• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.4
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• pp.162-166
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• 2017

Thermoelectric compounds of $Zn_{1-x}Ag_xSb$ with x = 0~0.2 were prepared by vacuum melting and quenching process and their crystal phases and thermoelectric properties were examined. It was found that free metallic Sb phases were formed in the compound with x = 0.05, leading to increasing the electrical conductivities. The power factors were significantly affected by the electrical conductivity rather than Seebeck coefficient. When x > 0.05, the peak intensities of $Ag_3Sb$ phases in XRD patterns were increased and those of free Sb phases were weakened. These changes of second phases resulted in decreasing the electrical conductivities and the power factors and became more obvious in the compound with x = 0.2.

• Korean Chemical Engineering Research
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• v.43 no.5
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• pp.566-570
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• 2005

The study on the hydrogenation and isomerization of unsaturated bicyclic hydrcarbon compounds using methylcyclopentadiene dimer (MCPD) was carried out. Exo compound was prepared through isomerization reaction after two hydrogenation reaction steps. In the first hydrogenation reaction which needs one mole of hydrogen, the formation rate of monomer was increased as dimer was decomposed at reaction temperature above $100^{\circ}C$. At first hydrogenation, DHDMCPD [dihydrodi(methylcyclopentadiene)] was formed and second hydrogenation was proceeded to produce THDMCPD [tetrahydrodi(methylcyclopentadiene)], the ratio of exo to endo THDMCPD was varied by the control of 2nd hydrogenation temperature. To improve the process, continuous 1st and 2nd hydrogenation conditions were established by using the 2nd stage heat controllable reactor. Also, catalytic activities were compared by the use of halogenized aluminum, metal halides and solid acids catalysts on the isomerization reaction from endo to exo THDMCPD.

• Korean Chemical Engineering Research
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• v.43 no.5
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• pp.588-594
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• 2005

We have investigated Y zeolite and activated carbon for an adsorptive desulfurization of diesel. In batch experiments, cation ($Cu^{2+}$, $Ni^{2+}$) exchanged Y zeolites showed high equilibrium adsorption capacity for sulfur compounds in model diesel, which contained BT, DBT and 4,6-DMDBT of each 50 ppmw in n-octane. But the cation exchanged Y zeolites lost its capacity in commercial diesel (186 ppmw). On the other hand, activated carbon showed reasonable adsorption capacity for sulfur compounds in both model and commercial diesel. The adsorption capacity of sulfur on Ni-Y zeolite was decreased with the increase of benzene concentration in model diesel but the sorption capacity on activated carbon was insensitive to aromatic concentration. In breakthrough test, activated carbon of 1 g could treat 15 ml of commercial diesel with 186 ppmw sulfur. Toluene showed good solvent for regenerating activated carbon among several solvents.

• Journal of the Korean Electrochemical Society
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• v.10 no.2
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• pp.94-103
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• 2007

The transition of interconnection metal from aluminum alloy to copper has been introduced to meet the requirements of high speed, ultra-large scale integration, and high reliability of the semiconductor device. Since copper, which has low electrical resistivity and high resistance to degradation, has different electrical and material characteristics compared to aluminum alloy, new related materials and processes are needed to successfully fabricate the copper interconnection. In this review, some important factors of multilevel copper damascene process have been surveyed such as diffusion barrier, seed layer, organic additives for bottom-up electro/electroless deposition, chemical mechanical polishing, and capping layer to introduce the related issues and recent research trends on them.

• Proceedings of the KSR Conference
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• 2000.11a
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• pp.535-542
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• 2000

Pure copper, Cu-1.1wt%Cd and ACSR(Aluminum Conductor Steel Reinforced) have been used as Catenary Materials in Electric Railway System. Since these materials may have chance to be exposed to the corrosive environments like polluted air, acid rain and sea water, it is important not only to investigate the corrosion characteristics but also to measure corrosion rates in various corrosive environments. In order to examine corrosion characteristics according to the dissolved oxygen content, pH, chloride ion concentration ion, and the addition of Cd to Cu, a series of tests such as potentiodynamic polarization. a.c impedance spectroscopy and galvanic corrosion tests were carried out in these materials. Results showed that the addition of Cd to Cu and chloride ion in the solution have an adverse effect on the resistance to corrosion. Additionally, Galvanic currents between Al and steel wires of ACSR were confirmed by using ZRA(zero resistance ammeter) method.

