• Transactions of the Korean Society of Automotive Engineers
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• v.6 no.5
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• pp.104-110
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• 1998

In automotive industries, various processes for the cost reduction have been investigated lively. As one of them, powder metallurgy becomes influential. Compared to other methods used for he manufacture of steel components the Powder metallurgy process is competitive primarily due to the small number of production steps to reach the final geometry and thereby also the energy-efficiency. In this paper, to alter present forging process into powder metallurgy process by which the automotive clutch disc spline hub is manufactured machining process, the mechanical properties of sintered materials is investigated by specimen test. Selecting the 3 kinds of materials-SMF 4040, SMF 9060 and DHP-1, their properties according to heat treatment such as carburizing -tempering and plasma-nitrodizing are compared. By result of specimen test - tensile test, compression ring test, Impacting test, measurment of hardness, and microstructure analysis - we concluded that SMF 9060 and carburizing-tempering heat treatment is an optimal material and heat treatment method for the spline hub. It will be able to reduce manufacturing cost and weight.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.129-129
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• 2003

최근에 능동 영역 액정 표시 소자(Active Matrix Liquid Crystal Display, AMLCD)에서 고해상도와 빠른 응답속도를 요구하게 되면서부터 다결정 실리콘(poly-Si) 박막 트랜지스터(Thin Film Transistor, TFT)가 쓰이게 되었다. 그리고 일반적으로 디스플레이의 기판을 상대적으로 저가의 유리를 사용하기 때문에 저온 공정이 필수적이다. 따라서 새로운 저온 결정화 방법과 부가적으로 최근 디스플레이 개발 동향 중 하나인 대화면에 적용 가능한 공정인 금속유도 결정화 (Silicide Mediated Crystallization, SMC)가 연구되고 있다. 이 소자는 top-gated coplanar구조로 설계되었다. (그림 1)(100) 실리콘 웨이퍼위에 3000$\AA$의 열산화막을 올리고, LPCVD로 55$0^{\circ}C$에서 비정질 실리콘(a-Si:H) 박막을 550$\AA$ 증착 시켰다. 그리고 시편은 SMC 방법으로 결정화 시켜 TEM(Transmission Electron Microscopy)으로 SMC 다결정 실리콘을 분석하였다. 그 위에 TFT의 게이트 산화막을 열산화막 만큼 우수한 TEOS(Tetraethoxysilane)소스로 사용하여 실리콘 산화막을 1000$\AA$ 형성하였고 게이트는 3000$\AA$ 두께로 몰리브덴을 스퍼터링을 통하여 형성하였다. 이 다결정 실리콘은 3$\times$10^15 cm^-2의 보론(B)을 도핑시켰다. 채널, 소스, 드래인을 정의하기 위해 플라즈마 식각이 이루어 졌으며, 실리콘 산화막과 실리콘 질화막으로 passivation하고, 알루미늄으로 전극을 형성하였다 그리고 마지막에 TFT의 출력특성과 전이특성을 측정함으로써 threshold voltage, the subthreshold slope 와 the field effect mobility를 계산하였다.

• Journal of Welding and Joining
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• v.14 no.2
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• pp.19-27
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• 1996

재료의 표면개질은 표면층의 조직변화에 대한 개질법과 표면피복에 의한 개질 법으로 나눌 수 있다. 조직변화에 의한 개질법으로는 침탄, 질화, 이온주입 및 금속 확산 등이 있고, 표면피복에 의한 개질법으로는 도장, 도금, 육성용접, 물리증착(PVD) 및 화학증착(CVD) 등이 있는데, 용사법은 표면피복에 의한 개질법에 속한다. 용사기술 은 비교적 최근에 발달된 표면피복 기술로서 그림1과 같이 플라즈마, 가스화염 또는 아크열원을 이용하여 금속 또는 비금속 재료를 용융 혹은 반용융 상태로 모재에 고속 도로 분사하여 충돌 적층시켜 피복하는 공정으로 다른 표면개질기술에 비해서 여러 가지 잇점을 가지고 있다. 이것은 거의 모든 재질의 모재(금속, 세라믹, 유기재료 등) 에 대해 피막의 형성이 가능하고, 용사재료의 종류도 다양하다(금속, 합금, 각종 세라 믹, 플라스틱, 각종 복합재료 등). 또한 노재크기의 제한이 없고, 대형의 재료에 대해 서 한정된 부위의 피복이 가능하며, 모재의 열영향이 적고, 피막의 형성속도가 다른 피막법에 비해 빠른 장점을 가지고 있다. 그 예로 알루미나(Al$_{2}$O$_{3}$)를 피복할 경우 화학증착(CVD)법에 의해서는 피막형성 속도가 약 2 * $10^{-4}$mm/min 인데 비해 용사법에 의해서는 약 7.5 * $10^{-1}$mm/min로 매우크다. 이와같은 많은 장점을 갖고있는 용사법을 이용한 표면개질에 대해 본 기술보고에서 서술하고자 한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.1
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• pp.39-44
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• 2014

Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.234-240
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• 2005

In this study, ion nitriding of a EHA pump part made of AISI 4340 steel was performed under different applied power conditions to study the relationship between dimensional changes of specimens and the type of applied power source. Microstructures and micohardness distribution at different processing conditions were also examined. Duplex surface treatment of ion nitriding with the optimum process conditions to produce the minimum dimensional variation in a EHA pump part and a TiN thin film coating by unbalanced magnetron sputtering was performed and the specimens with a duplex surface treatment were subjected to a high speed wear test to evaluate the wear performance of EHA hydraulic pump parts with various surface treatment conditions. Results indicated that uniform and continuous surface layer with a minimum dimensional variation could be obtained by ion nitriding with bipolar mode power source and much enhanced wear characteristics with a duplex surface treatment could be obtained, compared with results from ion nitriding or single-layerd TiN coating specimens.

