• Proceedings of the KIPE Conference
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• 2019.11a
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• pp.220-221
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• 2019

본 논문에서는 자기유도방식의 드론용 무선전력 전송 시스템에 적합한 송·수신 패드의 모델을 제안하고, 드론의 수평 이격 거리에 따른 특성을 비교하였다. 송·수신 코일 간 결합계수, 저항 성분 등을 통하여 송·수신 패드의 성능을 비교하였으며, 해당 모델에서 최적의 성능을 보이는 코일의 턴 수 및 위치를 연구하였다.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.8
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• pp.1921-1930
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• 1993

In order to evaluate the inlet pressure correctly, the full Navier-Stokes equations are solved numerically for the computational domain which covers the cavity region between pads as well as the bearing film. A nonuiform grid system is adopted to reduce the number of grid points, and the numerical solutions are obtained for a wide range of Reynolds number in laminar regime with various values of the distance between pads. The numerical results show that the inlet pressure is significantly affected by Reynolds number and the distance between pads. An expression for the loss coefficient in terms of Reynolds number and non-dimensional distance between pads is obtained on the basis of the numerical results. It is found that the inlet pressure over the whole range of numerical solutions can be fairly accurately estimated by applying the formula for the loss coefficient to the extended Bernoulli equation.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.10a
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• pp.388-390
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• 2021

This paper introduces a system that can help visually impaired people to board a bus using an embedded board with keypad, dot matrix, lidar sensor, NFC reader, a public data portal Open API system, and deep learning algorithm (YOLOv5). The user inputs the desired bus number through the NFC reader and keypad, and then obtains the location and expected arrival time information of the bus through the Open API real-time data through the voice output entered into the system. In addition, by displaying the bus number as the dot matrix, it can help the bus driver to wait for the visually impaired, and at the same time, a deep learning algorithm (YOLOv5) recognizes the bus number that stops in real time and detects the distance to the bus with a distance detection sensor such as lidar sensor.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.251-255
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• 2003

탄화규소 반도체에 대한 오옴성 금속 접촉 성질을 조사하기 위해 3종류의 금속 (Ni, Co, Cu)을 세척한 탄화규소 반도체 위에 직접 증착하여 전기적 성질을 조사 비교하였다. 이들 금속에 대한 오옴성 성질은 금속종류 뿐만 아니라 열처리조건에 대해서도 크게 좌우됨을 알 수 있었다. 열처리는 급속열처리 장치를 이용한 진공상태 및 환원 분위기에서 2-step 방법으로 시행하였다. 접합비 저항은 TLM 구조를 만들었으며 면저항$(R_s)$, 접촉저항$(R_c)$, 이동거리$(L_T)$, 패드간거리(d), 저항$(R_T)$ 값을 구하면 접합비저항$(\rho_c)$ 값을 구하여 알려진 계산식에 의해 추정하였다. 가장 양호한 결과는 Cu 금속에 의한 접촉 결과이었으며 접합비저항$(\rho_c)$은 $1.2\times10^{-6}{\Omega}cm^2$의 낮은 값을 얻을 수 있었다. 열처리는 진공보다 환원분위기에서 수행한 시편이 양호한 전기적 성질을 가짐을 알 수 있었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.73-77
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• 2002

Characteristics of Cu/Si/Cu ohmic contacts to n-type 4H-SiC were investigated systematically. The ohmic contacts were formed by rf sputtering of multi layer Cu/Si/Cu sputtered sequentially. The annealings were peformed With 2-Step using RTP in vacuum ambient. The specific contact resistivity($\rho$c), sheet resistance(Rs), contact resistance(Rc), transfer length(L$_{T}$) were calculated from resistance(R$_{T}$) versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. Best results were obtained for a sample annealed at vacuum as $\rho$c = 1.0x10$^{-6}$ $\Omega$$\textrm{cm}^2$, Rc = 2$\Omega$ and L$_{T}$ = 1${\mu}{\textrm}{m}$. The physical properties of contacts were examined using XRO and AES. The results showed that copper silicide was formed on SiC and Cu was migrated into SiC.o SiC.

