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Wafer Position Recognition System of Cleaning Equipment  

Lee, Jung-Woo (동서대학교 영상콘텐츠 학과)
Lee, Byung-Gook (동서대학교 컴퓨터정보공학부)
Lee, Joon-Jae (계명대학교 게임모바일컨텐츠학과)
Publication Information
Journal of Korea Multimedia Society / v.13, no.3, 2010 , pp. 400-409 More about this Journal
Abstract
This paper presents a position error recognition system when the wafer is mounted in cleaning equipment among the wafer manufacturing processes. The proposed system is to enhance the performance in cost and reliability by preventing the wafer cleaning system from damaging by alerting it when it is put in correct position. The key algorithms are the calibration method between image acquired from camera and physical wafer, a infrared lighting and the design of the filter, and the extraction of wafer boundary and the position error recognition resulting from generation of circle based on least square method. The system is to install in-line process using high reliable and high accurate position recognition. The experimental results show that the performance is good in detecting errors within tolerance.
Keywords
Wafer recognition; Image processing; Camera calibration; Computer vision;
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  • Reference
1 Rafael C. Gonzalez, Richard E. Woods, Digital Image Processing, 2nd Edition, Prentice Hall, 2002.
2 I. D. Coope, "Circle fitting by linear and nonlinear least squares," Journal of Optimization Theory and Applications, Vol.76, No.2, pp.381-388, 1993.   DOI
3 F. H. Y. Chan, F. K. Lam and H. Zhu, "Adaptive thresholding by variation method," IEEE Transaction on Image Processing, Vol.2, No.3 pp. 168-147, Mar.
4 Tianhe Yu, Qiuming Li, and Jingmin Dai, "New enhancement of infrared image based on human visual system," Chinese Optics Letters, Vol.7, No.3, pp. 206-209, 2009.   DOI   ScienceOn
5 Z. Zhang, "A flexible new technique for camera calibration," IEEE Transactions on Pattern Analysis and Machine Intelligence, Vol.22, No.11, pp. 1330-1334, 2000.   DOI   ScienceOn
6 R. Sukthankar, R. Stockton and M. Mullin "Smarter presentation : Exploiting homography in camera- projector system," Proceedings of Eighth IEEE International Conference on Computer Vision(ICCV), Vol.1, pp. 247-253, 2001.
7 G. Leach, "Improving worst-case optimal Delaunay triangulation algorithms," Proceedings of the 4th Canadian Conference on Computational Geometry, pp. 340-346, June 1992.
8 J. Leavey and P.J.S. Mangat, "Mask and wafer inspection and cleaning for proximity x-ray lithography," Proc. SPIE Vol.3331, pp.179-188, 1998.
9 R. K. Nurani, R. Akella, A. J. Strojwas, R.Wallace, M. G. McIntyre, J. Shields, and I. Emami, "Development of an optimal sampling strategy for wafer in spection," International Symposium on Semiconductor Manufacturing, pp. 143-146, 1994.
10 G. Ducotey, A. Couvrat, V. Audran, D. Pepper, and L.Couturier, "In-line methodology for defectivity analysis from dark field wafer in spection to defect root cause analysis using FIB cut," IEEE Advanced Semiconductor Manufacturing Conference(ASMC), pp. 138-141, 2008.