• Title/Summary/Keyword: 프린트배선기판

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A Study on Dielectric Properties of Printed Circuit Board(PCB) Materials with Variation of Frequency and Temperature using Coaxial Air Line Probe (동축선로 프로브를 이용한 프린트 배선 회로용 기판 재료의 주파수 및 온도 변화에 따른 유전특성 연구)

  • 박종성;김종헌
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.11a
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    • pp.187-190
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    • 1998
  • In this paper a probe for the' measurement of dielectric properties of dielectric sheet materials is designed and implemented as a coaxial air line type. Using the broadband impedance method with this measurement probe the dielectric constant and loss tangent of the glass-epoxy and teflon are determined in the frequency range of 0.1 - l.O[GHz] with the temperature variation from $25[^{\circ}C]$ up to $65[^{\circ}C]$. A measured relative dielectric constant of the glass-epoxy is 4.42 and a loss tangents is 0.019 relatively, and the relative dielectric constants of teflon is 2.17 and a loss tangents is 0.002 relatively

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A Study on Dielectric Properties of Printed Circuit Board(PCB) Materials with Variation of Frequency and Temperature (온도 및 주파수 변화에 따른 프린트 배선기판의 유전특성 연구)

  • 박종성;김종헌;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.135-138
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    • 1998
  • This paper presents the results of measured permittivity of PCB sheet material in the frequency range of 0.1[GHz] - 2[GHz] and temperature range of $25[^{\circ}C]$ - $85[^{\circ}C]$. Microstrip lines with different physical length are implemented to measure the attenuation and phase shift of the signals though these lines. The loss factor of these materials could be obtained with the dielectric constant and the attenuation of the microstrip lines.

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The Grinding Characteristics of the Metal Components in Printed Circuit Boards(PCBs) Scrap by the Swing-Hammer Type Impact Mill (충격형 분쇄기 에 의한 폐프린트배선기판(PCBs) 중 금속성분의 분쇄 특성)

  • 이재천;길대섭;남철우;최철준
    • Resources Recycling
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    • v.11 no.2
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    • pp.28-35
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    • 2002
  • A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

A Study on Dielectric Properties of Printed Circuit Board Materials with Variation of Frequency and Temperature (온도 및 주파수 변화에 따른 프린트 배선기판의 유전특성 연구)

  • 박종성;김종헌;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.10
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    • pp.773-777
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    • 1998
  • This paper presents the results of measured permittivity of PCB sheet material in the frequency range of 0.1 ~ 2[㎓] and temperature range of 25~ 85[>$^{\circ}C$]. Microstrip lines with different physical length are implemented to measure the attenuation and phase shift of the signals through these lines. The loss factor of glass-epoxy and teflon could by calculated with the measured dielectric constant and the attenuation. From the experiment, the glass-epoxy was more influenced by temperature and frequency than teflon. The average dielectric constants of glass-epoxy and teflon within the measured frequency range are 4.48 and 2.18, respectively.

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A Placement Prablem with Wire Congestion in LSI Layout CAD (LSI의 Layout CAD에 있어서의 배선 혼잡도를 고려한 배치 문제)

  • Im, In-Chil;Jeong, Jeong-Hwa;Lee, Byeong-Ho
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.19 no.3
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    • pp.19-27
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    • 1982
  • Minimization of total routing and number of cuts has been adopted for the placement problem in LSI and printed wire board as the object function, recently. Although it is considered that in the general situation this object function reflects the final goal which is wiring of 100% of layout, it often seems to be insufficient because it does not exhibit partial wire congestion. This paper introduces a new concept called the wire congestion of segestion to get the partial wire congestion and proposes the object function to minimize the wire congestion of segmests. In order to optimize this object function, an effective heuristic algorithm is also suggestsl Experimental results show that this algorithm sustains its efficiency. The experimental consequences point out that if the total routing length is short, maximum wire congestion of segment is small and vice versa. Therefore control parameter, that is, congestion parameter, which mintnizes total length and concurrently reduces maximal wire congestion of segment, is obtained by experiment.

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