• Communications of Mathematical Education
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• v.30 no.1
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• pp.1-22
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• 2016

We had a full scale of literature survey and case survey of mathematics Flipped Learning class models. The purpose of this study is to design and adopt a Flipped Learning 'Linear Algebra' class model that fis our need. We applied our new model to 30 students at S University. Then we analyzed the activities and performance of students in this course. Our Flipped Learning 'Linear Algebra' teaching model is followed in 3 stages : The first stage involved the students viewing an online lecture as homework and participating free question-answer by themselves on Q&A before class, the second stage involved in-class learning which researcher solved the students' Q&A and highlighted the main ideas through the Point-Lecture, the third stage involved the students participating more advanced topic by themselves on Q&A and researcher (or peers) finalizing students' Q&A. According to the survey, the teaching model made a certain contribution not only to increase students' participation and interest, but also to improve their communication skill and self-directed learning skill in all classes and online. We used the Purposive Sampling from the obtained data. For the research's validity and reliability, we used the Content Validity and the Alternate-Form Method. We found several meaningful output from this analysis.

• Journal of The Korean Association of Information Education
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• v.21 no.6
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• pp.665-673
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• 2017

This research was performed for learning motivation and learning satisfaction of flipped learning on software education in university class. In order to compare and get the result, this study used 2 groups of experimental group(flipped learning) and comparison group(traditional face to face learning). Consequently an experimental group got more strong learning motivation and learning satisfaction than traditional learning group on software education in non-major class of university. It showed at the same time in factors of learning motivation like concentration, importance of subject, self confidence. and on factors pf learning satisfaction like problem solving, reaction, understanding, interest and relation with lecturer, This study showed that flipped learning method is more effective than face to face traditional learning method for creative or problem solving subject like software education.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.9-14
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• 2007

In this study, the thermal reliability on flip chip package with non-conductive pastes (NCPs) was evaluated under accelerated conditions. As the number of thermal shock cycle and the dwell time of temperature and humidity condition increased, the electrical resistance of the flip chip package with NCPs increased. These phenomenon was occurred by the crack between Au bump and Au bump and the delamination between chip or substrate and NCPs during the thermal shock and temperature and humidity tests. And the variation of electrical resistance during temperature and humidity test was larger than that during thermal shock test. Therefore it was identified that the flip chip package with NCPs was sensitive to environment with moisture.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.17-23
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• 2013

As a basic research to develop stretchable electronic packaging technology, CNT-Ag composite pads were formed on top of Cu/Sn chip bumps and flip-chip bonded using anisotropic conductive adhesive. Average contact resistances of the flip-chip joints were measured with respect to bonding pressure and presence of the CNT-Ag composite pads. When Cu/Sn chip bumps with CNT-Ag composite pads were flip-chip bonded to substrate Cu pads at 25MPa or 50 MPa, contact resistance was too high to measure. The specimen processed by flip-chip bonding the Cu/Sn chip bumps with CNT-Ag composite pads to the substrate Cu pads exhibited an average contact resistance of $213m{\Omega}$. On the other hand, the flip-chip specimens processed by bonding Cu/Sn chip bumps without CNT-Ag composite pads to substrate Cu pads at 25MPa, 50MPa, and 100MPa exhibited average contact resistances of $370m{\Omega}$, $372m{\Omega}$, and $112m{\Omega}$, respectively.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.12
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• pp.780-788
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• 2019

This study is intended to analyze flipped classroom learning activities, which have recently been spotlighted as a learner-centered teaching method in universities, from the perspective of cultural and historical activity theory. A survey and some participation observations were conducted with one professor and the students who participated in Educational Methods and Technology courses at A university. The components of the flipped classroom learning activities were analyzed based on the model of the activity system, and contradictions that appeared in the interactions between components were analyzed. Four implications were proposed for a more advanced flipped classroom learning activity system: the professor's and the learners' true identity recognition and role performance, strengthening the organic link between online and offline activities, support for alleviating the burden of teaching and learning preparation, and readjusting the system to support its smooth operation.

• The Journal of Korean Association of Computer Education
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• v.19 no.1
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• pp.87-100
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• 2016

This study has examined the structural relationship among factors related to the effects of flipped learning using the structural equation modeling. Two hundred thirty-six middle school and high school students were participated in this study. This study's results are as follows. First, looking through how much the flipped learning variables affect achievement, motivation affects achievement the most, and then interaction, participation come next. Second, looking through how much the flipped learning variables affect personality, interaction affect personality the most, and then teaching attitudes come next. Third, as a result of verifying the research model, the hypothetical model indicating relationship among motivation, participation, teaching attitudes, interaction and achievement, personality is valid.

• Journal of Digital Convergence
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• v.18 no.9
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• pp.49-56
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• 2020

This study aims to examine the effects of CF about learners' English writing through FL on English improvement and the factors that influence class satisfaction. For achieving this purpose, response to CF and feelings about CF were selected as predictive variables. It is intended to investigate how these variables predict learners' satisfaction. A total of 94 university students were placed into two groups: 48 experimental group, who received CF on their writing through FL, and 46 control group given traditional instruction. All the participants took pre/post tests including writing tasks, and the experimental group completed a questionnaire after the instructional treatment. The findings indicated that FL affected English improvement and both response to CF and feelings about CF predicted class satisfaction. Based on the findings, this study sheds light on the implications of how to manage the FL class efficiently.

• Journal of Digital Convergence
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• v.15 no.4
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• pp.65-71
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• 2017

With advances in technology, many researchers have made an effort to find out educational methods with customized instruction. The purpose of the research is to investigate i) if flipped learning is beneficial for the students taking intermediate-level English grammar and writing class compared with the traditional class, ii) if the flipped learning class is advantageous for all the score level students in terms of student achievement and iii) if the students feel motivated with the flipped learning class. T-test was utilized to determine any differences between pretest and posttest in student achievement. The result in terms of the academic achievement revealed that the flipped classroom approach for the low score group was found to be the least effective among others. In the case of flipped learning teaching method, the instructor should develop contents according to the level of learners. The development of customized contents tailored to the level of learners will enhance learners' learning achievement.