• KIPS Transactions on Computer and Communication Systems
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• v.13 no.1
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• pp.21-30
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• 2024

As the self-driving car market continues to grow, the need for charging infrastructure is growing. However, in the case of a wireless charging system, stability issues are being raised because it requires a large amount of power compared with conventional wired charging. SAE J2954 is a standard for building autonomous vehicle wireless charging infrastructure, and the standard defines a communication method between a vehicle and a power transmission system. SAE J2954 recommends using physical media such as Wi-Fi, Bluetooth, and UWB as a wireless charging communication method for autonomous vehicles to enable communication between the vehicle and the charging pad. In particular, UWB is a suitable solution for indoor and outdoor charging environments because it exhibits robust communication capabilities in indoor environments and is not sensitive to interference. In this standard, the process for building a wireless power transmission system is divided into several stages from the start to the completion of charging. In this study, UWB technology is used as a means of fine alignment, a process in the wireless power transmission system. To determine the applicability to an actual autonomous vehicle wireless power transmission system, experiments were conducted based on distance, and the distance information was collected from UWB. To improve the accuracy of the distance data obtained from UWB, we propose a Single Model and Multi Model that apply machine learning and deep learning techniques to the collected data through a three-step preprocessing process.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.438-441
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• 2013

알려진바 한 해 우리나라에서 200여 건 이상의 차량 급발진으로 추청 되는 사고(Sudden Unintended Acceleration, SUA)가 발생하지만 지금까지 명확하게 급발진으로 추정되는 사고의 원인을 밝혀내지 못해 사고를 당한 운전자는 막대한 정신적, 물질적 피해를 보고 있다. 이에 차량의 급발진으로 추정되는 사고 시 차량의 상태 및 원인 파악을 위하여 차량 내 설치되는 OBD-II(On Board Diagnostics-II)와 운전자의 발쪽을 촬영하는 Foot Camera를 이용하여 통합 블랙박스 시스템을 구현하고자 한다. 지금까지의 블랙박스 시스템은 단순히 사고 시 영상을 촬영 저장하여 운전자에게 보여 주는 장치라면 현재 구현하려는 통합시스템은 블랙박스 자체에서 이동 통신을 통한 차량데이터 실시간 서버 전송 및 스마트 폰과 스마트 패드의 앱(App)으로 OBD-II와 메인서버와의 통신을 통해 사용자 차량의 현재 상태, 차량의 이상 유무, 소모품 교환 시기, 차량사고 시 영상 및 급발진 추정 시 차량상태, 위치, 이동거리, 운전자의 발쪽 영상 저장 및 재생 등 사용자가 필요로 하는 다양한 기능과 정보들을 블랙박스 하나로 통합하여 구현 할 것이다. 이 시스템이 개발되면 차량 관리에 서툰 여성 운전자들, 좀 더 체계적이고 손쉽게 내 차 정보를 원하는 운전자들과 전 세계 자동차 소비자들의 관심사인 급발진에 대한 사고 분석이 정확해 질 것으로 여겨진다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.29-33
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• 2003

Material and electrical properties of copper-based ohmic contacts on n-type 4H-SiC were investigated for the effects of the post-annealing and the metal covering conditions. The ohmic contacts were prepared by sequential sputtering of Cu and Si layers on SiC substrate. The post-annealing treatment was performed using RTP (rapid thermal process) in vacuum and reduction ambient. The specific contact resistivity ($p_{c}$), sheet resistance ($R_{s}$), contact resistance ($R_{c}$), transfer length ($L_{T}$), were calculated from resistance (RT) versus contact spacing (d) measurements obtained from TLM (transmission line method) structure. The best result of the specific contact resistivity was obtained for the sample annealed in the reduction ambient as $p_{c}= 1.0 \times 10^{-6}\Omega \textrm{cm}^2$. The material properties of the copper contacts were also examined by using XRD. The results showed that copper silicide was formed on SiC as a result of intermixing Cu and Si layer.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.10
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• pp.2359-2366
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• 2015

In accordance with development of many smart phone applications, the importance of keypad that can be used in smart phone has been increasing. In this paper, we design the Hangul smart phone keypad to type a Hangeul characters more efficiently by considering the characteristics of the Hangul characters based on the existing research on smart phones keypad. The proposed keypad in this paper, when we placed the letters on the keyboard, minimizes the travel distance by using the frequency of characters and the associated frequency between vowel and consonant. In addition, we define an assessment model for evaluating the performance of the keypad and verify efficiency of the proposed keypad. According to the result of the experiment, the proposed keypad is more efficient than other keypads.