• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.184-187
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• 2005

Forging process is one of the forming process and is used widely in automobile parts and manufacture industry. Especially the gears like spur gear, helical gear, bevel gear were produced by machine tool, but recently they have been manufactured by forging process. The goal of this study is to study forming process with data obtained by comparison between forward extrusion and upsetting simulation results and formability improvement by various heat treatment conditions. By analysis data of 3D FEM by upsetting and forward extrusion forming, the forming process of clutch gear develops using data based on 3D FEM analysis. Through tensile test using specimens by various heat treatment conditions, the optimal heat treatment condition is obtained by comparison the results of tensile test.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.11
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• pp.88-93
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• 2000

Recently the gear design focuses on the optimal design to extract the design factors from the vehicle transmission that is required to equip the powerful, speedy and silent characteristics. In this study, we had determined modules($m_n$) and face widths (b) to sustain strengths of contact and bending. The pressure angle ($\alpha$) and the helix angle ($\beta$) also had been obtained from the constraint of a contact ratio ($\varepsilon) on helical gears. Through the optimal design algorithm suggested in this study, the design factors were calculated on vehicle transmission gears and those determined factors were able to firm a suitability of the design.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.05a
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• pp.783-785
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• 2015

Automotive Semiconductor revenue grew 3.9% in 2013 to $26.7 billion, driven by strength in LED lighting, ASSPs and analog ICs. Renesas Electronics held onto the No.1 spot despite a revenue decline, while Freescale Semiconductor, NXP, Texas Instruments and Robert Bosch made strong gains. Global Semiconductor manufacturers are paying attention to the Korean auto market, which reflects the reality of the local auto industry. The local industry has a long way go in the automotive semiconductor sector, even though it has grown to become the six-largest in the world. The reason for global semiconductors companies' interest in the local market lies in the fact that are the use of semiconductors in cars is on the rise, since smart and eco-friendly cars are becoming popular.

• Journal of the Korea Convergence Society
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• v.9 no.10
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• pp.257-263
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• 2018

The purpose of this study is to develop an automatic inspection system for a part of the differential drive gear into the transmission. This technology will make using the microvision automatic test equipment and automatic test equipment microlaser. This is that the operator intends to make the defect rate 0 in the inspection stage of the product which has been carelessly processed. The equipment developed in this research project will be applied to many areas. Packaging companies, nut bolt processing company, precisely supplier for printing on top of the semiconductor, SMT, etc. The company wants to sell the vision inspection equipment for various applications. If the defective rate of 0 is achieved through this research project, it is also possible to secure a stable supply from the parent company, and to lay the foundations for exporting based on product reliability. When the automatic inspection system is applied to domestic automobile parts processing companies, the reliability of automobiles in Korea will be greatly increased.

• Tribology and Lubricants
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• v.33 no.1
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• pp.1-8
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• 2017

Drag torque reduction in a wet clutch pack is a key aspect of the design process of the dual clutch transmission (DCT) system. In order to reduce the drag torque caused by lubricant shear resistance, recently developed wet clutch pack systems of DCT, as well as automatic transmission and other four-wheel drive (4WD) couplings, frequently utilize wavy wet clutch pads. Therefore, wavy shape of friction pad are made on the groove patterns like waffle pattern for the reduction of drag torque. Additionally, the groove patterns are designed with larger channels at several locations on the friction pad to facilitate faster outflow of lubricant. However, channel performance is a function of the waviness of the friction pad at the location of the particular channel. This is because the discharge sectional area varies according to the waviness amplitude at the location of the particular channel. The higher location of the additional channel on the friction pad results in a larger cross-sectional area, which allows for a larger flow discharge rate. This results in reduction of the drag torque caused by the shear resistance of DCTF, because of marginal volume fraction of fluid (VOF) in the space between the friction pad and separator. This study computes the VOF in the space between the friction pad and separator, the hydrodynamic pressure developed, and the shear resistance of friction torque, by using CFD software (FLUENT). In addition, the study investigates the dependence of these parameters on the location and waviness amplitude of the channel pattern on the friction pad. The paper presents design guidelines on the proper location of high waviness amplitude on wavy friction pads.

