• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.36-43
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• 2020

A biliant stent was fabricated using a magnesium alloy wire, a biodegradable metal. In order to control the fast decomposition and corrosion of magnesium alloys in vivo, magnesium alloy wires were coated with biodegradable polymers such as polycaprolactone (PCL), poly(propylene carbonate) (PPC), poly (L-lactic acid) (PLLA), and poly (D, L-lactide-co-glycolide) (PLGA). In the case of PPC, which is a surface erosion polymer, there is no crack or peeling compared to other polymers (PCL, PLLA, and PLGA) that exhibit bulk erosion behavior. Also, the effect of biodegradable polymer coating on the axial force, which is the mechanical property of magnesium alloy stents, was investigated. Stents coated with most biodegradable polymers (PCL, PLLA, PLGA) increased axial forces compared to the uncoated stent, reducing the flexibility of the stent. However, the stent coated with PPC showed the axial force similar to uncoated stent, which did not reduce the flexibility. From the above results, PPC is considered to be the most efficient biodegradable polymer.

• Journal of the Korean Institute of Gas
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• v.17 no.3
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• pp.14-19
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• 2013

This paper presents an experimental study on the safety of a valve for a special gas cylinder. The test valves that were randomly dismantled from the special gas cylinder were experimented on the gas leakage and operation safeties. The crack, wear and deformation of the valve body, screw thread, safety disk, vent hole, stem and handle components that may affect to the gas leakage safety of a used valve were not found in this experimental study. A painted handle of a valve was partly stripped from the coated surface, and the surface of PT screw of a used valve body was rusted. But, these paint and rust problems do not affected to the gas leakage safety of used valves. And there was no gas leakage in the dismantled valve, and the permanent deformation and partial scars of a valve stem and O-rings were observed on the rubbing surfaces. Thus, the valve seat and O-rings are recommended to be replaced for a gas leakage safety of a dismantled valve. And it is necessary to repair and inspect handle fastening forces for a safe opening and closing operations of a valve.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.5
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• pp.974-980
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• 2015

Arc thermal spray coating using Al-3%Mg thermal spray wire was carried out to prevent steel from corrosion damage under the marine environment. Post-sealing was applied to Al-3%Mg spray coating treatment using organic/inorganic composite ceramics in order to improve the corrosion resistance of the as-sprayed coating. The results of various electrochemical experiments with sealing treatment indicated that the improvement in corrosion resistance was observed due to low current density in all applied potential range during anodic and cathodic polarization experiments. Futhermore, the natural potential measurement exhibited severe potential fluctuation due to influence of micro-crack presence on the surface of sealed thermal spray coating layer. In addition, the sealed layer was easily eliminated during anodic polarization. Nevertheless, Al-3%Mg spray coating layer improved corrosion resistance by sealing treatment because the sealed coating efficiency was determined to be 92.11%, indicating the exterior environment barrier effect which is based on the Tafel analysis.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.329-329
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• 2010

반도체 및 디스플레이의 진공부품은 알루미늄 모제에 전해연마법(electrolytic polishing), 양극산화피막법(Anodizing), 플라즈마 용사법(Plasma spray) 등을 사용하여 $Al_2O_3$ 피막을 성장시켜 사용되고 있다. 반도체 제조공정 중 30~40% 이상의 비중을 차지하는 식각(etching) 및 증착(deposition) 공정은 대부분 플라즈마를 사용하고 있다. 플라즈마에 의해 화학적, 물리적 침식이 발생하여 코팅막에 손상을 일으켜 코팅막이 깨지거나 박리되면서 다량의 Particle을 생성함으로써 생산수율에도 문제를 야기 시킨다고 알려져 있다. 하지만 이들 코팅막을 평가하는 방법은 거의 전무하여 산업계에서 많은 애로를 겪고 있다. 이러한 코팅부품의 내플라즈마 성능평가 방법과 기준이 없어 적절한 교체시기를 파악하기 위한 코팅부품의 손상정도를 정량화 및 평가 방법의 표준화를 구축하는 연구를 수행하였다. 본 연구에서는 이러한 소재의 특성평가를 위해 공정에서 사용 중 손상되어 교체된 샘플의 모폴로지 관찰하고 내전압 측정으로 전기적 특성을 분석하여 손상 전, 후의 변화를 관찰하였다. 또한 플라즈마의 영향에 따른 코팅 막 형태 변화 및 전기적 특성의 변화를 알아보기 위하여 양극산화피막법(Anodizing)으로 $Al_2O_3$를 성장시킨 평가용 샘플을 제작한 후, Plasma chamber 장비를 이용하여 플라즈마 처리에 따른 코팅막의 내전압, 식각율, 표면 미세구조의 변화를 측정하였고 이를 종합적으로 고려하여 진공 장비용 코팅부품의 공정영향에 의한 내플라즈마 특성평가방법 개발에 관하여 연구하였다. 이러한 실험을 통해 플라즈마 처리 후 코팅 막에 크랙이 발생되는 것을 확인할 수 있었고 코팅 막의 손상으로 전기적 특성이 감소를 것을 확인할 수 있었다. 또한 ISPM 장비를 이용하여 진공 장비용 코팅부품이 플라즈마 공정에서 발생하는 오염 입자를 측정할 수 있는 방법을 연구하였다. 이러한 결과를 이용하여 진공공정에서 사용되는 코팅부품이 플라즈마에 의한 손상정도를 정량화 하고 평가방법을 개발하여 부품 양산업체의 진공장비용 코팅부품 개발 신뢰성 향상이 가능할 것으로 본다.

