• Title/Summary/Keyword: 핀 배열

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Numerical Study of Bubble Motion During Nucleate Boiling on a Micro-Finned Surface (마이크로 핀 표면 핵비등에서의 기포거동에 대한 수치적 연구)

  • Lee, Woo-Rim;Son, Gi-Hun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.10
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    • pp.1089-1095
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    • 2011
  • Numerical simulation is performed for nucleate boiling on a micro-finned surface, which has been widely used to enhance heat transfer, by solving the equations governing the conservation of mass, momentum, and energy in the liquid and vapor phases. The bubble motion is determined by a sharp-interface level-set method, which is modified to include the effect of phase change and to treat the no-slip and contact-angle conditions, as well as the evaporative heat flux from the liquid microlayer on immersed solid surfaces such as micro fins and cavities. The numerical results for bubble formation, growth, and departure on a microstructured surface including fins and cavities show that the bubble behavior during nucleate boiling is significantly influenced by the fin-cavity arrangement and the fin-fin spacing.

RF 열 플라즈마를 이용한 초고순도 그래핀 플레이크 제작에 관한 연구

  • Seong, Da-In;O, Jong-Sik;O, Ji-Su;Sin, Jae-Hui;Yeom, Geun-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.05a
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    • pp.80-80
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    • 2015
  • 벌집 모양 격자 속에 배열된 탄소 원자들의 단일 층으로 구성되고, 매우 놀라운 특성들을 지니고 있는 차세대 물질인 그래핀을 생산하기 위해서 지금까지 많은 연구진이 다양한 합성법을 개발해 왔다. 본 연구에서는 Radio Frequency (RF) 열 플라즈마를 통해 고 순도의 그래핀 플레이크를 생산하고자 하였다. 이러한 방법을 통해 sulfur와 oxygen을 포함한 불순물이 다량 제거될 수 있었으며, 초고순도 그레핀 플레이크 제조를 통해 면저항을 낮출 수 있었다.

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Experimental Study on the Heat Transfer Characteristics of Spiral Fin-Tube Heat Exchangers (나선형 핀튜브 열교환기의 열전달 특성에 관한 실험적 연구)

  • Yun Rin;Kim Yongchan;Kim Sru;Choi Jong Min
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.17 no.6
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    • pp.529-535
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    • 2005
  • This study experimentally examines the air-side performance of spiral finned tube heat exchangers. The effects of fin spacing, fin height, and tube alignment were investigated. Reduction of fin spacing decreased the Colburn j factor. However, the effect of fin height on the Colburn j factor was negligible. An increase of tube row decreased the Nusselt number for both staggered and in-line tube alignments. However, the decrease of the Nusselt number for the in-line tube alignment was much more significant than that of the staggered tube alignment. The average Nusselt number of the staggered tube alignment was larger than that of the in-line tube alignment by $10\%$ when the Reynolds number ranged from 300 to 1700. An empirical correlation of the Nusselt number was developed by using geometric parameters of heat exchanger and correction factors. The correction factor considered the effects of tube alignment and number of tube rows on the heat transfer. The proposed correlation yielded a mean deviation of $4\%$ from the present data.

Numerical Analysis of Heat Transfer of Aligned Wing Type Pin-Fin Array of Air Cooling Module with Various Fin Shapes for Electronic Packaging Application (날개형 핀-휜의 기하학적 형상이 전자기기 모듈 냉각용 공기냉각기의 유동 및 열전달에 미치는 영향)

  • Kim, Soo-Youn;Heo, Kyeon;Shin, Seok-Won
    • Clean Technology
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    • v.14 no.4
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    • pp.265-270
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    • 2008
  • In this study, the flow and heat transfer of the aligned pin-fin array of the air cooling module for electronic packaging application were numerically analyzed with various fin shapes. The geometric cross-sectional shapes of pin-fins considered in this study were ellipse, wing and circle. The fins had same cross-sectional area and height, but they had different surface areas. As the results, the surface area, the heat transfer coefficient, and the heat transfer performance of pin-fins greatly depended on their shapes. Of the three types of pin-fins, the wing type pin-fin with suitable shape produced the best heat transfer performance. This result implies that the cooling capacity of the pin-fin cooler can be significantly enhanced only by the change of fin shape without increasing air flow-rate or fin density.

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Effect of the Pin Radius on the Radiation Characteristics of a Patch Antenna with a Pin Array on a Patch (핀 반경이 패치에 핀 배열을 가지는 안테나의 방사 특성에 미치는 영향)

  • Lee, Woo-Ram;Kim, Tae-Young;Kim, Boo-Gyoun;Shin, Jong-Dug
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.355-356
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    • 2008
  • Effect of the pin radius on the radiation characteristics of a patch antenna with a pin array inserted between a patch and ground plane is investigated. As the pin radius increases, the resonant frequency increases and the radiation intensity in the horizontal plane decreases. However, the radiation intensity in the horizontal plane increases for the pin radius larger than a certain value.

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Heat transfer and friction loss characteristics of shaped short pin-fin arrays (짧은 못형핀의 형상 변화에 따른 열전달 및 마찰손실 특성)

  • Cho, H.H.;Goldstein, R.J.
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.9 no.3
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    • pp.259-267
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    • 1997
  • Average heat transfer coefficients and friction coefficients have been measured from staggered short pin-fin arrays to investigate the effect of fin shapes. Flow entering into the test section is a fully developed duct flow and the Reynolds number ranges from 5,000 to 25,000 based on fin diameter and average approaching velocity. The fin has three different shapes; uniform-diameter circular fin, two stepped-diameter circular fins. Average heat transfer rates change slightly with the fin shapes. However, friction loss(pressure loss) for the stepped-diameter fins is significantly less than that for the uniform-diameter fin. This results indicate that the stepped-diameter fin arrays in duct flow enhance heat transfer rates largely based on unit pumping power.

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Experiments on the Heat Transfer and Pressure Drop Characteristics of a Channel with Pin-Fin Array (핀-휜을 삽입한 채널의 열전달 및 압력강하 특성 실험)

  • 신지영;손영석;김상민;이대영
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.16 no.7
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    • pp.623-629
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    • 2004
  • Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.