• Proceedings of the Korea Information Processing Society Conference
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• 2007.11a
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• pp.1088-1091
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• 2007

RFID 기술의 상용화를 저해하는 한 요소인 태그 인식률 문제를 보완하기 위한 클리닝 모듈을 설계한다. 클리닝 모듈은 RFID 리더로부터 원본 데이터를 클리닝 모듈을 통해 애플리케이션에서 사용 가능한 수준의 정보로 가공한다. 클리닝 모듈의 성능을 확인하기 위해 태그의 논리적인 구역을 정하고 태그의 이동을 추적한다. 실험결과를 통해 클리닝 모듈 적용 전후를 비교하여 모듈의 성능을 평가한다.

• Journal of KIISE:Computer Systems and Theory
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• v.34 no.11
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• pp.599-609
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• 2007

Due to the restrictions of Flash memory such as overwrite limitation and write/erase operational unit differences, block cleaning is required in Flash memory based file systems and known as a key factor on the performance of file systems. In this paper, we identify three parameters, namely utilization, invalidity and uniformity, and analyze how the parameters affect the cost of block cleaning. The analysis show that as uniformity degrades, the cost of block cleaning increases drastically. To overcome this problem, we design a new modification-aware(MODA) page allocation scheme that strives to keep uniformity high by separating frequently-updating data from infrequently-updating data. Real implementation experiments conducted on an embedded system show that the MODA scheme can actually enhance uniformity of Flash memory, which consequently leads to reduce the cost of block cleaning with an average of 123%, compared to the traditional sequential allocation scheme that is used in YAFFS.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.575-582
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• 2011

A cleaning blade is an attachment installed in the toner cartridge of a laser printer for removing the residual toner from an organic photo-conductive drum. There have been many studies on the performance and life of the rubber blade. We focus on optimally designing the blade shape parameters to minimize the maximum stress of the blade while satisfying design constraints on the cleaning performance and part interference. The blade is optimally designed using a design of experiments, meta-models and an optimization algorithm implemented in PIAnO (process integration, automation, and optimization), a commercial PIDO (process integration and design optimization) tool. We integrate the CAE tools necessary for the structural analysis of the cleaning blade, automate the analysis procedure, and optimize the solution using PIAnO. We decreased the maximum stress by 32.6% in comparison with that of the initial design.

• Korean Journal of Heritage: History & Science
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• v.46 no.1
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• pp.228-237
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• 2013

Paper relics are affected by a number of complex physical, chemical, biological and artificial damaging factors due to the vulnerability of organic materials. Wet cleaning is a conservation treatment method for removing pollutants from paper artefacts. This study was carried out in order to analyse the effect of wet cleaning on Hanji (Traditional Korean paper made from mulberry trees) which is the main material used in Korean paper relics (historical paper documents). For this study, the color change and folding endurance of artificially degraded paper was analysed before and after immersion wet cleaning. The result showed that washing each twice in 30 minutes is the most appropriate method for obtaining cleaning efficiency and material stability.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.423.1-423.1
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• 2014

본 발표에서는 실리콘 이종접합 태양전지에서 중요한 실리콘 웨이퍼 표면/계면 제어에 대하여 발표한다. 다시 말하여, 실리콘 웨이퍼 기판 세정공정 변화에 따른 실리콘 웨이퍼 표면의 소수전하수명(minority carrier lifetime, MCLT) 및 태양전지 소자특성 변화에 대하여 연구하였다. 구체적으로, 실리콘 웨이퍼 클리닝 최초단계로써 KOH damage etching 공정을 도입할 때, 이후 클리닝 공정을 통일하여 적용한 웨이퍼 표면의 MCLT 및 상기 웨이퍼를 이용하여 플라즈마 화학기상증착법(PECVD)을 통하여 제작한 태양전지 소자 효율은 KOH etching 시간이 10분일 때 최대치에 도달한 후 감소하였다. 또한, RCA1, RCA2, Piranha로 이루어진 웨이퍼 클리닝 단계의 사이에, 또는 맨 마지막에 묽힌 불산용액(DHF, 5 %) 처리를 하여 표면 산화막 제거 및 수소종단처리를 하여 기판의 passivation 특성을 향상시키고자 할 때, 불산용액 처리 순서에 따른 웨이퍼 표면의 MCLT 및 태양전지 소자 효율을 비교하였다. 그 결과, 묽은불산용액을 클리닝 단계 사이에 적용하였을 때의 MCLT 및 태양전지 소자의 특성이 더 우수하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.193-194
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• 2012

