Direct bonding of Si(100)/Si$_3$ N$_4$ ∥Si (100) wafers using fast linear annealing method
(선형열처리를 이용한 Si(100)/Si$_3$ N$_4$ ∥Si (100) 기판쌍의 직접접합)
-
- Korean Journal of Materials Research
- /
- v.11 no.5
- /
- pp.427-430
- /
- 2001