• Journal of KIISE:Computing Practices and Letters
• /
• v.9 no.3
• /
• pp.241-253
• /
• 2003

SCA (Software Communication Architecture), which has been adopted as a SDR(Software Defined Radio) Forum standard, provides a framework that successfully exploits common design patterns of embedded systems software. However, the SCA is inadequate as a component framework since it does not explicitly specify (1) a component model that defines how to express a component interface and how to implement it, (2) a package model that defines what and how to package in deployment units, and (3) a deployment model that defines the deployment environment and deployment process. In this paper, we propose a SCA-based component framework for SDR. Specifically, we present (1) a component model that defines a component as a specialized CORBA object that implements object management functionality, (2) a package model exploiting the existing XML descriptors of the SCA, and (3) a deployment model that defines a SCA-based deployment environment, a boot-up process that restores the deployment state, and a deployment process that supports lazy application instantiation and dynamic component replacement.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.47-53
• /
• 2019

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/PTFE structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff polytetrafluoroethylene (PTFE) as the island substrate, and their stretchable deformation-resistance characteristics were characterized. The flip-chip joints, formed by bonding the chip bumps of 50 ㎛-diameter onto the PDMS/PTFE substrate pads, exhibited an average contact resistance of 96 mΩ. When the stretchable package of the soft PDMS/hard PDMS/PTFE structure was deformed to 30% elongation, the strain on the PTFE was restrained to 1%, resulting in a negligible resistance increase of 1% in the daisy-chain circuit formed on the PTFE island substrate. The circuit resistance increased for 1.7% after 2,500 cycles of 0~30% stretchable deformation.

• Journal of Convergence for Information Technology
• /
• v.11 no.6
• /
• pp.219-225
• /
• 2021

As for the battery package method, a prismatic package method is preferred for stability reasons, but it is rapidly expanding due to the stability verification of a pouch type package. The pouch type using the lamination process has an advantage of high battery energy density because it can reduce space waste, but has a disadvantage of low productivity. Therefore, in this paper, by extracting edge detection algorithm precision, pattern algorithm precision, and motion controller recall rate by improving backlight lighting fixtures to minimize light diffusion, securing standards for stereo camera position relationship displacement monitoring, and securing standards for lens release monitoring. We propose to implement a system that ensures accuracy and reliability in positioning. As a result of the experiment, the proposed system shows an average error range of 0.032mm for edge detection, 0.02mm for pattern algorithm, and 0.014mm for motion controller, thus ensuring the accuracy and reliability of the positioning mechanism.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.71-72
• /
• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.831-832
• /
• 2013

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.73-82
• /
• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.

• Proceedings of the KAIS Fall Conference
• /
• 2002.05a
• /
• pp.234-238
• /
• 2002

오늘날 거의 모든 기업이 고객 및 고객 서비스를 경영에 있어 가장 중요한 요소로 인식하고 있으며, 실제로도 고객을 이용하기 위해 더 많이 노력하고, 그 결과를 경영전략 수립에 제 대로 활용해온 기업들이 업종을 막론하고 상당히 따른 시간 안에 주요 경쟁업체로 부상하고 있음이 증명되고 있다. 본 논문에서는 CRM과 DW의 관계를 통하여 기존의 외국패키지의 아키텍처대신에 한국형 CRM 아키텍처를 제시하였고 차세대 아키텍처를 제안하였다.

• 프린팅코리아
• /
• v.8 no.3
• /
• pp.84-85
• /
• 2009

IT기술과 인쇄기계가 결합되는 사례가 적지 않은 요즘이지만 패키지나 번들 수준을 벗어나서 1:1 맞춤형으로 제공되는 사례나 아예 전적으로 집중하는 사례는 그리 흔하지 않은 것이 사실이다. 지난 1987년 출범한 대신정보통신(대표 이재원, www.dsic.co.kr)은 IT기술을 기반으로 하는 전형적인 정보통신분야의 회사이지만 IT기술과 시스템프린터를 융합한 고객맞춤형 디지털프린팅사업을 하는 POD사업본부(본부장 김종배이사)는 많은 고객을 확보, 활발한 사업을 전개하고 있다. POD사업본부는 특화 및 차별화된 상품 및 서비스 개발에 역점을 기울여 왔으며 오세코리아, 다이니폰스 크린코리아, 리코 등 유력한 프린터 제조사들과 협력관계를 맺고 다양하고 생산성 높은 작업을 지원하는 시스템 프린터와 토탈 Out_put 솔루션을 제공해 왔다.

• Journal of the Korean BIBLIA Society for library and Information Science
• /
• v.14 no.1
• /
• pp.5-24
• /
• 2003

In recent years, electronic technologies are rapidly changing the library's approach to collection management. In digital age, collection is a hybrid, that is, a mix of analog materials and digital information resources. But electronic publications are both a blessing and a curse for libraries. And the rapid acceptance of electronic resources raises many misconceptions and myths about their capabilities. This paper analyzes the digital paradox of current collection management from six standpoints : production of digital informations : digital scholarly communication : digital access paradigm : acceptance of e-journal package web collection development : digital archiving. Nowadays the pragmatic view of library is a logical information gateway to its own services and those of other libraries and information providers. Libraries and librarians need a concept and strategies of the hybrid collection management that reflects digital reality.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.2
• /
• pp.21-28
• /
• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.