• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.228-228
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• 2008

CdS is II-VI semiconductor with a wide band gap of approximately 2.42 eV. CdS is the most popularly employed heterojunction partner to p-CdTe due to its similar chemical properties. In this work, to improvement of the surface properties of the CdS films, PET substrate is treated by high density $O_2$ plasma. CdS films are prepared by chemical bath deposition(CBD) method. In case of the PET substrate with plasma treatment for 2min, the crystalline orientation of CdS films exhibits a strong hexagonal(002). Grain size was increased from 300nm without $O_2$ plasma treatment to 380nm with an $O_2$ plasma treatment.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.6.1-6.1
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• 2009

최근 신 재생 에너지에 대한 관심이 고조되고 있으며 특히 태양전지는 차세대 대체에너지로 많은 연구 개발이 이루어지고 있다. 현재 태양전지 시장은 벌크실리콘 태양전지가 주를 이루고 있으나, 박막형, 유기물, 염료감응형 등 다양한 차세대 태양전지가 개발되고 있다. 차세대 태양전지는 글래스나 폴리머 기판위에 형성된 전극을 바탕으로 하여 다양한 형태의 태양전지가 형성되기 때문에 태양전지용 투명도전성 산화물 전극에 대한 중요성이 증가하고 있다. 예를 들어 실리콘 박막형 태양전지의 경우 수소 플라즈마 분위기 안정성 때문에 ZnO:Al 전극이 개발, 적용되고 있다. 이밖에도 ZnO는 나노입자, 나노로드 등의 다양한 형태를 기반으로 유기물 및 염료감응형 태양전지 전극으로 적용되고 있다. 본 연구에서는 전기화학적 방법을 이용해 나노입자, 나노로드, 나노 sheet 등 다양한 형태의 ZnO 나노구조를 형성한 후, 태양전지 적용을 위한 전기적, 광학적 특성을 분석하였다. 3차원 형태의 ZnO sheet 전극은 90% @ 550 nm 가 넘는 우수한 광특성 (Haze value)을 보였으며, 염료감응형 태양전지에 적용되었을 경우 2차원 형태의 ZnO 전극에 비해 Jsc 값이 2.5배 이상 향상되었다.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.873-880
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• 2009

Water-vapor permeation through metallic barriers deposited on polymer substrates has been an important technological issue because the performance of the barrier is critical to the reliability of flexible organic devices. For the development of long-lifetime flexible organic devices, two different sets of samples were designed and demonstrated from the viewpoint of the water-vapor transmission rate (WVTR). Aluminum (Al) and polyethylene terephthalate (PET) were chosen for the barrier layer and the polymer substrate, respectively. Two stacking structures, a single-layer (Al/PET) structure and a double-layer (Al/PET/Al) structure, were used for the WVTR measurement. For the single-layer structure, the WVTR decreases as the thickness of the barrier layer increases. Compared to the single-layer sample, the double-layer sample showed superior WVTR performance (by nearly three times) when the total thickness of the Al barrier was greater than 100 nm.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.303-310
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• 2008

We fabricated hydrogenated amorphous silicon(a-Si:H) 140 nm thick film on a $180\;nm-SiO_2/Si$ substrate with an inductively-coupled plasma chemical vapor deposition(ICP-CVD) equipment at $250^{\circ}C$. Moreover, 30 nm-Ni film was deposited with a thermal-evaporator sequently. Then the film stack was annealed to induce silicides by a rapid thermal annealer(RTA) at $200{\sim}500^{\circ}C$ in every $50^{\circ}C$ for 30 minuets. We employed a four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), and scanning probe microscope(SPM) in order to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure evolution, and surface roughness, respectively. We confirmed that nano-thick high resistive $Ni_3Si$, mid-resistive $Ni_2Si$, and low resistive NiSi phases were stable at the temperature of <300, $350{\sim}450^{\circ}C$, and >$450^{\circ}C$, respectively. Through SPM analysis, we confirmed the surface roughness of nickel silicide was below 12 nm, which implied that it was superior over employing the glass and polymer substrates.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.29-35
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• 2017

