• Journal of the Korean Ceramic Society
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• v.47 no.6
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• pp.566-571
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• 2010

Dispersion behavior of the slurries consisted of bimodal-type AlN powders was examined in non-aqueous solvent system. Azotropic solvent system and copolymer acidic dispersant were applied to the slurries. Measurements of the sedimentation height and the viscosity of the each slurry, and the test of particle size distribution of the each powder sample were conducted as examinations for the dispersion behavior at the various dispersant contents. The bimodal-type particle size distribution was continued after addition of the dispersant and small particle portions were increased as the dispersant content increases. The density of the green sheet was also increased as the dispersant content increases and a green density of $2.114\;g/cm^3$ was obtained at the sample prepared from 2.4 wt% dispersant content. The increase of large particle portions resulted in the surface defects of the green sheets.

• Journal of Ocean Engineering and Technology
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• v.23 no.5
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• pp.32-38
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• 2009

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between $1850^{\circ}C$ and $2050^{\circ}C$ were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.19-24
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• 1999

The multilayer chip band pass filter for mobile communication is fabricated and designed. The size, insertion loss, center frequency and band width of multilayer chip filter are 4.5$\times$4.4$\times$1.8[mm], 3.0[dB] and 700[MHz]$\pm$15[MHz] respectively. The chip filter using $BiNbO_4$with CuO 0.06wt% +$V_2O_5$.lwt% was fabricated by screen printing with Ag electrode after tape casting. Insertion loss and center frequency of the fabricated chip filter are 2.58[dB] and 692.5$\pm$15[MHz] respectively. The center frequency was lower 7.5[MHz] than design result, but other characteristics of chip filter were similar to the ruts ultras of design result.

• Korean Journal of Materials Research
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• v.7 no.12
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• pp.1097-1104
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• 1997

인산형 연료전지(PAFC)용 전해질 매트릭스의 표면 거칠기를 감소시켜 분극저항을 줄이고 작업성을 향상시키기 위해 SiC whisker를 사용하여 일반적인 테이프 캐스팅법으로 제조된 매트릭스의 거친 표면을 평탄화 처리하였다. 구형 입자의 분무공정을 이용하여 표면 평탄화 처리(process l)하는 경우와 롤링을 이용하여 표면 평탄화 처리(process 2)하는 두가지 공정을시도하였으며, 두가지 공정 모두 기공율과 인산 함침도를 유지시키면서, 매트릭스의 표면 거칠기를 감소시키고 기공압, 가소성 및 인장강도를 향상시킬 수 있었다. 위와 같이 제조한 매트릭스로 연료전지를 구성하여 교류 임피던스 분석을 한 결과, 표면 평탄화 처리는 매트릭스 표면의 거칠기를 감소시킴으로써 전극과의 접촉시 계면에서의 분극 저항을 감소시켜 전지성능을 향상시키는 것으로 나타났다. process 2는 표면의 거칠기 감소뿐 아니라 표면에서의 인산함침도가 커서 가장 우수한 전지특성을 나타내었으며, process 1은 매트릭스 표면에 불규칙하게 존재하는 거대 기공을 완전히 제거하고 기공압을 크게 향상시킬 수 있기 때문에 대형의 매트릭스 제조를 가능하게 하였다.

• Journal of Ocean Engineering and Technology
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• v.27 no.2
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• pp.8-12
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• 2013

Four kinds of silicon nitride composites with tri-laminate structure were prepared by stacking tapes with aligned ${\beta}-Si_3N_4$ whisker seeds. The composites were fabricated using a modified tape casting method for enhanced alignment of the whisker seeds. The relative densities of all four samples reached 99% at room temperature. The three-point flexural strengths of the samples according to the stacking sequences were measured at both room temperature and 1723 K. The high temperature strength of sample WWW was $457{\pm}14$ MPa. The fracture of sample WWW occurred mainly along the grain boundary. The room temperature strengths of samples OOO, OWO, WOW, and WWW were $430{\pm}32$ MPa, $470{\pm}19$ MPa, $700{\pm}14$MPa, and $940{\pm}14$ MPa, respectively.

• Journal of the Korean Ceramic Society
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• v.43 no.12 s.295
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• pp.788-797
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• 2006

An anode-supported SOFC single cell having $5{\mu}m$ thin electrolyte was fabricated cost-effectively by tape casting, laminating, and co-filing of anode (NiO-YSZ), cathode (LSM-YSZ), and electrolyte (YSZ) components. The optimal slurry compositions of the green tapes for SOFC components were determined by an analysis of the mean diameter, the slurry viscosity, the tensile strength/strain of the green tapes, and their green microstructures. The single cells with a dense electrolyte and porous electrodes could be co-fired successfully at $1325\sim1350^{\circ}C$ by controlling the contents of pore former and the ratio of coarse YSZ and fine YSZ in the anode and the cathode. The single cell co-fired at $1350^{\circ}C$ showed $100.2mWcm^{-2}$ of maximum power density at $800^{\circ}C$ but it was impossible to apply it to operate at low temperature because of low performance and high ASR, which were attributed to formation of the secondary phases in the cathode and the interface between the electrolyte and the cathode.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.169-172
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• 2002

