• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.55-60
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• 2007

The codeposition behavior of submicron sized diamond with nickel from nickel electrolytes has been investigated. Electroplating of diamond dispersed nickel composites was carried out on a rotating disk electrode (RDE). The effects of current type and current density on the electrodeposited Ni-diamond composite coating were investigated. The effects of surfactants on the composite coating were also investigated. The hardness of coating was measured with varying electroplating conditions using Micro Vickers. As diamond was incorporated into the coating, the hardness of coating as well as the wear resistance was improved. The hardness of the coating was increased as much as 100% and the wear resistance was improved as much as 27%. The hardness of composite coating layer increased slightly at the diamond content of above 20 gpl.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.57-63
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• 2006

For chip-stack package applications, Cu filling characteristics into trench vias of $75{\sim}10\;{\mu}m$ width and 3 mm length were investigated with variations of electroplating current density and current mode. At $1.25mA/cm^{2}$ of DC mode, Cu filling ratio higher than 95% was obtained for trench vias of $75{\sim}35{\mu}m$ width. When electroplated at DC $2.5mA/cm^{2}$, Cu filling ratios became inferior to those processed at DC $1.25mA/cm^{2}$. Pulse current mode exhibited Cu filling characteristics superior to DC current mode.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Korean Magnetics Society
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• v.25 no.1
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• pp.10-15
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• 2015

The model for the magneto-impedance of composite wires composed of highly conductive nonmagnetic metal core and soft magnetic shell was derived based on the Maxwell's equations. The Cu($100{\mu}m$ diameter)/$Ni_{80}Fe_{20}$($15{\mu}m$ thickness) core/shell composite wire was fabricated by electrodeposition. The impedance spectra for the $Cu/Ni_{80}Fe_{20}$ core/shell composite wire were measured in the frequency range of 10 kHz~10 MHz under longitudinal dc magnetic field in 0 Oe~200 Oe. The spectra of complex permeability in circumferential direction were extracted from the impedance spectra by using the derived model. The extracted spectra of complex permeability showed relaxation-type dispersion which is well curve-fitted with Debye equation with single relaxation frequency. By analyzing the magnetic field dependence of the complex permeability spectra, it has been verified that the composite wire has magnetic anisotropy in longitudinal direction and the origin of the single relaxation process is the magnetization rotation in circumferential direction.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.