• Journal of the Korean Wood Science and Technology
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• v.19 no.1
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• pp.31-63
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• 1991

It was proved that in conventional kiln drying of disks piling position in the kiln exerted a great influence on drying rates, and the larger the variation of disk diameter, the more undulating drying rates of disks. While in vacuum drying disks there was no influence on drying rates. By the end-wrapping treatments and the radial direction of disks tangential surface stresses in the core of disks were slightly compressive in three species. In control disks the drying stresses distributed into one step-style that compressive stresses in the pith side of 6cm from pith were larger than those in the bark side, while in the disks end-wrapped with Korean paper the drying stresses distributed uniformly, because flow rates of free water in disks had no difference between heart-and sap-wood by obstruction of evaporating water from surface of disks by end-wrapping with Korean paper. And end-wrapping with Korean paper considerably restrained those. Tangential differential shrinkage stresses developed the maximum tensile stress near the bark and with approaching the pith the stresses gradually reduced and changed into compressive stresses in near the pith. At the end of vacuum drying the maximum tangential tensile stresses of disks end-wrapped with Korean paper were smaller than those of control disks, and critical moisture contents causing the V-shaped crack of disks end-wrapped with Korean paper were lower than those of control disks because of the set by obstruction of evaporating water of end-wrapping with Korean paper. In the experiment of vacuum drying stress distribution the disks end-wrapped with Korean paper or aluminum foil in three species were free from V-shaped cracks and control disks were defected very slightly by V-shaped cracks. And also disks end-wrapped with Korean paper were free from heart checks in Alnus japonica and Juglans sinensis, and heart checks were occurred very slightly in others. Especially, not to speak of disks end-wrapped with Korean paper, vacuum drying of disks end-wrapped with aluminum foil prevented effectively drying defects, moreover drying times could be shortened, that is. Ginkgo biloba, Alnus japonica, and Juglans sinensis disks could be dried from green to in-use moisture content in 110 hours, 272 hours, and 407 hours, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Journal of Conservation Science
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• v.32 no.4
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• pp.501-510
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• 2016

In this study, we investigated the degradation of adhesives when exposed to ultraviolet light irradiation using samples of lacquer (L), treated lacquer (TL), lacquer mixed with glue (LG), and urushiol mixed with glue (UG). Four types of film specimens were collected under the ultraviolet exposure time, and gloss test, tensile shear strength test, scanning electron microscope analysis, and infrared spectroscopic analysis were conducted for the specimens. LG and UG showed lowering rate of gloss is somewhat later than L. Also, it was observed that with increasing exposure time to ultraviolet irradiation, the surface of L began to show spherical pits and cracks when the polysaccharide layers started to be exposed, whereas the surfaces of LG and UG remained smooth. The Infrared spectra of L and TL showed that the intensity of the overall peak decreased with increasing ultraviolet irradiation time. There was no change in the peak intensity of LG, but for UG, the peaks at $3013cm^{-1}$, $1593cm^{-1}$ and so on disappeared and the overall intensity declined. The tensile shear strength of LG and UG was maintained or increased as compared to the initial test, whereas the tensile shear strength of L decreased sharply after 600 h. LG and UG exhibited fewer changes as a result of high temperature and humidity conditions, and they retained their strength under UV exposure. These results indicate that LG and UG are more durable than L when subjected to environmental change.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.33-40
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• 2003

In this work, diglycidyl ether of bisphenol A (DGEBA)/polyetherimide (PEI) blends were cured using 4,4-diaminodiphenyl methane (DDM). And the effects of addition of different PEI contents to neat DGEBA were investigated in the thermal properties and fracture toughness of the blends. The contents of contents of containing PEI were varied in 0, 2.5, 5, 7.5, and 10 phr. The cure activation energies ($E_a$) of the cured specimens were determined by Kissinger equation and the mechanical interfacial properties of the specimens were performed by critical stress intensity factor ($K_{IC}$). Also their surfaces were examined by using a scanning electron microscope (SEM) and the surface energetics of blends was determined by contact angles. As a result, $E_a$ and $K_{IC}$ showed maximum values in the 7.5 phr PEI. This result was interpreted in the increment of the network structure of DGEBA/PEI blends. Also, the surface energetics of the DGEBA/PEI blends showed a similar behavior with the results of $K_{IC}$. This was probably due to the improving of specific or polor component of the surface free energy of DGEBA/PEI blends, resulting in increasing the hydrogen bonding of the hydroxyl and imide groups of the blends.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.