• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.1
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• pp.91-98
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• 2023

With the increasing flood damage by frequently localized heavy rains, flood prediction research are being conducted to prevent flooding damage in advance. In this paper, we present a machine-learning scheme for developing a flooding depth and location prediction model using real-time rainfall data. This scheme proposes a dataset configuration method using the data as input, which can robustly configure various rainfall distribution patterns and train the model with less memory. These data are composed of two: valid total data and valid local. The one data that has a significant effect on flooding predicted the flooding location well but tended to have different values for predicting specific rainfall patterns. The other data that means the flood area partially affects flooding refers to valid local data. The valid local data was well learned for the fixed point method, but the flooding location was not accurately indicated for the arbitrary point method. Through this study, it is expected that a lot of damage can be prevented by predicting the depth and location of flooding in a real-time manner.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.20-25
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• 1998

Cu removal rates for various SiO$_2$ trench pitch sizes and densities and AFM images of surface profiles after global planarization using Cu CMP technology are investigated. In the experimental results, Cu removal rates are increasing as the pattern densities and pattern pitches are getting high and low, respectively, and then decreasing after local planarization. The rms roughness after global planarization are about 120$\AA$. AFM images with a 50% pattern density for 1${\mu}{\textrm}{m}$ and 2${\mu}{\textrm}{m}$ pitches show that thicknesses of 120~330$\AA$ Cu interconnects have been peeled off and oxide erosion of Cu/Sio$_2$ sidewall is observed. However, AFM images with a 50% pattern density for 10${\mu}{\textrm}{m}$ and 15${\mu}{\textrm}{m}$ pitches show that 260~340$\AA$ thick Cu interconnects have been trenched at the boundaries of Cu/Sio$_2$ sidewall.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.3C
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• pp.255-261
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• 2008

Conventional look-up table(LT) has gained a lot of speed increase in generation of digital holograms for 3D objects, but it has required an enormous memory size of the LT. In this paper, a novel approach to dramatically reduce the size of the conventional LT, still keeping its advantage of fast computational speed is proposed, which is called here a N-LT(novel look-up table) method. In the proposed method, only the fringe patterns of the center points on each image plane are pre-calculated, called elemental fringe patterns and stored in the look-up table. Then, the fringe patterns for other object points on each image plane can be obtained by simply shifting this pre-calculated elemental fringe pattern according to the displaced values from the center to those points and adding them together. Some experimental results revealed that the computational speed and the required memory size of the proposed approach are found to be 48.7 times faster than that of the ray-tracing method and 217 times smaller than that of the conventional LT method, respectively.

• The KIPS Transactions:PartD
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• v.12D no.6 s.102
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• pp.807-816
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• 2005

Sequential pattern mining finds all of the frequent sequences satisfying a minimum support threshold in a large database. However, when mining long frequent sequences, or when using very low support thresholds, the performance of currently reported algorithms often degrades dramatically. In this paper, we propose a novel sequential pattern algorithm using only closed frequent sequences which are small subset of very large frequent sequences. Our algorithm generates the candidate sequences by depth-first search strategy in order to effectively prune. using bitmap representation of underlying databases, we can effectively calculate supports in terms of bit operations and prune sequences in much less time. Performance study shows that our algorithm outperforms the previous algorithms.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.17-23
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• 2002

The more productive and stable fabrication can be obtained by applying chemical mechanical polishing (CMP) process to shallow trench isolation (STI) structure in 0.18 $\mu\textrm{m}$ semiconductor device. However, STI-CMP process became more complex, and some kinds of defect such as nitride residue, tern oxide defect were seriously increased. Defects like nitride residue and silicon damage after STI-CMP process were discussed to accomplish its optimum process condition. In this paper, we studied how to reduce torn oxide defects and nitride residue after STI-CMP process. To understand its optimum process condition, We studied overall STI-related processes including trench depth, STI-fill thickness and post-CMP thickness. As an experimental result showed that as the STI-fill thickness becomes thinner, and trench depth gets deeper, more tern oxide were found in the CMP process. Also, we could conclude that low trench depth whereas high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

• Journal of Broadcast Engineering
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• v.18 no.3
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• pp.409-415
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• 2013

Recently, various equipments have been developed for convenience of presentations. Presentation equipments added the keyboard and mouse functions to laser pointer and devices have become main method. However these devices have demerits of limited action and a few events. In this paper, we propose a method which increases the degrees of freedom of presentation as the control of the hand by using a depth camera. The proposed method recognizes the horizontal and vertical positions of hand pointer and the distance between hand and camera from both depth and RGB cameras, then performs a presentation event as the location and pattern that the hand touches a screen. The simulation results show that a camera is fixed on left side of the screen, and nine presentation events is correctly performed.

• 한국정보통신설비학회:학술대회논문집
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• 2007.08a
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• pp.231-234
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• 2007

와전류를 이용한 전위강하법은 시험체에 와전류를 비 접촉식으로 발생 시킬 수 있어 기존의 방식에 비해 결함 검출시 발생하는 오차를 줄일 수 있고 물체의 결함 검출신호의 신뢰성을 향상 시킬 수 있다. 본 논문에서는 와전류를 이용한 전위강하법의 전자기 유한요소해석을 수행하였다. 3차원 유한요소해석과정에서 해석시간을 단축시키기 위해 각 영역별로 MVP, ESP, RMSP, TMSP의 미지수 변수를 부여하여 유한요소해석을 수행하였다. 기존의 전위강하법에 와전류의 개념을 적용하기 위해서 주파수에 대한 결함 깊이의 영향과 결함에 대한 주파수에 대한 영향을 검토해본 결과 결함의 깊이가 깊어질수록 또한 높은 주파수에서 신호의 크기가 선형적으로 증가하는 패턴을 보였다. 연구결과 와전류를 이용하여 ACPD법을 시행할 경우 데이터 처리 과정과 실험 장비를 단순화 시킬 수 있어 결함 검사를 손쉽게 할 수 있을 것이라 예상된다.

• Journal of Korea Society of Industrial Information Systems
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• v.9 no.1
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• pp.63-68
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• 2004

This paper is the study about the thinning algorithm by the fire front' propagation and WPTA available for the recognition of various characters. The proposed algorithm can extract the skeleton of a character almost similar to the original pattern by using the depth value representing depth information of each pixel. In this paper we proposed the new thinning algorithm, implemented it, and showed execution results.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.20 no.1
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• pp.77-83
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• 2002

Recently, the industrial development caused the expansion of city and the field of construction is being larged in size. So, information of construction buried in underground is necessary. In this paper, we were investigated the detachability on various specimen in self-designed test field using the GPR system with three antenna elements and it was constantly radiated 730 MHz frequency. To examine the detachability on various condition, the test were displayed B-scan CRT. And the pattern was exactly positioned when it was compared to the real buried-depth. Therefore, we can confirm similarity between the wave-propagation velocity and previous results.

• Proceedings of the Korea Information Processing Society Conference
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• 2014.11a
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• pp.1008-1010
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• 2014

본 논문에서는 색상-깊이 영상간의 좌표 변환 관계 검출 시스템 및 변환 정확도 측정 시스템의 알고리즘을 제안한다. 자체 제작한 3D 체크 패턴 구조물을 이용하여 두 영상간의 대응점을 찾고, 이들 간에 관계식을 수치적 분석 또는 수학적인 분석을 통해 관계를 유도하였다. 키넥트 카메라를 이용하여 실험을 하였고, 3차원 영상으로 기존의 방법과 비교하여 성능이 향상됨을 확인 할 수 있었다.