• Title/Summary/Keyword: 프로브 팁

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Design of Vertical Type Probe Tip Using Finite Element Analysis (유한요소해석을 이용한 수직형 프로브 팁의 설계)

  • Oh, Young-Ryun;Kim, Yun-Jae;Nam, Hyun-Suk;Park, Ung-Gi;Lee, Hak-Joo;Kim, Jung-Yub;Park, Jun-Hyub
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.8
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    • pp.851-856
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    • 2012
  • The design process of a micro-probe tip is very complicated and expensive. To avoid these problems, in this study, we used element (FE) analysis. To simplify design process. A new pre-probe tip (cobra-needle type) made of Ni and Co was designed by FE analysis. Experimental results were compared with those obtained by FE analysis to verify the reliability of the analysis. The contact force and over drive were respectively found to be 12.5 gf(Contact Force) and $100{\mu}m$(Over drive). We propose the new designed probe tip. Material of new designed probe tip is NiCo. Values of Property are 1~2 gf(Contact Force) and $100{\mu}m$(Over drive).

Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch (미세 피치를 갖는 MEMS 프로브 팁의 설계 및 기계적 특성 평가)

  • Ha, Seok-Jae;Kim, Dong-Woo;Shin, Bong-Cheol;Cho, Myeong-Woo;Han, Chung-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.4
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    • pp.1210-1215
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    • 2010
  • The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

Materials Compatibility and Structure Optimization of Test Department Probe for Quality Test of Fingerprint Sensor (지문인식센서 품질평가를 위한 검사부 프로브의 소재 적합성과 구조 최적화 연구)

  • Son, Eun-Won;Youn, Ji Won;Kim, Dae Up;Lim, Jae-Won;Kim, Kwang-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.73-77
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    • 2017
  • Recently, fingerprint sensors have widely used for personal information security, and require quality evaluation to reduce an error of their recognition rate. Quality of fingerprint sensors is evaluated by variation of their electrical resistance introducing by contacts between a probe tip and a sensor electrode, Investigation on the materials compatability and structure optimization of probe is required to reduce deformation of sensor electrode for repeatability of quality testing. Nickel, steel(SK4), beryllium copper, and phosphor bronze were considered as probe materials, and beryllium copper was the most appropriate for materials of probe tips, considering indentation and contact resistance while being contacted probe tips on electrodes. Probes of an inspection part were manufactured with the single-unit structure for physical damage prevention and parallel processing capability. Inspection repeatability was evaluated by voltage variation of fingerprint sensors when the specific current was applied. A single-unit inspection part with beryllium copper probe tips showed excellent repeatability within ${\pm}0.003V$ of its voltage variation.

Process Development of Forming of One Body Fine Pitched S-Type Cantilever Probe in Recessed Trench for MEMS Probe Card (멤스 프로브 카드를 위한 깊은 트렌치 안에서 S 모양의 일체형 미세피치 외팔보 프로브 형성공정 개발)

  • Kim, Bong-Hwan
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.1
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    • pp.1-6
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    • 2011
  • We have developed the process of forming one body S-type cantilever probe in the recessed trench for fine-pitched MEMS probe card. The probe (cantilever beam and pyramid tip) was formed using Deep RIE etching and wet etching. The pyramid tip was formed by the wet etching using KOH and TMAH. The process of forming the curved probe was also developed by the wet etching. Therefore, the fabricated probe is applicable for the probe card for DRAM, Flash memory and RF devices tests and probe tip for IC test socket.

Development and Calibration of a Seven-Hole Pressure Probe (7공 압력프로브의 교정 및 개발)

  • Yang, Jae-Hun;Chang, Jo-Won
    • Journal of the Korean Society for Aviation and Aeronautics
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    • v.14 no.1
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    • pp.43-48
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    • 2006
  • The present study was carried out in order to develope a seven-hole pressure probe which is able to measure high flow angles. The seven-hole pressure probe is a non-nulling, directional velocity probe used for measuring three dimensional flow that having high flow angles. A 4 mm diameter seven-hole conical pressure probe was manufactured with a cone angle of 70$^{\circ}$. The probe was comprised of seven 1 mm diameter stainless steel tubes packed close together and fitted into an outer stainless steel sleeve. The calibration procedure is based on the use of the Callington's polynomial curve-fit method. The validity of the seven-hole conical pressure probe is demonstrated by comparisons with hot-wire data.

