되는 CF$_{x}$-polymer/SiO$_{x}$층을 남겼다. 100.angs.정도의 silicon light etch는 minority carrier life time과 thermal wave signal값을 초기 웨이퍼 수준까지 회복시켰으며 접합누설 전류도 거의 습식 식각 공정수준까지 감소시켰다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.423.1-423.1
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• 2014

본 발표에서는 실리콘 이종접합 태양전지에서 중요한 실리콘 웨이퍼 표면/계면 제어에 대하여 발표한다. 다시 말하여, 실리콘 웨이퍼 기판 세정공정 변화에 따른 실리콘 웨이퍼 표면의 소수전하수명(minority carrier lifetime, MCLT) 및 태양전지 소자특성 변화에 대하여 연구하였다. 구체적으로, 실리콘 웨이퍼 클리닝 최초단계로써 KOH damage etching 공정을 도입할 때, 이후 클리닝 공정을 통일하여 적용한 웨이퍼 표면의 MCLT 및 상기 웨이퍼를 이용하여 플라즈마 화학기상증착법(PECVD)을 통하여 제작한 태양전지 소자 효율은 KOH etching 시간이 10분일 때 최대치에 도달한 후 감소하였다. 또한, RCA1, RCA2, Piranha로 이루어진 웨이퍼 클리닝 단계의 사이에, 또는 맨 마지막에 묽힌 불산용액(DHF, 5 %) 처리를 하여 표면 산화막 제거 및 수소종단처리를 하여 기판의 passivation 특성을 향상시키고자 할 때, 불산용액 처리 순서에 따른 웨이퍼 표면의 MCLT 및 태양전지 소자 효율을 비교하였다. 그 결과, 묽은불산용액을 클리닝 단계 사이에 적용하였을 때의 MCLT 및 태양전지 소자의 특성이 더 우수하였다.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.548-551
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• 2014

In order to reduce toxicity on the human body, four new cleaning agents (1-4) containing ester and ether functionalities have been invented. The synthesized cleaning agents's physical properties, biodegradabilities, and $LD_{50}$ values, which were conducted by Korea Testing Certification Institute by using standard method, showed excellent values. A specimen for cleaning ability was prepared by cutting in $60{\times}40mm$ size of stainless steel plate. The surface of the above specimens was treated with four different kinds of contaminants, such as cutting oil, anti-rust oil, drawing oil, and lubricating oil. Contaminated specimens were then immersed in compounds (1-4) for 1 to 5 minutes to dissolve oil in the cleaning agent. The data indicate that all compounds (1-4) exhibit good cleaning ability toward four contaminant oils. It is also confirmed that these compounds can be applicable to various industrial cleaning fields as nontoxic and biodegradable cleaning agents because of their excellent biodegradabilities and $LD_{50}$ values.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2008.05a
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• pp.119-120
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 1994.02a
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• pp.38-39
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• 1994