In this paper, we investigated a manufacturing process of metal micro-wire interconnection on submillimeter diameter catheter. Over the years, flexible electronic researches have focused on flexible plane polymer substrate and micro electrode manufacturing on its surface. However, a curved polymer substrate, such as catheter, is very important for medical application. Among many catheters, importance of submillimeter diameter steerable catheter is increasing to resolve the several limitations of neurosurgery. Steering actuators have been researched for realizing the steerable catheter, but there is no research about practical wiring for driving these actuators. Therefore we developed a new manufacturing process for metal micro-wire interconnection on submillimeter diameter catheter. We designed custom jigs for alignment of the metal micro-wires on the submillimeter diameter catheter. An UV curing system and commercial products were used to reduce the manufacturing time and cost; Au micro-wire, UV curable epoxy, UV lamp, and submillimeter diameter catheter. The assembled catheter was characterized by using an optical microscope, a resistance meter, and a universal testing machine.

• Polymer(Korea)
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• v.30 no.4
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• pp.362-366
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• 2006

It was found by polarized FTIR spectroscopic studies that pentacene molecules are arranged with their molecular axes perpendicular to the substrate surface when pentacene films are deposited on a polyimide alignment layer. The ring plane in a pentacene molecule is arranged parallel to the rubbing direction of the polyimide alignment film while no specific arrangement of vertically deposited pentacene molecules was found for the film without rubbing. The pentacene band at $1296cm^{-1}$ which has a transition dipole moment parallel to the ring plane is much stronger in a polarized IR spectrum of parallel to the rubbing direction, whereas the band at $908cm^{-1}$ whose transition dipole align normal to the ring plane shows much stronger intensity in a spectrum of perpendicular to the rubbing direction. These findings indicate that orientation of polyimide chains affects the arrangement of pentacene molecules when they are deposited on a polyimide alignment film.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.475-480
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• 2017

In this paper, the conductivity of the fine pattern is improved in the insulating substrate by laser-induced forward transfer (LIFT) process. The high laser beam energy generated in conventional laser induced deposition processes induces problems such as low deposition density and oxidation of micro-patterns. These problems were improved by using a polymer coating layer for improved deposition accuracy and conductivity. Chromium and copper were used to deposit micro-patterns on silicon wafers. A multi-pulse laser beam was irradiated on a metal thin film to form a seed layer on an insulating substrate(SiO2) and electroless plating was applied on the seed layer to form a micro-pattern and structure. Irradiating the laser beam with multiple scanning method revealed that the energy of the laser beam improved the deposition density and the surface quality of the deposition layer and that the electric conductivity can be used as the microelectrode pattern. Measuring the resistivity after depositing the microelectrode by using the laser direct drawing method and electroless plating indicated that the resistivity of the microelectrode pattern was $6.4{\Omega}$, the resistance after plating was $2.6{\Omega}$, and the surface texture of the microelectrode pattern was uniformly deposited. Because the surface texture was uniform and densely deposited, the electrical conductivity was improved about three fold.

• Polymer(Korea)
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• v.37 no.3
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• pp.373-378
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• 2013

The interfacial adhesion strength is very important in $SiO_x$ deposited PC film for the barrier enhanced polycarbonate (PC) flexible substrate. In this study, PC films were treated by undercoating, UV/$O_3$ and low temperature plasma and then the effect of physical and chemical surface modifications on the interfacial adhesion strength between PC film and $SiO_x$ barrier layer were studied. It was found that untreated PC film shows significantly low interfacial adhesion strength due to the smooth surface and low surface free energy of PC. Low temperature plasma treatments resulted in the increase of both surface roughness and surface free energy due to etching and the appearance of polar molecules on the PC surface. However, UV/$O_3$ treatment only shows the increase of surface free energy by developed polar molecules on the surface. These surface modifications caused the enhancement of surface interfacial strength between PC film and $SiO_x$ barrier. In the case of undercoating, it was found that the increase of surface interfacial strength was achieved by adhesion between various acrylic acid on acrylate coated surface and $SiO_x$ without increase of polar surface energy. In addition, the barrier property is also improved by organic-inorganic hybrid multilayer structure.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.389.1-389.1
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• 2014

