• Title/Summary/Keyword: 피코

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Droplet-based Microfluidic Device for High-throughput Screening (액적 기반의 미세유체 시스템을 이용한 초고속 대용량 스크리닝)

  • Jeong, Heon-Ho;Noh, Young-Moo;Jang, Sung-Chan;Lee, Chang-Soo
    • Korean Chemical Engineering Research
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    • v.52 no.2
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    • pp.141-153
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    • 2014
  • Droplet based microfluidic systems have been developed for the application of biological and chemical research field. A picoliter droplet in microfluidic device provides a compartmentalized and well-defined reactor in miniaturized system. The microfluidic system with small droplets can reduce reagent cost and enhance efficiency through automated high-throughput screening system. In this review, we summarize the functionality of droplet based microfluidic system including droplet generation, precise droplet control, and various applications. In addition, this article reviews current applications in chemistry and biology, and discuss advantages of droplet based microfluidics compared with conventional manner.

An Adaptive Hot-spot Operating Scheme in Vertically Overlaid OFDMA Wireless Systems (수직적으로 겹쳐진 OFDMA 무선 시스템에서의 적응적 Hot-spot 운용 기법)

  • Choi Hye-Sun;Chung Hee-Jeong;Kim Nak-Myeong
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.30 no.7A
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    • pp.620-627
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    • 2005
  • We develop an adaptive hot-spot operating scheme(AHOS) to mitigate the negative effects from the nonuniform distribution of user location and the variation in the mixture of QoS requirements in OFDMA downlink systems. The base station in a macrocell can control the operation of picocells within the cell, and turns on or off according to the changes in the estimated user outage probability and the AHOS gain parameter. With the computer simulation, the AHOS has been proved to maximize the system throughput while maintaining the QoS outage probability very low under various system scenarios.

10㎛-wide Pattern Engraving using Metal Specimens coated with a heterogeneous metal for Printed Electronics (이종 금속이 코팅된 금속소재를 이용한 인쇄전자소자용 선폭 10㎛급 패턴 가공)

  • Sohn, Hyonkee;Cao, Binh Xuan;Cho, Yong-Kwon;Shin, Dong-Sig;Choi, Jiyeon
    • Laser Solutions
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    • v.17 no.4
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    • pp.20-23
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    • 2014
  • In printed electronics, printing rolls are used to transfer electronic ink onto a flexible substrate. Generally printing rolls are patterned in microscale by the indirect laser method. Since based on the wet etch process, the indirect method is neither environment-friendly nor suitable for making a printing roll with patterns narrower than $20{\mu}m$. In this paper, we have directly engraved micro-patterns into a Zn-coated metal specimens using a picosecond laser in order both to engrave $10{\mu}m$-wide patterns and to improve the pattern profile. Experiments showed that it is possible to engrave $10{\mu}m$-wide patterns with an a rectangular-shaped profile which is necessary for the dimensionally accurate printing.

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Theoretical analysis on the maximum volume ablation rate for copper ablation with a 515nm picosecond laser (515nm 피코초 레이저를 이용한 구리 어블레이션 공정의 최대 가공율에 대한 이론적 분석)

  • Shin, Dongsig;Cho, Yongkwon;Sohn, Hyonkee;Suh, Jeong
    • Laser Solutions
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    • v.16 no.2
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    • pp.1-6
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    • 2013
  • Picosecond lasers are a very effective tool for micromachining metals, especially when high accuracy, high surface roughness and no heat affected zone are required. However, low productivity has been a limit to broadening the spectrum of their industrial applications. Recently it was reported that in the micromachining of copper with a 1064nm picosecond laser, there exist the optimal pulse energy and repetition rate to achieve the maximum volume ablation rate. In this paper, we used a 515nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, to obtain its optimal pulse energy and repetition rate. Theoretical analysis based on the experimental data on copper ablation showed that using a 515nm picosecond laser instead of a 1064nm picosecond laser is more favorable in that the calculated threshold fluence is 75% lower and optical penetration depth is 50% deeper.

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Dynamics of a Pico Slider during the Ramp Loading Process (Ramp Loading 피코 슬라이더의 거동 해석)

  • Rhim Yoon-Chul;Kim Bum-Joon;Cho Kwang-Pyo
    • Tribology and Lubricants
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    • v.20 no.6
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    • pp.322-329
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    • 2004
  • Recently, a load/unload(L/UL) system is adopted to the hard disk drive(HDD) due to its advantages such as lower power consumption, larger data zone, simpler fabrication of disk due to no bumped parking zone, and rarer contact between slider and media. An analysis of the transient motion for the slider is very important to design an air bearing surface(ABS) of the slider to secure the stable performance of the system. During the L/UL process, however, there are several issues occurred such as contact or collision between slider and media. Sometimes this will cause the system failure. In this study, the dynamics of a pico slider during the loading process are investigated through numerical simulation using FEM analysis and experiment. Ramp profile and angular velocity of the swing arm actuator are very important parameters for the design of L/UL system to avoid collision between slider and disk.