This study demonstrated the feasibility of using tape-casting followed by sintering as a low-cost alternative for coating glass-ceramic or glass film on a metal substrate. The process has been successfully used to fabricate a glass-on-stainless steel and a glass-ceramic-on-molybdenum electrostatic chuck(ESC) with the insulating layer thickness about $150{\mu}{\textrm}{m}$. Electrical resistivity data of the coaling were obtained between room temperature and 55$0^{\circ}C$; although the resistivity values dropped rapidly with increasing temperature in both coatings, the glass-ceramic still retained a high value of $10^{10}$ ohm-cm at $500^{\circ}C$. Clamping pressure measurements were done using a mechanical apparatus equipped with a load-cell at temperatures up to $350^{\circ}C$ and applied voltages up to 600V; the clamping behavior of all ESCs generally followed the voltage-squared curve as predicted by theory. Based on these results, we believe that we have a viable technology for manufacturing ESCs for use in reactive-ion etch systems.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.49-52
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• 2002

This study demonstrated the feasibility of tape casting method to fabricate soda borosilicate glass-coated stainless steel electrostatic chucks(ESC) for low temperature semiconductor processes. Glass coating on the stainless steel substrate was 125 $\mu\textrm{m}$ thick. The adhesion of glass coating was found to be excellent such that it was able to withstand temperature cycling to over $300^{\circ}C$ without cracking and delamination. The electrostatic clamping pressure generally followed the theoretical voltage-squared curve except at elevated temperatures and high applied voltages. The deviations at elevated temperatures and high applied voltages are due to increased leakage current as the electrical resistivity of glass coating drops.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.13-16
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• 2008

Solid oxide fuel cell(SOFC) is an electrochemical energy conversion system with high efficiency and low-emission of pollution. In order to reduce the operating temperature of SOFC system under $800^{\circ}C$, the thickness reduction of YSZ electrolyte to be as thin as possible, e.g., less than 10 ${\mu}m$ are considered with the microstructure control and optimum design of unit cell. Methods for reducing the thickness of YSZ electrolyte have been investigated in coin cell. Moreover, a large unit cell($8cm{\times}8cm$) for SOFC was fabricated using an anode-supported electrolyte assembly with a thinner electrolyte layer, which was prepared by a tape casting method with a co-sintering technique. we studied the design factors such as active layer, electrolyte thickness, cathode composition, etc,. by the coin type of unit cell ahead of the fabrication process of a large unit cell and also reviewed about the evaluation technique of a large size unit cell such as interconnect design, sealing materials and current collector and so forth. Electrochemical evaluations of the unit cells, including measurements such as power density and impedance, were performed and analyzed. Maximum power density and polarization impedance of coin cell were 0.34W/$cm^2$ and $0.45{\Omega}cm^2$ at $800^{\circ}C$, respectively. However, Maxium power density of a large unit cell($5cm{\times}5cm$) decreased to 0.21W/$cm^2$ at $800^{\circ}C$ due to the increase of ohmic resistance. However, It was found that the potential value of a large unit cell loaded by 0.22A/$cm^2$ showed 0.76V at 100hrs without the degradation of unit cell.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.181-181
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• 2007

PTCR 세라믹스를 적층형 부품으로 제조할 경우 소형화, 저 저항화 및 과전류 유입 시 빠른 응답특성을 갖는다는 장점을 가지고 있으며, 이러한 적층형 부품제조시에는 내부전극재가 부품소자의 물성에 중요한 영향을 미친다. 특히 우수한 옴성 접촉(Ohmic Contact)을 갖는 Zn, Fe, Sn, Ni 등의 적층 PTC용 전극재는 높은 산화특성으로 인해 재산화 과정에서의 비옴성 접촉(Non-ohmic contact)을 갖게 되어 PTC 특성을 저하시킬 우려가 있다. 따라서 본 연구에서는 적층형 PTCR 세라믹스의 내부전극재와 반도체 세라믹층의 동시소성거동 및 적층 PTCR 세라믹스의 전기적 특성을 평가하였다. 본 연구에 적용된 내부전극재로는 Ni 전극을 사용하였고, Ni 전극용 paste로는 무공제 paste, 반도체 세라믹공제 paste, $BaTiO_3$ 공제 paste의 3종 전극재가 이용되었다. 적층형 PTCR 세라믹스의 제조공정은 테이프 캐스팅(Tape casting), 내부전극인쇄, 적층 및 동시소성을 포함하는 적층화공정을 적용하였다. 각각의 전극 paste를 적용하여 제조된 chip은 미세구조관찰, I-V특성, R-T특성 등을 평가하여 내부전극내 세라믹공제의 영향을 고찰하였다.