최근의 환경 및 에너지에 대한 관심으로 수요가 증가하고 있는 하이브리드 및 전기 자동차나 태양광발전, 풍력발전용의 인버터기기에는 고에너지밀도 커패시터가 필수적이 되었다. 높은 에너지 밀도를 요구하는 전력전자, 펄스파워 등의 응용분야에 사용되는 고에너지밀도 커패시터는 PET (Polyethylene terephtalate)와 PP (Polypropylene)와 같은 폴리머 유전체를 사용하는 범용 필름 커패시터가 사용되었으나 사용 요구 조건의 한계에 도달하여, 새로운 유전체를 적용하는 커패시터가 절실히 필요한 상황이다. PET와 PP와 같은 유전체는 유전상수가 2~3의 낮은 값을 가지고 있어 고에너지밀도를 구현하기가 어렵다. 본 연구에서는 새롭게 요구되고 있는 고에너지 밀도 커패시터의의 성능을 만족시키기 위하여 $20{\sim}50{\mu}m$ 두께의 PET 필름상에 세라믹 유전체인 $ZrO_2$ 박막을 스퍼터(Sputter) 증착법에 의해 코팅하여 종래의 필름 커패시터와 세라믹 커패시터의 장점을 갖는 커패시터를 제조하기 위한 박막 유전재료의 개발을 목표로 하였다. 수백 nm~수 ${\mu}m$ 두께의 $ZrO_2$ 박막을 스퍼터링 공정조건에 따라 증착한 후 박막의 결정성, 기판과의 부착성, 증착속도, 유전상수, 절연파괴강도, 온도안정성 등을 XRD, SEM, AFM, EDS, XPS, Impedance analyzer 등에 의해 평가하였다. $ZrO_2$ 유전체막은 상온에서 증착하였음에도 정방정(tetragonal)구조의 결정질로 성장하였고 증착압력이 증가함에 따라 주피크의 세기가 감소하였다. 증착 중 산소가스를 주입하였을 경우에도 결정질막으로 성장하였다. 증착막들은 산소가스의 양이 증가함에 따라 짙은 흰색으로 변하였으며 PET 기판과의 접착력도 약해졌다. 또한 거칠기는 Ar가스만으로 증착한 경우보다 증가하였으며 24~66 nm의 평균 거칠기값을 보였다. PET위에 Ar가스만으로 증착한 $ZrO_2$의 비유전율은 1kHz에서 116~87의 비유전율을 보여 PET에 비해 매우 우수한 특성을 보였다. $ZrO_2$ 막들은 300kV/cm의 전계에서 대략 10-8A 이하의 누설전류를 보였다. 증착가스비를 달리하여 제조된 시편에서도 유사한 누설전류값을 나타내었다. 300 kV/cm 전후의 전계까지 측정한 $ZrO_2$ 막의 P-E (polarization-electric field) 특성을 확인하였는데, 5 mTorr의 압력에서 증착한 막은 253 kV/cm에서 $5.5{\mu}C/cm^2$의 분극값을 보였다. P-E커브의 기울기와 분극량에 따라 에너지밀도가 달라지므로 공정조건에 따라 에너지밀도가 변화됨을 예측할 수 있었다. PET위에 스퍼터 증착한 $ZrO_2$ 유전체막은 5mTorr의 Ar가스분위기에서 제조할 때 가장 안정적인 구조를 보였으며, 고에너지밀도 커패시터에의 적용가능성을 보였다.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.