• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.101-105
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• 1990

The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.96-100
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• 1990

The cordierite ($2MgO,2Al_{2}O_{3},5SiO_{2}$) is of great interest for packaging substrates of multilayer IC. The Cu layer was fabricated on the cordierite substrate by the screen printing method and the adhesion properties of the interfaces at the different cosintering conditions were studied. When cosinted in the $Ar+H_{2}O$atmosphere good adhesion was obtained and the heating was found out to be an important factor for the adhesion.

• Electrical & Electronic Materials
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• v.7 no.1
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• pp.1-6
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• 1994

Cordierite based glass ceramics has become an electronic substrate material for electronic circuits and the use of whickers for improving strength and toughness is evident. Pure cordierite containing 15 vol.% silicon nitride were sintered by hot-prossing and it has above 99% density. Especially, it is assumed that toughening increasing at the more high sintering temperature relevants to the glass phase increasing, as showned in the roughness of the fracture surfaces. It was directionally dependent of whisker drirection during processing.

• Electrical & Electronic Materials
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• v.5 no.2
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• pp.182-188
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• 1992

코디에라이트 그라스 세라믹은 다충 IC 기관과 IC 팩키지용 그라스 세라믹의 재료로 크게 각광을 받고 있다. 보강용 휘스커량과 열처리 온도는 시료의 경도와 이성에 직접적인 영향을 미치며 경도와 인성은 휘스커량과 열처리 온도에 따라 증가하였다. 약 15 vol.%의 휘스커를 포함한 시료를 950.deg.C로 열처리 하였을 때에 경도나 인성 같은 기계적 특성이 가장 좋았다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.8
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• pp.1250-1254
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• 1990

The cordierite (MgO, SiO2, Al2O3) is of great interest for microelectronic packaging of integrated circuits. Its main advantages are low dielectric constant and low thermal expansion. The cordierite precursor is obtained by sol-gel synthesis using organic and inorganic compounds. The obtained cordierite precursor is an amorphous state at about 900\ulcorner. Green and fired cordierite samples were studied by SEM. Microanalysis X and TEM for microscopic properties. The fired cordierite shows forte diminution of Mg in comparison with its value at volume and the deficit of Mg compensates by sugmentation of Al and Si \ulcornercordierite and \ulcornercordierite are present near the surface (< 100) and small quantities of magnesium aluminate (MgAl2O4)is presented spinnel phase.

• Journal of the Korean Ceramic Society
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• v.27 no.3
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• pp.345-354
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• 1990

The densification behaviro and resulting properties of cordierite-aluminium titanate composites containing 5 to 40wt.% aluminium titanate were investigated. Compared with cordierite monolithics a substantial increase of sintering temperature range for composites was observed, which was due to the formation of cordierite and glass phase at relatively low temperatures. The bending strength of composites showed its maximum at 30wt.% aluminium titanate content, which was about 50% increase relative to the cordierite monolithics, then decreased by a small amount at 40wt.% aluminium titanate content. The decrease was explained by the increase of microcracks whose presence was confirmed by the hysteresis of thermal expansion curve of composites. However, the microcracks formed was not severe enough to produce a significant decrease in strength, which was also evidenced by the continuous increase of thermal expansion coefficient up to 40wt.% aluminium titanate content.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.1
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• pp.27-32
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• 1988

Electron Spectroscopy for Chemical Analysis(ESCA) allowes the determination of the elemental composition and the bonding state of the surface atomes in the interface between two materials. In the binding energies of ESCA spectrum, there are zero error, voltage scaling error and random error. Accurate analysis of the intensity energy response functions and accurate calibration of the energy scale are essential to use X-ray photoelectron spectron meter. At the results of the calibration of the ESCA spectra in the copper and cordierite (Mg2Al4Si5kO18) interfaces, the errors relative to the copper are -3.03 eV for the zero error -z,-197 ppm for the voltage scaling error -V and 6.9 meV for the random error -R. The method of the calibration is able to apply for the binding energy calibration of the another ESCA spectra.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.11a
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• pp.97-101
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• 1992

Cordierite glass ceramic has become an electronic substrate material for electronic circuits and the use of whiskers for improving strength and toughness is evident. Green sheets of mixtures containing 15% silicon nitride were sintered to greater than 99 % density. The microstructure was analysed using optical microscopy, scanning electron microscopy (SEM), and X-ray diffraction (XRD). The toughness and hardness were improved with increasing the whisker vol. % and sintering temperature. Especially, it is assumed that toughening increasing at the more high sintering temperature relevants to the glass phase increasing, as showned in the roughness of the fracture surfaces. It was directionally dependent of whisker direction during processing.

• Proceedings of the KIEE Conference
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• 1990.07a
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• pp.211-214
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• 1990

The cordierite(2 MgO, $2Al_2O_3$, $5SiO_2$) is of great interest for microelectronic substrate of multilayer intergrated circuits. The metal used in this study was copper, and metal layer is fabricatedon the cordierite substrate by the screen printing method. We studied the adhesion properties of the interfaces due to the different cosintering conditions. When cosintering in the $Ar+H_2O$ gas, the adhesion is very good. Specially heating rate is very important factor for the adhesion.

• Journal of the Korea Concrete Institute
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• v.16 no.3 s.81
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• pp.383-390
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• 2004

This study has focused on the possibility for recycling tailings from the Sangdong tungsten mine as admixture for concrete. The XRD(X-ray diffraction analysis) and PSA(Particle size analysis) were performed to find mineralogical characteristics. As a result of XRD analysis, the tailings from the Sangdong tungsten fine were composed of quartz, chlorite, anorthite and cordierite etc. As a result of KSLT for cement mortar mixed with tailings from the Sangdong tungsten mine, most of heavy metals were determined as below the guide line for waste material. In addition, the setting time and compressive strength of cement mortar mixed with tailings from the Sangdong tungsten mine were investigated. It was indicated that the initial and final set were retarded according to increasing replacement of tailings from the Sangdong tungsten mine. The compressive strength of mortar was decreased with increasing replacement of failings from the Sangdong tungsten mine.