Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Adhesion of corddierite-copper

코디에라이트-구리 접합력

  • Lim, N.H. (Department Electric of Engineering Chounbuk Unv.) ;
  • Yu, S.T. (Department Electric of Engineering Chounbuk Unv.) ;
  • Jang, M.H. (Department Electric of Engineering Chounbuk Unv.) ;
  • Park, S.J. (Department Electric of Engineering Chounbuk Unv.) ;
  • Han, B.S. (Department Electric of Engineering Chounbuk Unv.)
  • 임남희 (전북대학교 공과대학 전기공학과 대학원) ;
  • 유성태 (전북대학교 공과대학 전기공학과 대학원) ;
  • 장미혜 (전북대학교 공과대학 전기공학과 대학원) ;
  • 박성진 (전북대학교 공과대학 전기공학과 대학원) ;
  • 한병성 (전북대학교 공과대학 전기공학과)
  • Published : 1990.07.05
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Abstract

The cordierite(2 MgO, $2Al_2O_3$, $5SiO_2$) is of great interest for microelectronic substrate of multilayer intergrated circuits. The metal used in this study was copper, and metal layer is fabricatedon the cordierite substrate by the screen printing method. We studied the adhesion properties of the interfaces due to the different cosintering conditions. When cosintering in the $Ar+H_2O$ gas, the adhesion is very good. Specially heating rate is very important factor for the adhesion.

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