• Proceedings of the Korean Information Science Society Conference
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• 2010.06b
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• pp.476-481
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• 2010

기존 리눅스 소프트웨어 패키지는 타겟 시스템의 CPU 타입이 정해진 후 컴파일 되어 사용자에게 배포된다. 만약 설치 시스템의 CPU를 위한 패키지가 제공되지 않을 경우 사용자는 크로스 컴파일러를 이용하여 소프트웨어를 추가적으로 빌드해야 하는데 일반 사용자가 이와 같은 작업을 수행하기란 쉽지 않았다. 다른 대안으로 JVM과 같은 가상머신 기반의 소프트웨어를 작성하면 CPU에 독립적으로 패키지를 배포하고 소프트웨어를 실행할 수 있지만 네이티브 코드에 비해 성능이 떨어진다는 단점이 있었다. 본 논문에서는 가상머신의 이점을 살리면서도 네이티브 코드와 동일한 성능을 보장해줄 수 있는 OceanVM 가상머신을 사용하여 CPU 독립적인 리눅스 소프트웨어 패키지를 설계하고 구현하였다.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.33-38
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• 2002

High performance packages must have a minimum insertion loss and return loss. In this paper, we design a millimeter-wave ceramic package using LTCC (Low Temperature Cofired Ceramic) technology to satisfy excellent transmission characteristics and characterize in a frequency range from DC to 30 GHz using the FEM (Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This designed ceramic package will be useful for MMIC (Monolithic Microwave Integrated Circuit) modules.

• The Transactions of the Korea Information Processing Society
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• v.7 no.9
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• pp.2783-2796
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• 2000

In electronic commerce systems, for the purchase of package goods to be processed in realtime, the stock of their components has to be

• Journal of the Korean Society for information Management
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• v.32 no.3
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• pp.21-47
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• 2015

The construction of preservation metadata is a prerequisite for the preservation of digital information. In the current approaches to digital archiving, however, there is no metadata structure optimized to describe preserved digital objects. This research proposed metadata packages that can support the description of digital objects from the perspective of the core processes of digital archiving. The proposed metadata packages consist of 4 wrapper elements and 25 sub-elements. They can provide detailed descriptions required to preserve digital objects in accordance with the core processes of digital archiving. Therefore, the proposed metadata package can be applied to digital archiving as a better approach to the description of digital objects compared to the approaches to information package.

• Proceedings of the Korean Information Science Society Conference
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• 2011.06c
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• pp.105-108
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• 2011

범정부적인 차원에서 기록물은 종이 위주의 생산방식에서 전자문서방식으로 변하고 있다. 이미, 많은 국가에서 표준을 정의하여 기록물에 대한 연구가 진행되고 있다. 또한, 기록물을 효과적으로 저장하기 위한 기록물 보존소에 대한 연구도 활발하게 진행 되고 있다. 대부분의 기록물 보존소는 OAIS 참조모델을 기반으로 구성이 되고 있으며, SIP, AIP, DIP 패키지 형태로 수집, 보관, 배포되고 있다. 이러한 기록물 패키지들은 다양한 메타데이터 스키마를 포함 할 수 있어서, 여러 종류의 기록물들의 수집, 보관, 배포가 용이 하게 하지만, 기록물 보존소에 저장되어 있는 기록물 패키지를 검색하기 위해서는 다양한 스키마를 모두 검색 할 수 있어야 하는 문제점이 존재한다. 따라서 본 논문에서는 기록물 패키지를 위한 신경망 회로 기반 자동 스키마 매칭 기법을 제안 하고자 한다. 신경망 회로 기반 자동분류 알고리즘을 통하여 기록물 패키지 안에 존재하는 다양한 형태의 메타데이터 스키마들에 대한 검색을 가능하게 한다. 또한, 실험을 통하여 제안하는 방법의 정확성을 확인 하였다.

• KIPS Transactions on Computer and Communication Systems
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• v.11 no.4
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• pp.119-126
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• 2022

In this paper, we present important factors and methodologies that we have to follow for secure and efficient package management systems in a closed network. By analyzing previous works, we present several security considerations for the existing package management systems. Based on the consideration, we propose guidelines regarding the use of package management systems in the closed network. More specifically, we propose the development of new package management tools, utilization of physical storage media, utilization of local backup repositories, package updates, and downgrade batches for secure and efficient package management.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.17-22
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• 2018

In this paper, the effects of solder joint aging on the reliability of embedded package solder joints were investigated using numerical analysis by finite element method. Solder joints were SAC305 with aging time 0, 60, 180 days. For reliability analysis, warpage of package and equivalent creep strain (ECS) and total strain energy density (TSED) of solder joint were analyzed. The analysis results show that the package warpage is decreased in the case of the embedded package compared to the non embedded package, and the reliability life of the solder joint is predicted to be high. Also, it was interpreted that the longer the aging time, the less the warpage of the embedded package, but the reliability life of the solder joint would be shortened.

• The Journal of the Korea Contents Association
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• v.13 no.6
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• pp.469-480
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• 2013

This study suggests 12 products regarding the pending question of tourism package price mechanism which is linked directly and indirectly to Jeju Tourism, and shows the following conclusions through inspection in mental accounting principles and framing effect based on prospect theory. First, when presenting the price list of the tourism package, it is needed to present in price bundling. Second, it is proven that it is desirable that information about discount prices open the individual discount information of the basic package and option package to public. Third, it is discovered that experienced tourists in purchasing tourism products are more sensitive to price information (price discount) than inexperienced tourists, so that framing effect conform to Knowledge-assembly theory. The current questions of this study are that 'no discount' information should be presented in bundling, that the method of framing is important in presenting discount product information. It is required not only to grasp the viewpoint of modern people in purchasing tourism products, but also to present ready-to-serve products which can save time, effort, cost to give stability in mental accounting principles.