• Korean Journal of Materials Research
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• v.9 no.10
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• pp.992-999
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6419-6424
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• 2014

The use of the PMP (Protection Module Package) was proposed as a solution for the shorter battery lifetime. The PMP means that a protection circuit consists of a semiconductor single. In this study, basic research was carried out to select a suitable epoxy material of the EMC module through finite element analysis. First, the stress on the external force was compared by the flexural strength analysis. In the following thermal analysis, the temperature change of the EMC module and the internal part was compared using the calculated heating value. Finally, the filling ratio was compared with the injection of the melting epoxy in the EMC module.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.143-147
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• 2014

The ECU which is operating inductive actuator like motor or solenoid should be designed with considering the heat removal performance and the EMC performance. In most cases, these two performances are trade-off. Especially, the metal cover with plastic housing for improving heat removal performance can affect EMC performance by coupling the noise source to harness cable and connector. Therefore, after analyzing the EMC effectiveness of the metal cover, countermeasures for EMC noise reduction should be established. In this paper, by simulating and testing of AHB Gen3 ECU, the influence of the metal cover to EMC performance is analyzed. And based on this result, we propose solutions for EMC noise reduction.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.406-410
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• 2002

최근 군사부문에서는 국방획득 비용 및 시간의 절감, 상용부문의 최신기술 활용등의 목적으로 상용품목을 적극 활용하고자 하는 노력이 있다. 그러나 상용과 군사부문의 특성 차이로 상용품목의 군사적 활용에는 많은 어려움이 있으며, EMC 관련 문제도 이를 어렵게 하는 이유중 하나이다. 상용과 군사부문의 EMC 표준은 주파수범위, 측정방법 등에 큰 차이가 있으며, 이로 인해 군사 EMC 표준을 충족하는 상용품목의 선정 및 상용표준에 의한 측정 결과의 군사적 해석이 어려운 실정이다. 상용품목의 군사적 활용에 따른 효율적인 EMC 문제의 해결을 위해서는 우선 상용품목의 사용이 의도되는 군사 전자파 환경에 대한 정확한 분석 및 이를 바탕으로 군사표준의 간소화, 상용표준과 군사표준의 연계성 연구, 상용품목의 개발단계에서의 설계반영 등이 필요하다.

• Korean Journal of Construction Engineering and Management
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• v.7 no.3 s.31
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• pp.149-158
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• 2006

For construction projects, it is required to estimate the Environmental Management Cost(EMC) for pollution prevention, using the calculation standards prescribed in the Construction Technology Management Law(CTML). However, the EMC standards are difficult to utilize without definite site information. Therefore, it is needed a new calculation method reflecting project site information. According to the definition of EMC in the CTML, this study identifies the EMC items and classifies them into the pollution types such as air, water, noise, waste and others. With this EMC classification, the stud:』 analyzes using the SPSS the EMC for the 78 new multi-housing projects, which were executed during the past three years, 2000-2002. And then an EMC estimating matrix is developed with simple information such as site location and size of area from historical data. The proposed matrix can be effectively used to check and control budgeting and estimating the EMC of the multi-housing projects. In addition, the proposed EMC matrix are validated through a case study.

• Journal of Navigation and Port Research
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• v.26 no.5
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• pp.525-528
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• 2002

The proposed EMC filter composed with feed-through capacitors and ferrite beads of high permeability was prepared which satisfy the EMC standard for a wide-band noise signal in the frequence of 10 MHz to 1.5 GHz in power supply line. The optimum structure of ferrite bead was found by calculating the load effect of ferrite beads. As a result, the filter showed excellent differential- and common-mode noises filtering characteristics above 30dB in the frequency band from 10 MHz to 1.5 GHz. The immunity characteristics are improved more than 10 to 30 dB over the frequency band from DC to 1.8GHz.

• Journal of electromagnetic engineering and science
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• v.13 no.4
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• pp.199-207
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• 2013

Meeting electromagnetic compatibility (EMC) requirements can be a significant challenge for engineers designing today's electronic devices. Traditional approaches rely heavily on EMC design rules. Unfortunately, these design rules aren't based on the specific EMC requirements for a particular device, and they don't usually take into account the specific function of the circuits or the many design details that will ultimately determine whether the device is compliant. This paper describes a design methodology that relates design decisions to the product's EMC requirements. The goal of performance-based EMC design is to ensure that electronic designs meet EMC requirements the first time the product is tested. More work needs to be done before this concept reaches its full potential, but electronic system designers can already derive significant benefit by applying this approach to products currently under development.

• Nuclear Engineering and Technology
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• v.55 no.7
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• pp.2407-2418
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• 2023

Internal replaceable electronic module substitutions can impact EMC (ElectroMagnetic Compatibility) qualification testing and results if EMC testing is conducted at the cabinet level. The impact of component substitutions on EMC qualification results therefore should be evaluated. If a qualitative evaluation is not adequate to ensure that the modified product will not impact the cabinet level EMC qualification results, a new qualification testing should be conducted. Component level retesting should be conducted under electromagnetically equivalent conditions with the cabinet level test. This paper analyzes the propagation of conducted susceptibility test waveforms in a representative cabinet and evaluates the impact of component substitutions on cabinet level EMC qualification results according to the location of the replacement items. A guideline for a qualitative evaluation of the impact of component substitutions is described based on the propagation of the conducted susceptibility test waveforms. A module level test method is also described based on an analysis of the shielding effectiveness of the cabinet.

• Journal of Surface Science and Engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Korean Journal of Materials Research
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• v.29 no.2
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• pp.106-115
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• 2019

Recently, metal cases are widely used in smart phones for their luxurious color and texture. However, when a metal case is used, electric shock may occur during charging. Chip capacitors of various values are used to prevent the electric shock. However, chip capacitors are vulnerable to electrostatic discharge(ESD) generated by the human body, which often causes insulation breakdown during use. This breakdown can be eliminated with a high-voltage chip varistor over 340V, but when the varistor voltage is high, the capacitance is limited to about 2pF. If a chip capacitor with a high dielectric constant and a chip varistor with a high voltage can be combined, it is possible to obtain a new device capable of coping with electric shock and ESD with various capacitive values. Usually, varistors and capacitors differ in composition, which causes different shrinkage during co-firing, and therefore camber, internal crack, delamination and separation may occur after sintering. In addition, varistor characteristics may not be realized due to the diffusion of unwanted elements into the varistor during firing. Various elements are added to control shrinkage. In addition, a buffer layer is inserted in the middle of the varistor-capacitor junction to prevent diffusion during firing, thereby developing a co-fired product with desirable characteristics.