• Title/Summary/Keyword: 평탄화

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The Technique of Spectrum Flattening by Algorithm for Minimized Harmonics Variance Value (Harmonic 분산값 최소화 알고리즘에 의한 주파수 영역 평탄화 기법)

  • Min, So-Yeon;Kim, Young-Kyu
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.9
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    • pp.3558-3562
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    • 2010
  • The exact fundamental frequency (pitch) extraction is important in speech signal processing. However the exact pitch extraction from speech signal is very difficult due to the effect of formant and transitional amplitude. So in this paper, the pitch is detected after flattening the spectrum in frequency region by proposed algorithm for minimized harmonics variance value. Experimental result showed the proposed method appeared an outstanding performance in compared with LPC, Cepstrum. Also, the results show the proposed method is better than conventional method.

The Effects of Additives on the Electropolishing of Copper Through Via (구리 Through Via 전해연마에 미치는 첨가제의 영향 연구)

  • Lee, Suk-Ei;Lee, Jae-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.45-50
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    • 2008
  • The effects of electrolytes and additives on the electropolishing of 50 and $20{\mu}m$ diameter copper via were investigated to flatten 3D SiP through via. The termination time was determined with analysis of applied potential on anode and cathode to avoid excess electropolishing. Acetic acid played a role of accelerator and glycerol played a role of inhibitor in phosphoric acid electrolytes. The overplated copper on the through via was effectively electropolished in the phosphoric electrolytes with acetic acid and glycerol addition. The electropolishing was terminated at the point of abrupt change of applied potential to remove only overplated copper on the through via.

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Enhancement of Light Extraction Efficiency of OLED Using Si3N4 Nano Pattern on Glass Substrate

  • Park, Sang-Jun;Jo, Jung-Yeon;Kim, Yang-Du;Yu, Sang-U;Heo, Ju-Hyeok;Seong, Yeong-Hun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.251.1-251.1
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    • 2014
  • Oraganic Light Emitting Diodes (OLED) 소자의 광추출 효율을 향상시키기 위한 방안으로 나노급 사이즈의 고 굴절률 패턴을 기판의 내부 패턴에 적용하였다. 100 nm 및 300 nm의 직경을 갖는 Si3N4 나노 패턴을 나노 임프린트 리소그래피와 건식 식각 공정을 통하여 OLED의 유리기판에 형성을 하였다. 그리고 Silicon On Glass (SOG) 물질을 패턴이 전사된 기판에 스핀 코팅으로 평탄화 공정을 진행 함으로써 OLED소자의 전기적인 특성이 떨어지는 문제점을 개선하였다. 그러고 나서 Si3N4 나노 패턴이 형성되고 평탄화 공정을 마친 기판상 OLED 소자를 제작하였다. OLED의 발광층에서 발생한 빛은 Si3N4 나노패턴에 의해 산란되어 광 추출 효율을 개선할 수 있다. 본 연구에서 두 가지 종류 100nm, 300nm 높이의 Si3N4 나노패턴으로 높이에 따른 광 추출 효율을 비교하고자 OLED 소자를 제작하였다. 기판에 Si3N4 패턴이 형성된 OLED의 효율은 Si3N4 300nm에서 13.1% 증가하였다.

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Analysis of Research Trends on Electrochemical-Mechanical Planarization (전기화학-기계적 평탄화에 관한 연구 동향 분석)

  • Lee, Hyunseop;Kim, Jihun;Park, Seongmin;Chu, Dongyeop
    • Tribology and Lubricants
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    • v.37 no.6
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    • pp.213-223
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    • 2021
  • Electrochemical mechanical planarization (ECMP) was developed to overcome the shortcomings of conventional chemical mechanical planarization (CMP). Because ECMP technology utilizes electrochemical reactions, it can have a higher efficiency than CMP even under low pressure conditions. Therefore, there is an advantage in that it is possible to reduce dicing and erosions, which are physical defects in semiconductor CMP. This paper summarizes the papers on ECMP published from 2003 to 2021 and analyzes research trends in ECMP technology. First, the material removal mechanisms and the configuration of the ECMP machine are dealt with, and then ECMP research trends are reviewed. For ECMP research trends, electrolyte, processing variables and pads, tribology, modeling, and application studies are investigated. In the past, research on ECMP was focused on basic research for the development of electrolytes, but it has recently developed into research on tribology and process variables and on new processing systems and applications. However, there is still a need to increase the processing efficiency, and to this end, the development of a hybrid ECMP processing method using another energy source is required. In addition, ECMP systems that can respond to the developing metal 3D printing technology must be researched, and ECMP equipment technology using CNC and robot technology must be developed.

Long haul transmission link using a optimized circulating loop for optical wavelength division multiplexing signals (최적화된 반복루프를 이용한 파장분할다중화 광신호 장거리 전송)

  • Choi, Bo-Hun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.7
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    • pp.1757-1763
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    • 2014
  • Optical wavelength division multiplexing signals of eight non-return-to-zero 10 Gb/s channels were transmitted on the long-haul link up to 720 km. The link span was composed of 80 km single mode fiber, dispersion compensation fiber for complete compensation, and EDFAs. A circulating loop method was applied to the link experiment and the loop was optimized for the transmission link. Wavelength-dependent gain variation of EDFA was compensated using EDFAs of opposite gain slopes without expensive gain flattening filters. Average OSNR was aggravated to 22 dB and the worst OSNR channel variation was 9.7 dB after the transmission. It was confirmed by analyzing optical spectra that this OSNR variation was mainly caused by the hole burning effect of EDFA.

Gain flattening of erbium-doped fiber amplifiers by using an AOTF for long-haul WDM optical transmissions (파장분할방식 장거리 광전송을 위한 음향광학필터를 이용한 에르븀 첨가 광섬유 증폭기의 이득 평탄화)

  • 안성준;정희상;이동한
    • Korean Journal of Optics and Photonics
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    • v.9 no.6
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    • pp.413-416
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    • 1998
  • We have flattened the gain of EDFA by using a long-period FBG filter and AOTF's. The gain and optical SNR characteristics of the gain-flattened EDFA in long-haul transmission been evaluated in a recirculating EDFA loop. The gain variation was less than 4.6 dB and the optical SNR was higher than 14 dB over 20-nm wavelength range when the optical signal went through the EDFA as many as 200 times. These results indicate that this gain-flattened EDFA is applicable for ultra long-haul WDM optical transmissions over 8000 km.

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