레이저클리닝이란 레이저빔을 표면에 조사하여 오염 물질을 제거하는 공정 기술로서 건식 세정방식이다. 본 연구에서는 레이저클리닝을 금속문화재에 코팅된 아크릴수지에 적용하여 제거 가능성 및 표면 특성을 조사하였다. 실험 결과 소지금속에 손상을 주지 않으면서 아크릴수지를 제거하는 레이저 조건을 확인하였으나 청동유물에 적용한 결과 아크릴수지와 파티나 층이 함께 제거되는 레이저클리닝의 문제점도 확인할 수 있었다. 앞으로 다양한 레이저 시스템 및 파장별 실험을 진행하여 청동 파티나층의 제거 가능성을 검토하면 레이저 클리닝을 청동 문화재에 적용하는데 도움이 될 것으로 본다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.39-47
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• 2003

Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12 $W/cm^2$, increasing of RF power density changed the morphology of polyimide surfaces from round dig to sharp shape, and surface roughness increased by anisotropic etching. The intermixed layer-like interfaces between Cr and polyimide were observed in the RF bias sputtered specimens. This interface seems to be formed due to the RF cleaning effect; the polyimide surface was RF plasma cleaned while RF power was increased to the setting point before Cr deposition.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.77-85
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• 2004

To evaluate the effect of plasma cleaning on the soldering reliability the plasma cleaning using Ar-10vol%$H_2$ gas was applied on a UBM(Under Bump Metallization). The UBM consisted of Au/ Cu/ Ni/ Al layers which were deposited on a Si-wafer with 20 nm/ 4 $\mu\textrm{m}$/ 4 $\mu\textrm{m}$/ 0.4 $\mu\textrm{m}$ thickness respectively. Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-37%Pb solder balls sized of 500 $\mu\textrm{m}$ in diameter were used. Solder balls on the UBM were plasma reflowed under Ar-10%$H_2$ plasma (with or without plasma cleaning). They were compared with air reflowed solder balls with flux. The spreading ratios of plasma reflowed solder with plasma cleaning was 20-40% higher than that of plasma reflowed solder without plasma cleaning. The shear strength of plasma reflowed solder with plasma cleaning was about 58-65MPa. It showed 60-80% higher than that of plasma reflowed solder without plasma cleaning and 15-35% higher than that of air reflowed solder. Thus it was believed that plasma cleaning for the UBM using Ar-10vol%$H_2$ gas was considerably effective for the improvement of the strength of solder ball.

• Journal of Korea Multimedia Society
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• v.13 no.3
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• pp.400-409
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• 2010

This paper presents a position error recognition system when the wafer is mounted in cleaning equipment among the wafer manufacturing processes. The proposed system is to enhance the performance in cost and reliability by preventing the wafer cleaning system from damaging by alerting it when it is put in correct position. The key algorithms are the calibration method between image acquired from camera and physical wafer, a infrared lighting and the design of the filter, and the extraction of wafer boundary and the position error recognition resulting from generation of circle based on least square method. The system is to install in-line process using high reliable and high accurate position recognition. The experimental results show that the performance is good in detecting errors within tolerance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.163-170
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• 2016

Regulations for the exhaust gas of diesel vehicles are being strengthened every year. Recently, diesel emission regulations for HC, CO, NOx, and particulate matter (PM) have been subject to very strict standards. In the future, the regulation of PM is expected to become stricter. Accordingly, diesel particulate filters (DPFs) have been applied to most diesel vehicles for PM reduction. With increasing engine mileage, ash and soot from the engine exhaust gas accumulate inside the DPF. This accumulation can damage the DPF or degrade engine performance. Therefore, efficient cleaning of the DPF is critical for the maintenance of the engine. If the DPF is well managed through regular cleaning, it can improve the power and fuel economy of the engine and reduce maintenance costs. Therefore, this study was performed to develop a high-efficiency cleaning method for DPFs and an apparatus that can more effectively clean out the accumulated ash and soot.