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Fabrication of Bump-type Probe Card Using Bulk Micromachining (벌크 마이크로머시닝을 이용한 Bump형 Probe Card의 제조)

  • 박창현;최원익;김용대;심준환;이종현
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.3 no.3
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    • pp.661-669
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    • 1999
  • A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

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A Study on the Flow Characteristics in Axial Flow Rotors with Varying Tip Clearance (축류회전차에서 팁간극의 변화를 고려한 유동특성에 관한 연구)

  • 이명호
    • Journal of Advanced Marine Engineering and Technology
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    • v.26 no.3
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    • pp.353-361
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    • 2002
  • The tip leakage flow passing through the clearance between rotor blade tip and casing shroud has been known to occupy an important portion of the rotor overall loss. In this study, flow characteristics in axial flow rotors with different tip clearances is investigated by experimental and numerical methods. The experimental study was carried out to measure static pressure and velocity profiles at the real rotating test rig. The axial flow rotors used for the experiments have ten blades and three different rotor diameter. The tip clearance heights are 1mm, 3mm, and 4.5mm. Measurements were done using spherical type five-hole probe by non-nulling method. The numerical study was carried out to calculate pressure distributions and velocity vectors at the same condition as the experiments in the flow fields of axial flow rotors using Phoenics code.

Manipulation of Carbon Nanotube Tip Using Focused Ion Beam (집속이온빔을 이용한 탄소나노튜브 팁의 조작)

  • Yoon, Yeo-Hwan;Park, June-Ki;Han, Chang-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.12 s.189
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    • pp.122-127
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    • 2006
  • This paper reports on the development of carbon nanotube tip modified with focused ion beam(FIB). We used an electric field which causes dielectrophoresis, to align and deposit CNTs on a metal-coated canning Probe Microscope (SPM) tip. Using the CNT attached SPM tip, we have obtained an enhanced resolution and wear property compared to that from the bare silicon tip through the scanning of the surface of the bio materials. The carbon nanotube tip was aligned toward the source of the ion beam allowing their orientation to be changed at precise angles. By this technique, metal coated carbon nanotube tips that are several micrometer in length are prepared for SPM.

Effect of Turbine Blade tip shape on the Total Pressure Loss of a Turbine Cascade (블레이드 팁 형상이 터빈 캐스케이드 전압 손실에 미치는 영향에 대한 연구)

  • Lee, Ki-Seon;Park, Seoung-Duck;Noh, Young-Chul;Kim, Hak-Bong;Kwak, Jae-Su;Jun, Yong-Min
    • The KSFM Journal of Fluid Machinery
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    • v.12 no.2
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    • pp.39-45
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    • 2009
  • Leakage flow through turbine blade tip gap causes strong leakage vortex near the blade suction side and induces large aerodynamic losses. In this study, the conventional plane tip and various squealer tip blades were tested in a linear cascade in order to measure the effect of the tip shape on the total pressure loss. Three tip gap clearances of 0.6%, 1.3%, and 2.0% of blade span were tested. Flow measurement was conducted at one chord downstream from the trailing edge with a five-hole probe. Results showed that the leakage vortex was stronger than passage vortex and the mass averaged overall total pressure loss through the cascade was the lowest for suction side blade tip case. For all tested cases, the area averaged overall total pressure loss was increased as the tip clearance increased.

Studies on the Characteristics of Electroless Ni-B-W Deposition using Dimethylamine borane (DMAB를 사용한 무전해 Ni-B-W 도금의 특성 연구)

  • Jeong, Sang-Il;Jeong, Seong-Hui;Lee, Ju-Yeol;Jang, Do-Yeon;Jeong, Yong-Su
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.137-137
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    • 2013
  • 본 연구에서는 반도체 검사 장비인 프로브 카드의 핵심 부품인 프로브 니들의 팁 부분의 내마모성을 향상시키기 위하여 무전해 Ni-B-W 합금 도금 실험을 실시하였다. 무전해 Ni-B-W 합금 도금 실험에서 여러 가지 제어인자 중 도금욕의 pH와 온도 그리고 환원제의 농도 등을 변수로 하였다. 도금욕 pH와 온도에 따른 전착속도 및 물성 변화를 관찰하였으며, 환원제 농도 변화에 의한 open circuit potential의 변화를 측정하였다.

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