• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.18-26
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• 2001

In this paper, the resonant characteristics and modes of the film bulk acoustic wave resonator (FBAR) used in 1~2 GHz frequency region are analyzed by it's input impedance which was calculated by three dimensional finite element method formulated as eigenvalue problem using electro-mechanical wave equation and boundary condition. It was extracted that the resonant and the spurious characteristics considering the effects of electrode area and shape variation and unsymmetry of upper and lower electrode. Those effects couldn't be analyzed by on dimensional analysis, e.g. Mason equivalent model. The simulation result was confirmed by comparing with the simulation data from Mason model analysis and the measured data of the ZnO FBAR fabricated using micro-machining technique. Also, through the simulation of the area variations of FBAR, it was obtained that the optimum ratio of length and thickness is 20:1 and the minimum ratio is 5:1 to operate thickness vibration mode.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.8
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• pp.967-975
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• 2012

This paper presents a method to measure reflection coefficients of microwave devices or antennas based on time domain analysis with sampling oscilloscopes. The reflection coefficients were extracted by the Fourier transformation of echo pulses from devices with respect to the 20 GHz incident pulse signals. The three-error terms, which are commonly used for the correction of a microwave network, were determined using a 3.5 mm calibration kit. In addition, a modified error-correction model associated with a directional coupler for reflection coefficient measurements is introduced. The results were compared with those of measured with a commercial vector network analyzer.

• Journal of the Korea Institute of Military Science and Technology
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• v.27 no.3
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• pp.311-318
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• 2024

In this paper, a design for a radio frequency(RF) and infrared(IR) absorber with metasurfaces is discussed in microwave frequency bands. The RF absorber includes double layers of metasurfaces to operate in S- and X-bands. Effects of sheet resistance of the metasurfaces and thicknesses of dielectric supporting layers on reflection responses are investigated. An IR stealth layer incorporates an array of conductive grids with slits to reflect IR signals but to transmit RF signals and visible rays. Periodicity of the grids and slits is studied for transmission responses in the X-band and a surface area ratio. Reflection responses of the RF/IR multispectral absorber are found to be lower than -10 dB and -16 dB in the S- and X-bands, respectively, from full-wave simulation. Finally, the RF/IR multispectral absorber is fabricated and its reflection responses are measured to verify designed performance.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.1
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• pp.89-93
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• 2020

In this paper, Ku-band Receiver for compact doppler radar has been designed and fabricated. It composed of MWR(Microwave Receiver) and IFR(Intermediate Frequency Receiver) which have 5 receive path. We applied limiter circuit to protect MWR from Tx leakage power and maximum 2 W. IFR can change the Rx path to broad band or narrow band by MSC(Mode Selection Switch). It is observed that fabricated receiver performs 68 dB gain and 3.7 dB noise figure, 93 ns limiter recovery time. Proposed Ku-band receiver is expected to apply for Ku-band compact doppler radar.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.108-113
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• 1999

For cylindrical shells, the closed-form solutions are confined to the specific boundary and/or loading conditions. Though the finite element method is certainly a powerful solution approach for the structural dynamics problems, it has been well known to provide the solution reliable only in the low frequency region due to the inherent high sensitivities of structual and numerical modeling errors. Instead, the spectral element method has been proved to provide accurate dynamic characteristics of a structure even at the ultrasonic frequency region. Since the wave characteristic of a cylindrical shell becomes identical to that fo a flat plate as the frequency increases, an equivalent plate model (EPM) representing the high-frequency dynamic characteristics of the cylindrical shell is introduced herein. The EPM-based spectral element analysis solutions are compared with the known analytical solutions for the cylindrical shells to confirm the validity of the present modeling approach.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.23-30
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• 1998

The use of microstrip is very common for various passive microwave devices because of the rather simple and planar structure. However, many microstrip devices require fairly large surface areas, which results in real estate problems of finite substrates. In this paper, we proposed a perforated microstrip with longitudinal slow-wave effect and characterized experimentally and theoretically. The impedance matching to the reference impedance(50 $\Omega$) and the quality factor are greatly improved compared to the conventional slow-wave structure with modulated strip. Because of the structural simplicity, it can be easily applied to miniaturize many microstrip devices.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.10
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• pp.1175-1180
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• 2014

In this paper, the open ring type DGS(Defected Ground Structure) resonator, applicable to MMIC(Monolithic Microwave Integrated Circuit), is proposed to improve phase noise characteristics of RF oscillator. This resonator is planar type, therefore, it easy to design miniaturrized., and takes relatively high Q value. Modeling the equivalent parameter of resonator is needed, when designing the RF oscillator with resonator. The mathematical method to solve the equivalent parameter of the resonator from the measured results of resonator is introduced in this paper. To verify the method, DGS resonator with 5.8 GHz center frequency is fabricated, for measuring characteristics and calculating the equivalent parameter. The result from this process is compared with the data of the ADS simulation, and as a result both were identical.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.31-31
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• 2008

고주파 잡음 발생과 고집적화 문제 해결을 위해 고용량 디커플링 캐패시터를 기판에 내장하는 연구가 활발히 진행되고 있다. 본 연구에서는 초고주파 환경에서 고용량 기판 내장형 디커플링 캐패시터로의 응용을 위해 $BaTiO_3$박막을 에어로졸 데포지션 법을 이용하여 12~0.2 ${\mu}m$의 두께로 제조하였고 그 유전특성을 조사하였다. 그결과, 1 MHz에서 permittivity가 70, loss tangent은 3% 이하였으며, capacitance density는 $1{\mu}m$의 두께에서 59 nF/$cm^2$이었다. 하지만, 박막의 두께가 $1{\mu}m$ 이하에서는 XRD를 통해 결정성이 확인 되었음에도 큰 누설전류로 인해 유전특성을 확인할 수 없었다. 이 누설전류의 발생 원인을 조사하기 위해 $BaTiO_3$박막의 표면의 미세구조를 SEM으로 관찰한 결과 여러 결함들이 확인되었으며, 또한 전극 직경의 크기를 1.5 mm에서 0.33 mm로 작게 변화시킴으로서 그 유전특성을 조사하여 박막의 불균일성과 박막화의 가능성을 확인하였다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.4
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• pp.31-36
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• 1984

Various efforts have been dedicated to obtain the negative impedances in microwave frequencies with semiconductor devices by many scientists for f: some passed decades, and as a result, many solid state microwave devices have been developed. But they all have much less maximum power ratings with respect to the vaccum tubes. In this paper, a MOSFET is proposed and studied, which have a periodic structure of multigates on the semiconductor via insulator. The hish electric field in the channel induces a voltage distribution on the gates by electrostatic coupling, and the polarization so induced between the gates is able to give a space modulation of the velocity of carriers or the current density in the channel, and as a natural consequence, a microwave amplifier with higher power ratings can be expected.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.1-6
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• 1998

The dielectric effects of plastic packages on GaAs($\varepsilon$$_{r}$=13) MMIC microstrip characteristics are analyzed using the spectral domain method (SDM). As being packaged by typical FR-4 composites ($\varepsilon$$_{r}$=14.2) for PCB substrates and plastic packages, the characteristic impedance is reduced by about 6 %, but the effective dielectric constant is increased by 13 % from those of bare microstrip, respectively. The parasitic effects of the packaging materials can greatly degrade the performance of the packaged MMIC. We also calculated the optimum microstrip width, which maintains the 50 $\Omega$ matching condition after plastic packaging. These calculated results can be used to optimize the plastic packages, and extend the application ranges for low cost MMIC production.n.