• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.9
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• pp.901-905
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• 2012

We present an electroporation and viability monitoring chip for lung cancer cells in a single channel with multiple electric field zones. Previous electroporation chips utilized multiple microchannels or electrodes to form multiple electric fields, thus resulting in complex structures. However, the present chip can generate multiple electric fields in a single stepwise microchannel between a pair of electrodes, thus achieving the analysis of both cell electroporation and viability with a simple structure. We demonstrate that the electric field of 0.4 kV/cm results in a maximum percentage of $51.4{\pm}3.0%$ and $26.6{\pm}0.7%$ of viable and electroporated human lung cancer cells, H23 and A549, respectively. The present chip has potential for use in integrated cell chips for transfection studies.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.35-45
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• 2002

The stresses of the underfill/chip interface due to thermal loading was studied using the finite element method. At first, the effective properties of underfill for several volume fractions of silica particles were calculated by Mori-Tanaka method for three different material sets, and the parameters of singularity for the bimaterial edge and the bimaterial wedge were calculated. Consequently, the stresses at the underfill/chip interface with volume fraction of silica particles were investigated. Five different geometric models of flip-chip assembly involving two kinds of bimaterial strips and three kinds of three-layer models were considered under the assumption that the underfill is homogeneous. It was assumed that all components of the flip-chip assembly were linear elastic and isotropic, and their properties were temperature independent. The analysis was conducted in the context of the uncoupled plane thermo-elasticity under a plane strain assumption.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.925-926
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• 2008

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.726-733
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• 1989

Conduction heat transfer in heat spreaders with concentrated heat sources is analyzed by finite element method calculation and the results are compared to analytical solutions for simplified cases. The local temperature rise is dependent on the heat flux, thermal conductivity of the spreader material, and the contact size of the heat source. The effect of the adjacency of other heat sources is also examined.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.11
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• pp.55-62
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• 2000

The poor machinability material such as austenite stainless steel(STS304) is emphasized on the wide use of HSSE for the tapping operation. The difficulty can be entirely to tapping torque due to chip formation through the hole of tap. The object of this study is to investigate tap geometry affecting the tapping torque from a practical point of view. The study shows that the optima tapping torque is affected by the tap geometry and cutting condition for STS304.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.8
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• pp.139-145
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• 1996

Tapping is one of the most widely used machining operations. There are several methodes of producing external screw threads, e.g. turning, milling with single or multiple cutter, rolling, and grinding, but the methods available for cutting enternal threads are less numerous, and for threads in small holes, tapping is employed almost exclusively. In this study, the tap with the various geometry has been developed in order to tap special workmaterial at considerably higher cutting speed than that of the conventional HSS tap. The experimental tests are run with various cutting speed by using a piezo type tool dynamometer to measure tapping torque. Tapping torque is affected by the design of the tap, which seems to be due to internal friction and shearing of the metal. It is clarified that the process of chip formation strongly depends on rake angle, relief angle, angle of twist.

• Journal of Korean Tunnelling and Underground Space Association
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• v.21 no.1
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• pp.127-136
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• 2019

Tunnel construction by TBMs should be supported by the performance of a screw conveyor in order to obtain the optimum penetration rate, so studies related to the screw conveyor performance have been being conducted. Compared to the study on the performance of the screw conveyor for the soil, however, the research on the performance of the screw conveyor for the rock is insufficient. Considering the domestic tunnel sites with more rock layers than soil layers, simulation of discharge of 6 types of rock chips by the screw conveyor was conducted using DEM. Regardless of the shape and volume of the rock chips, the discharge rates of the rock chips by the parallel placed screw conveyor at a speed of 10 RPM in the same rock mass were about 20% (standard deviation: 1.3%) of the maximum volume of discharge rate by the screw conveyor. It is expected that this study can be used as a reference material for screw conveyor design and operation in TBM excavations in rock masses.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.27-31
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• 2015

Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.264-269
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• 2000

Nickel-based heat resisting alloys are commonly used for high temperature applications such as in aircraft engines and gas turbines. In this paper, the machinability of Nickel-based heat resisting alloy was investigated with respect to the wear and the chip formation by tool type and cutting condition. Relationship between three types of tool and chip formation was experimentally investigated. Among the three types of tool tested, coated tools(CVD, PVD) are available for the difficult-to-cut-materials such as Nickel-based heat resisting alloy and etc..