• Applied Chemistry for Engineering
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• v.5 no.3
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• pp.419-424
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• 1994

An oil stain on the steel induced by metal working oil was studied on the six kinds of fat and oil compounds(rapeseed oil, oleic acid, methyl oleate, oleyl alcohol, lauryl amino, and lanolin) by MIL-C-22235A test. The samples used for the printing on the oil stain plates were prepared by the addition of fat and oil compounds(10wt% ) and antioxidants(B. H. T, B. T, T. C. P; 0.5wt%) to base oil(spindle oil; 1.5wt% of sulfur). An analysis based on the experimental data indicated that B.T was more effective than B. H. T and T. C. P as antioxidant for inhibiting oil stains. And acid values exerted a bad influence upon the preventation of oil stains. As expected by the chemical structure of fat and oil compound, oleic acid that could react with iron ions produced more stains on the steel pannel.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.75-75
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• 2010

3D 패키징 기술은 전기소자의 소형화, 고용량화, 저전력화, 높은 신뢰성등의 요구와 함께 그 중요성이 대두대고 있다. 이러한 3D 패키징의 연결방법은 와이어 본딩 또는 플립칩등의 기존의 방법에서 TSV(Through Silicon Via)를 이용하여 적층하는 방법이 주목받고 있다. TSV는 기존의 와이어 본딩과 비교하여 고집적도, 빠른 신호전달, 낮은 전력소비 등의 장점을 가지고 있어 많은 연구가 진행되고 있다. TSV의 세부 공정 중 비아필링(Via filling)기술은 I/O수 증가와 미세피치화에 따른 비아(Via) 직경의 감소 및 종횡비(Via Aspect Ratio)증가로 인해 기존 필링 공정으로는 한계가 있다. 기존의 비아 홀(Via hole)에 금속을 필링하기 위한 방법으로 전기도금법이 많이 사용되고 있으나, 전기도금법은 전기도금액 조성, 첨가제의 종류, 전류밀도, 전류모드 등에 따라 결과물에 큰 차이가 발생되어, 최적공정조건의 도출이 어렵다. 또한 20um이하의 비아직경과 높은 종횡비로 인하여 충진시 void형성등의 문제점이 발생하기도 한다. 본 연구에서는 용융솔더와 진공을 이용하여 비아를 필링시켰다. 이 방법은 관통된 비아가 형성된 웨이퍼 양단에 압력차를 주어, 작은 직경을 갖는 비아 홀의 표면장력을 극복하고, 용융상태의 솔더가 관통된 비아 홀 내부로 필링되는 방법이다. 관통 비아홀이 형성 된 웨이퍼 위에 솔더페이스트를 $250^{\circ}C$이상 온도를 가해 용융상태로 만든 후 웨이퍼 하부에 진공을 형성하여 필링하는 방법과 용융솔더를 노즐을 통하여 위쪽으로 유동시켜 그 위에 비아홀이 형성된 웨이퍼를 접촉하고 웨이퍼 상부에 진공을 형성하여 필링하는 방법으로 실험을 각각 실시하였다. 이 때, 웨이퍼 두께는 100um이하이며 홀 직경은 20, 30um, 웨이퍼 상부와 하부의 진공차는 약 0.02~0.08Mpa, 진공 유지시간은 1~3s로 실시하여 최적 조건을 고찰하였다. 각 조건에 따른 필링 후 단면을 전자현미경(FE-SEM)을 통해 관찰하였다. 실험 결과 0.04Mpa 이상에서 1s내의 시간에 모든 비아홀이 기공(Void)없이 완벽하게 필링되는 것을 관찰하였으며 이 결과는 기존의 방법에 비하여 공정시간을 감소시켜 생산성이 대폭 향상 될 수 있는 방법임을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.66-66
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• 1999

