• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.51-55
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• 2021

With the recent development of various smartphone designs in the smartphone market, the use of curved cover glass has been required, and interest in curved glass production has increased. In this paper, we designed a pressurization system that simplified the size of the system using a wedge amplification mechanism for smartphone curved glass molding systems. The pressurization system consisted of a linear motor, a wedge, and a force sensor. The wedge was used to amplify the force, and the piezoelectric sensor was used to measure the force. In addition, the proposed amplification mechanism was confirmed to have an error of 1.27% through an experiment compared to the simulation, and the pressurization error of 0.76% for the pressurization profile 3,500N was verified through an experiment.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.17-21
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• 2022

In the case of the manufacturing industry that produces high-tech components such as semiconductors and large flat panel displays, the manufacturing space is made into a cleanroom to increase product yield and reliability, and various environmental factors have been managed to maintain the environment. Among them, airborne particle is a representative management item enough to be the standard for actual cleanroom grade, and a sequential particle monitoring system is usually used as one parts of the FMS (Fab or Facility monitoring system). However, this method has a problem in that the measurement efficiency decreases as the length of the sampling tube increases. In this study, in order to solve this problem, a multiple regression model was created. This model can correct the measurement error due to the decrease in efficiency by sampling tube length.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Korean Society for information Management
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• v.39 no.2
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• pp.1-33
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• 2022

Voice shopping is gaining attention following the trend of non-contact E-commerce by enabling people to shop via voice command. Therefore, in this study, voice shopping service heuristics using a display-mounted voice interface were developed in preparation for the future where voice shopping becomes a part of daily life in the world. First, as a theoretical approach, a literature survey of 50 papers on the design principles of 'visual interface,' 'voice interface,' and 'shopping service' was conducted to produce a total of 29 draft design principles. Second, as an empirical approach, a focus group interview was conducted on consumer decision-making processes in shopping experiences and information-seeking behavior within the context of shopping to draft the heuristics. This was to supplement the user experience, a weak part of the literature research. Finally, a Delphi survey asked 20 experts in UX, service planning, artificial intelligence development, and shopping to evaluate the heuristics draft developed through the above two stages. After three rounds of Delphi surveys, the final heuristics were proposed.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2006.05a
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• pp.237-240
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• 2006

Human's sight holds the most extents among other senses. It will become more beneficial in person's emotion or body, if we form much better environment to human in connection with visual information as importance of visual information. Human is using a lot of display units on modern society. Basic colors that compose these are Red, Green and Blue. Using these three colors, we can change color sense of monitor or brightness degree. Suitable color degree by individual's environment can reduce person's stress or give comfortable feeling. So Factors by human's emotion and environment are standardized using fuzzy and the method that is to apply the result of Intelligent Color Control(ICC) on display is proposed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.96-96
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• 2012

복합분자펌프는 기존의 터보분자펌프 turbine blade에 spiral grooved를 추가하여 초고진공(10-8Pa)에서 저진공(330Pa)까지 넓은 압력범위에서 사용할 수 있고 이 펌프를 사용함으로서 완전 oil free한 진공시스템을 만들 수 있는 특징을 가지고 있다. 특히, 회전체를 비접촉으로 지지하는 자기베어링 방식을 적용함으로써, 진동은 극히 작고 베어링수명은 길면서 중저진공에 대한 배기속도가 크고 임의의 방향으로 접속이 가능하여 반도체 및 디스플레이 제조 공정과 같은 첨단산업의 다양한 분야에 쉽게 적용되고 있으며, 그 적용 분야와 시장은 계속 성장하고 있다. 고 진공과 배기 속도의 달성을 위해서, 고속으로 이동하는 격면과 기체분자를 충돌시켜, 기체 분자를 원하는 방향으로 유도하는 작동원리를 가지고 있다. 특히 공기분자의 밀도가 매우 낮은 희박가스 상태에서 고속 회전하는 blade로 공기분자를 쳐내면서 작동됨으로써 날개의 상하 압력차에 의한 공기력보다도 날개의 고속회전이 매우 중요시되고 압력으로는 10-1 Pa 이하의 분자영역에서 그 성능을 최고로 발휘할 수 있다. 이러한 복합 펌프의 주요 장점은 다음과 같다. 1. 10-8 Pa (10-10 torr) ~ 10 Pa (1 torr) 까지 넓은 영역에서 배기가 가능하다. 2. 탄화수계의 대하여 높은 압축특성을 가지고 있고, 윤활유를 사용하지 않으므로 얻을 수 있는 진공상태가 고청정하다(oil free). 3. 정밀 5축제어 자기베어링으로 완전히 부상하여 회전함으로서 마모가 없고 진동이 최소화하였을 뿐 만 아니라, 또한 운전음도 거의 없다. 4. 설치조건에 제한이 없고 고장이 거의 없다. 특히 복합분자펌프는 탄화수소화합물이 없는 진공을 생성시키면서 구성요소가 간단한 반면 폭넓은 진공대역을 충족하기 때문에 산업계와 연구계의 주요 첨단 분야에서 광범위하게 사용되고 있으며, 최근 반도체 및 디스플레이, 바이오엔지니어링 등의 발전으로 적용분야가 넓어지고 있다.