• Tribology and Lubricants
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• v.33 no.2
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• pp.71-78
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• 2017

The drag torque in the wet clutch system of a dual clutch transmission system is investigated because it is relatively high, up to 10 of the total output torque of the engine, even when the clutch is in the disengagement state with zero torque transfer. Drag torque results from the shear resistance of the DCTF between the friction pad and separator plate. To reduce the drag torque for ensuring fuel economy, the groove pattern of the wet clutch friction pad is designed to have a high flow rate through the pattern groove. In this study, four types of groove patterns on the friction pad are designed. The volume fraction of the DCTF (VOF) and hydrodynamic pressure developments in the gap between the friction pad and separator plate are computed to correlate with the computation of the drag torque. From the computational results, it is found that a high VOF and hydrodynamics increase the drag torque resulting from the shear resistance of the DCTF. Therefore, a patterned groove design should be used for increasing the flow rate to have more air parts in the gap to reduce the drag torque. In this study, ANSYS FLUENT is used to solve the flow analysis.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.77-77
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• 2009

ELV(; End of Life Vehicles)를 비롯한 최근 환경 동향은 자동차 전장 모듈에 대하여 다양한 무연 솔더 적용을 요구하고 있다. 특히 자동차 엔진룸과 트랜스미션은 가동 중 고온 및 진동의 지속적인 영향을 받기 때문에 이와 유사한 환경에서의 신뢰성 연구가 필요한 시점이다. 이에 본 연구에서는 Sn3.5Ag, Sn0.7Cu, Sn5.0Sb 솔더 조성에 대하여 복합환경 조건하에서 접합부 신뢰성을 평가하였다. 복합환경을 구현하기 위하여 $-40{\sim}150^{\circ}C$ 범위의 온도 사이클과 랜덤 진동을 동시에 인가하였으며, 진동 가속도 3G, 진동주파수는 10~1000Hz 로 설정하여 자동차 환경을 충족하였다. 복합시험의 1 cycle 은 20 시간이며, 총 120 시간의 시험 동안 진동의 영향 및 진동과 고온이 동시에 작용하였을 경우의 영향에 대해 비교하였다. 테스트 모듈 제작을 위해 450 um 의 솔더볼이 적용되었으며, 각 조성의 솔더볼을 이용하여 BGA test chip 제작하였고, 제작된 BGA test chip 은 다시 daisy chain PCB 위에 실장 및 리플로우 공정을 통해 접합되었다. 테스트 동안 In-situ 로 저항의 변화를 관찰하여 파단의 유무를 판단하였고 전자주사현미경을 통해 파괴 기전을 평가하였다. 복합시험 시간에 따른 전단강도를 측정하였으며, 각 조성에 대하여 상이한 전단강도 변화를 관찰하였다. 계면 IMC 형상은 전단강도 변화에 영향을 주었으며, 특히 높은 온도가 IMC 성장을 촉진시켜 전단강도 감소에 영향을 주었다. 본 복합환경 시험 조건에서는 Sn0.7Cu 가 가장 안정적이었으며, 파단면을 관찰한 결과 연성파괴 모드가 관찰되었다.

• The Transactions of the Korea Information Processing Society
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• v.1 no.4
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• pp.469-478
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• 1994

In this paper, a high speed, high resolution information processing digital- analog converter was designed for high definition color graphic, digital image signal processing, HDTV. For high speed operation, matrix type current cell array, latch which is not use pipelined, and two dimensional structure decoder using transmission gate were designed. It is adopted to fast-conversion, low-power implementation and exhibited high performance at linearity and accuracy. To reduce silicon area and to maintain resolution, current cell array composed of weighted and non-weighted current cells. In this paper, deglitching current cell design for high accuracy, new switching algorithm assert to reduce switching error. It's This circuit dissipates 130W with a 5-V power supply, and operate above 100MHz with 10 bit resolution.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.66-71
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• 2016

For the manual transmission gearbox used in the automotive industry, gear meshing transmission error is the main source of noise known as gear whine, and radiated gear whine noise plays an important role in the whole gearbox. Therefore, in order to keep competitive in the automotive market, the NVH performance of transmission gearboxes is increasingly important for automotive manufacturers when a new product is developed. In this paper, in order to achieve an optimized tooth contact pattern, gear tooth modification is applied to make up for the deformation of the teeth owing to load. A five-speed MT gearbox is firstly modeled in RomaxDesign software and the prediction of transmission error under the loaded torques is studied and compared. From the simulation, the transmission error and maximum contact stress are also simulated and compared after tooth modification of the loaded torques. Finally, the simulation results are used to optimize the whole gearbox design and the final gearbox prototype is testified to obtain NVH performance in a semi-anechoic room.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.34-39
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• 2007

Serial links via backplane channels suffer from severe signal integrity problems which are normally caused by channel imperfections, such as flat loss, frequency-dependent loss, reflection, etc. Particularly, the frequency-dependent loss causes ISI(Inter-Symbol-Interference) at signal waveforms. Therefore, adaptive equalizing techniques have been exploited in many products to facilitate the ISI problem. In this paper, we present an analog adaptive equalizer circuit designed in a $0.18{\mu}m$ CMOS process. It achieves 10Gb/s data transmission through a long 34-inch backplane channel(or transmission line). The post-layout simulations demonstrate $8ps_{p-p}$ jitter with 10mW power dissipation. The core of the adaptive equalizer occupies the area of $0.56mm^2$.