최근 들어 다결정 SiGe은 MOS(Metal-Oxide-Semiconductor)에서 기존에 사용되던 다결정 Si 공정과의 호환성 및 여러 장점으로 인하여 다결정 Si 대안으로 많은 연구가 진행되고 있다. 고농도로 도핑된 P type의 다결정 SiGe은 Ge의 함량에 따른 일함수의 조절과 낮은 비저항으로 submicrometer CMOS 공정에서 게이트 전극으로 이용하려는 연구가 진행되고 있으며, 55$0^{\circ}C$ 이하의 낮은 온도에서도 증착이 가능하고, 도펀트의 활성화도가 높아서 TFT(Thin Film Transistor)에서도 유용한 재료로 검토되고 있다. 현재까지 다결정 SiGe의 증착은 MBE, APCVD, RECVD. HV/LPCVD 등 다양한 방법으로 이루어지고 있다. 이중 HV/LPCVD 방법을 이용한 증착은 반도체 공정에서 게이트 전극, 유전체, 금속화 공정 등 다양한 공정에서 사용되고 있는 방법으로 현재 사용되고 있는 반도체 공정과의 호환성의 장점으로 다결정 SiGe 게이트 전극의 증착 공정에 적합하다고 할 수 있다. 본 연구에서는 HV/LPCVD 방법을 이용하여 게이트 전극으로의 활용을 위한 다결정 SiGe의 증착 메카니즘을 분석하고 Ex-situ implantation 후 열처리에 따라 나타나는 활성화 정도를 분석하였다. 도펀트를 첨가하지 않은 다결정 SiGe을 주성엔지니어링의 EUREKA 2000 장비를 이용하여, 1000$\AA$의 열산화막이 덮혀있는 8 in 웨이퍼에 증착하였다. 증착 온도는 55$0^{\circ}C$에서 6$25^{\circ}C$까지 변화를 주었으며, 증착압력은 1mtorr-4mtorr로 유지하였다. 낮은 증착압력으로 인한 증착속도의 감소를 방지하기 위하여 Si source로서 Si2H6를 사용하였으며, Ge의 Source는 수소로 희석된 10% GeH4와 100% GeH4를 사용하였다. 증착된 다결정 SiGe의 Ge 함량은 RBS, XPS로 분석하였으며, 증착된 박막의 두께는 Nanospec과 SEM으로 관찰하였다. 또한 Ge 함량 변화에 따른 morphology 관찰과 변화 관찰을 위하여 AFM, SEM, XRD를 이용하였으며, 이온주입후 열처리 온도에 따른 활성화 정도의 관찰을 위하여 4-point probe와 Hall measurement를 이용하였다. 증착된 다결정 SiGe의 두게를 nanospec과 SEM으로 분석한 결과 Gem이 함량이 적을 때는 높은 온도에서의 증착이 더 빠른 증착속도를 나타내었지만, Ge의 함량이 30% 되었을 때는 온도에 관계없이 일정한 것으로 나타났다. XRD 분석을 한 결과 Peak의 위치가 순수한 Si과 순수한 Ge 사이에 존재하는 것으로 나타났으며, ge 함량이 많아짐에 따라 순수한 Ge쪽으로 옮겨가는 경향을 보였다. SEM, ASFM으로 증착한 다결정 SiGe의 morphology 관찰결과 Ge 함량이 높은 박막의 입계가 다결정 Si의 입계에 비해 훨씬 큰 것으로 나타났으며 근 값도 증가하는 것으로 나타났다.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.690-695
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• 2003

Soft-solution route employing PVA(Polyvinyl Alcohol) as a polymeric carrier in a mixed metal cation solution was used for synthesis of single-phase nickel aluminate (NiA1$_2$O$_4$) powders. The PVA ensured the homogeneous distribution of metal ions in the solution and it resulted in the decrease of crystallization temperature. The synthesized powders prepared by PVA addition were soft and ball-milled easily. The ball-milled powders of about 300 nm in size were fully densified to density of 4.35 g/㎤ at 1600$^{\circ}C$ for 1 h. The Vickers hardness, flexural strength, fracture toughness and thermal expansion coefficient of the sintered nickel aluminate were 14.2 ㎬, 304 ㎫, 4.8 ㎫$.$m$\^$1/2/ and 9.8${\times}$10$\^$-6//$^{\circ}C$, respectively.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.238-243
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• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.