• 기계와재료
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• v.23 no.1
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• pp.44-51
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• 2011

사람은 노화가 진행됨에 따라 기억력, 지능, 언어, 운동 기능 등의 인지능력이 저하되므로 대상 노인에 특성에 맞는 적절한 재활치료 방법을 적용해야 한다. 체감형 3D 인지시스템은 가상현실을 기반으로 하고 인지능력 향상을 위한 컨텐츠를 적용하여 환자의 특성에 맞는 의료 활동을 수행할 수 있다. 특히 원예 컨텐츠는 노인들의 참여도를 높일 수 있고 인지능력 향상과 우울증 감소에 도움이 된다. 이러한 가상현실 시스템은 위치인식, 동작인식, 디스플레이 등의 하드웨어 장치들을 이용하여 구현 가능하다. 본 논문에서는 노화에 따른 인지기능 저하와 종류와 특징을 분석하고 관련 재활치료 방법을 조사하였다. 또한 체감형 3D 인지시스템을 구성하는 모듈과 재활치료에 적합한 가상현실 컨텐츠를 제안하였다.

• Information and Communications Magazine
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• v.19 no.4
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• pp.53-61
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• 2002

세계는 현재 디지털 혁명에 의한 새로운 정보통신(IT) 서비스의 홍수에 직면해있다. '언제, 어디서나, 사용자의 요구에 맞추어'라는 말은 이미 모든 서비스 기술개발 분야에서 캐치프레이즈로 자리잡은지 오래 되었다. 통신은 기존 전화를 통한 음성 서비스 위주에서 점차 데이터 통신으로 무게 중심이 이동되고 있고, 방송도 단순한 영상물 중심의 프로그램 전달이 아닌 개인별 정보 전달 및 양방향 통신에 의한 부가서비스로 그 영역을 확장해가지고 있다. 이런 변화의 중심에는 역시 '디지털' 기술에 의해 가능한 '융합(Convergence)' 화를 위한 기술개발이 그 동력을 제공하고 있으며, 프로세서 , 메모리, 디스플레이, 모뎀 등 하드웨어의 발전과 함께 오디오비쥬얼 신호 압축 및 전송, 웹 문서처리 등 소프트웨어적인 기술 개발 및 표준화 결과를 상호 유기적이고 통합적으로 각 응용 서비스 시스템에 적용함으로써 가능해지고 있다. 본 고에서 데이터 방송, 지능형 방송 및 MPEG-21 멀티미디어 프레임워크 표준을 중심으로 방송의 입장에서 본 방송통신융합의 기술개발 현황과 전망에 대해 개괄해보기로 한다.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.12-22
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• 2021

Since the technical realization of self-aligned planar complementary metal-oxide-semiconductor field-effect transistors in 1960s, semiconductor manufacturing has aggressively pursued scaling that fruitfully resulted in tremendous advancement in device performances and realization of features sizes smaller than 10 nm. Due to many intrinsic material and technical obstacles, continuing the scaling progress of semiconductor devices has become increasingly arduous. As an effort to circumvent the areal limit, stacking devices in a three-dimensional fashion has been suggested. This approach is commonly called monolithic three-dimensional (M3D) integration. In this work, we examined technical issues that need to be addressed and overcome to fully realize energy efficiency, short latency and cost competency. Full-fledged M3D technologies are expected to contribute to various new fields of artificial intelligence, autonomous gadgets and unknowns, which are to be discovered.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.6
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• pp.85-91
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• 2014

Nowadays, Dynamic lighting control and management skills are studied and used. If the system which is to manage multiple intelligent spot applied ubiquitous service technology is built with decision making and used in the complex intelligent space like a apartment then will improve energy efficiency and provide comfortability in optimal conditions. To solve this problem distributed autonomous control middleware and energy management system which process data gathering by zigbee mesh network and search proper services to save energy by the existing state of things is necessary. In paper we designed DDLEMS (Distributed Dynamic Lighting Energy Management System) that is to service duplex communication embedded by software based home server platform to provide mobile services in the smart place and support decision making about energy saving to the best use of wireless censor node and controled network, energy display devices.