• Journal of the Korean institute of surface engineering
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• v.35 no.6
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• pp.391-400
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• 2002

Corrosion characteristics of Ti, Ti/Cr coated and plasma-nitrided surface for stainless steel containing Ti have been studied. Stainless steels containing 0.09-0.92wt% Ti were fabricated by using vacuum furnace and solutionized for 1hr at 105$0^{\circ}C$. Ti and Cr coatings were done on solutionized stainless steel surface by EB-PVD. The Ti coated specimen were coated by Cr and were nitrided by plasma at $450^{\circ}C$ for 5hr. Microstructure and phase analysis were performed using SEM, OM and EDX. Corrosion behavior of the coated specimen was investigated by electrochemical test. The coated surface was of fine columnar structure. The Ti/Cr coated surface was denser than the Ti coated and the Ti coated-nitrided surfaces. The corrosion and pitting potential increased in proportion to the Ti content, coating temperature, coating thickness and formation of stable oxide film. The current density in active and passive region decreased in the case of Ti/Cr coated sample and Ti coated-nitrided samples. Especially the plasma nitrided specimen after Ti coating have a good corrosion resistance compared with the Ti coated specimen. The number and size of pits decreased as Ti content of matrix increased.

• Journal of Power System Engineering
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• v.9 no.1
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• pp.70-75
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• 2005

The damping property of Fe-12Cr-22Mn-X alloys has been investigated to develop high damping and high strength alloy. Particularly, the effect of the phase of austenite, alpha and epsilon martensite, which constitute the structure of the alloys Fe-12Cr-22Mn-X alloys, on the damping capacity at room temperature has been investigated. Various fraction of these phases were formed depending on the alloy element and cold work degree. The damping capacity is strongly affected by ${\varepsilon}$ martensite while the other phase, such as ${\alpha}'$ martensite, actually exhibit little effect on damping capacity. In case of Fe-12Cr-22Mn-3Co alloy, the large volume fraction of ${\varepsilon}$ martensite formed at about 30% cold rolling, and in case of Fe-12Cr-22Mn-1Ti alloy, formed at about 20% cold rolling and showed the highest damping capacity. Damping capacity showed higher value in Fe-12Cr-22Mn-1Ti alloy than one in Fe-12Cr-22Mn-3Co alloy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.133-133
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• 2018

증착(Vapor Deposition)이란 어떤 물질을 증기화 시켜 기판에 응축시키는 공정을 말하며 물리증착(Physical Vapor Deposition; PVD)과 화학증착(Chemical Vapor Deposition)으로 대별된다. 빗각 증착 (Oblique Angle Deposition; OAD) 기술은 입사 증기가 기판에 비스듬히 입사하도록 조절하여 코팅하는 물리증착 기술의 하나로 피막의 조직을 다양하게 제어할 수 있으며 따라서 피막의 특성 제어가 가능한 기술이다. 지금까지 빗각증착은 증기의 산란이 발생하지 않는 $10^{-5}$ 토르 이하의 고진공에서 이루어져 왔다. 본 연구에서는 플라즈마를 이용한 스퍼터링과 음극 아크 증착을 이용하여 질화티타늄(TiN; Titanium Nitride) 박막을 제조하고 그 특성을 평가하였다. TiN 박막은 내마모성 향상 및 장식용 코팅에 널리 이용되고 있다. 박막 제조시 특히 바이어스 전압을 박막 조직의 기울기를 제어하는 수단으로 이용하였고 빗각과 바이어스 전압을 이용하여 다층박막의 조직제어에 활용하였다. 박막의 미세구조와 방위, 경도를 SEM, XRD, Nano Indenter를 이용하여 측정하였고 반사율 및 박막의 조도는 Spectrophotometer와 조도 측정기를 이용하여 측정하였다. 기울어진 조직 및 V형태의 조직이 단층 및 다층의 피막에서 명확하게 관찰됨을 확인하였고 특히 마지막 층 제조시 바이어스 전압을 인가할 경우 탄성계수는 크게 변하지 않는 상황에서 경도가 증가함을 확인하였다.

• Korean Journal of Materials Research
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• v.14 no.4
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• pp.265-269
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• 2004

Plasma nitrocarburising and post oxidation were performed on SCM435 steel by a pulsed plasma ion nitriding system. Plasma oxidation resulted in the formation of a very thin ferritic oxide layer 1-2 $\mu\textrm{m}$ thick on top of a 15～25 $\mu\textrm{m}$ $\varepsilon$-F $e_{2-3}$(N,C) nitrocarburized compound layer. The growth rate of oxide layer increased with the treatment temperature and time. However, the oxide layer was easily spalled from the compound layer either for both oxidation temperatures above $450^{\circ}C$, or for oxidation time more than 2 hrs at oxidation temperature $400^{\circ}C$. It was confirmed that the relative amount of $Fe_2$$O_3$, compared with $e_3$$O_4$, increased rapidly with the oxidation temperature. The amounts of ${\gamma}$'-$Fe_4$(N,C) and $\theta$-$Fe_3$C, generated from dissociation from $\varepsilon$-$Fe_{2-3}$ /(N,C) phase during $O_2$ plasma sputtering, were also increased with the oxidation temperature.e.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.111-114
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• 2000

Growth characteristics and microstructure of AlN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the microstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.