EB-PVD 공정을 통한 열차폐 코팅 공정 기술 개발

  • Gang, Yong-Jin;Lee, Seong-Hun;Nam, Uk-Hui;Byeon, Eung-Seon;Kim, Jong-Guk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.193.2-193.2
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    • 2014
  • 열차폐 코팅(Thermal Barrier Coating)은 주로 항공기 엔진이나 화력발전용 터빈 등의 $1300^{\circ}C$ 이상의 고온에서 사용되는 부품에 적용되어 모재(내열합금)의 손상 방지 및 에너지 효율 향상을 위해 사용되고 있다. 열차폐 코팅의 경우 Plasma Spray 공법과 EB-PVD(전자빔 물리 증착법) 공법이 가장 많이 사용되고 있다. Plasma Spray에 의한 열차폐 코팅 공정은 생산 비용이 저렴하고 수평형 적층 구조를 통한 높은 열전도율을 가지는 장점이 있으며, EB-PVD 공정은 수직형 구조의 열차폐막을 통해 내열 충격성과 내열 사이클성이 양호하다는 장점이 있다. 본 연구에서는 열 사이클의 내구성이 뛰어난EB-PVD를 이용하여 열차폐 코팅 공정연구를 진행하였다. 본 연구소에서 사용하고 있는 EB-PVD 는 종래의 장치와는 달리 70 kW급 전자총 5기가 장착 되어 있으며, 각각 시편 가열용 전자총 2기 및 피코팅용 가열 전자총 3기로 구성되어 있다. 이런 구성을 통해 다양한 종류의 열차폐 박막과 높은 결정성과 치밀도를 가지는 박막 형성할 수 있을 것이다. 본 발표에서는 EB-PVD 공정 연구결과 및 향후 실용화를 위한 개발 연구 방향에 대해서 기술하였다.

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Practical application of picosecond laser micro-machining to the direct fabrication of a diffraction grating mold (피코초 레이저를 이용한 회절 격자 금형 개발)

  • Noh Ji-Whan;Lee Jae-Hoon;Sohn Hyon-Kee;Suh Jeong;Shin Dong-Sig
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.487-488
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    • 2006
  • Picosecond (ps) laser micro-machining has emerged as an attractive method of fabricating high-precision microstructures, especially in metals. In this paper, a metallic mold for diffraction gratings is fabricated with a mode-locked 12 Ps $Nd:YVO_4$ laser. Laser pulses with a wavelength of 355nm are irradiated on the surface of NOK 80, a mold material, to generate line patterns. In order to minimize the line width, laser power is set just above the ablation threshold of NOK 80. Results show that the spectrum from the fabricated mold is good enough for some industrial application.

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Fabrication of embedded circuit patterns for Ie substrates using UV laser (UV 레이저 응용 반도체 기판용 임베디드 회로 패턴 가공)

  • Sohn, Hyon-Kee;Shin, Dong-Sig;Choi, Ji-Yeon
    • Laser Solutions
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    • v.14 no.1
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    • pp.14-18
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    • 2011
  • Semiconductor industry demands decrease in line/space dimensions of IC substrates. Particularly for IC substrates for CPU, line/space dimensions below $10{\mu}m/10{\mu}m$ are expected to be used in production since 2014. Conventional production technologies (SAP, etc.) based on photolithography are widely agreed to be reaching capability limits. To address this limitation, the embedded circuit fabrication technology using laser ablation has been recently developed. In this paper, we used a nanosecond UV laser and a picosecond UV laser to fabricate embedded circuit patterns into a buildup film with $SiO_2$ powders for IC substrate. We conducted SEM and EDS analysis to investigate surface quality of the embedded circuit patterns. Experimental results showed that due to higher recoil pressure, picosecond UV laser ablation of the buildup film generated a better surface roughness.

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A Study of Low-k Wafer Engraving Processes by Using Laser with Pico-second Pulse Width (자외선 피코초 레이저를 이용한 Low-k 웨이퍼 인그레이빙 특성에 관한 연구)

  • Moon, Seong-Wook;Bae, Han-Seong;Hong, Yun-Suk;Nam, Gi-Jung;Kwak, No-Heung
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.1 s.18
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    • pp.11-15
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    • 2007
  • Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

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SLR 운영용 실시간 운영체계에 대한 실험적 고찰

  • Ryu, Dong-Yeong;Seo, Yun-Gyeong;Jo, Jung-Hyeon;Park, Jong-Uk;Kirchner, Georg;Iqbal, Farhat
    • Bulletin of the Korean Space Science Society
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    • 2009.10a
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    • pp.42.2-42.2
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    • 2009
  • 한국천문연구원에서 개발 중인 KHz급 Satellite Laser Ranging(SLR) 시스템인 ARGO-M 의 운영시스템 중의 하나인 Interface Control System 은 현재 시각에서의 위성의 위치를 개산하여 추적마운트부에 Tracking 정보를 제공하고, 주기적으로 발사되는 레이저의 귀환 시간을 계산하여 수신광검출기 게이트를 열어야 하는 시간을 FPGA 보드에 전달하는 기능 등을 수행하게 된다. 이러한 일련의 작업은 각각 필요한 시점에 정확하게 실행되어야 하며 이를 위해 실시간 운영체계가 사용될 예정이다. 실시간 운영체계 하에서 Ranging 에 관련한 프로세스를 수행할 경우에 발생될 수 있는 문제점을 검토하기 위해서 기존에 Austria Graz SLR 관측소에서 사용하고 있는 DOS용 테스트 프로그램을 실시간 운영체계로 검토되고 있는 INtime 환경으로 이식하여 성능을 기존의 DOS 프로그램과 비교하여 보았다. Controller 역할을 담당하고 있는 FPGA 보드와의 데이터 통신의 주기성을 확인하는 시험 결과 실시간 운영체계를 사용하는 경우가 USB 사용 등 외적인 교란에 의한 영향을 적게 받는 것을 확인 할 수 있었다. 또한 500피코초 단위의 해상도를 갖는 내부 이벤트 타이머와의 연계, 레이저 발사 명령, 광검출기의 게이트 여닫기 등의 프로세스가 실시간 환경에서 문제점 없이 구현 가능함을 확인하였다.

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