• Solar Energy
• /
• v.11 no.1
• /
• pp.41-49
• /
• 1991

In this study, the (P)SiC/(N)Si solar cell is fabricated by the vacuum evaporation method with the substrate temperature at about $200{\pm}5[5^{\circ}C]$ and its characteristics are investigated. The optimal thickness of $1.2[{\mu}m]$ of SiC film is derived from the relation between film thickness and conversion efficiency. The characteristics of solar cells are improved by the annealing. The optimum annealing temperature and duration are $420[^{\circ}C]$ and 12[min], respectively it is shown that the peak values of spectral response are shifted to the long wavelength region with increasing the annealing temperature. The X-ray diffraction patterns and the scanning electron micrographs show the grain grow thin SiC film as the annealing temperature and time is increased. The best conversion efficiency is 11.7[%] for a $2.5{\times}1[cm^2]$ cell.

• Applied Chemistry for Engineering
• /
• v.22 no.2
• /
• pp.149-154
• /
• 2011

In order to explore properties of various rubber compounds after thermal aging under the condition similar to the operating environment of a fuel cell-stack, heat resistance and compression set of those compounds were investigated for a long term operation in $H_2SO_4$, $H_2O$, and LLC (ethylene glycol : $H_2O=50:50$) solution. It was assumed that aging Acrylonitrile butadiene rubber (NBR) and Elthylene Propylene diene rubber (EDPM) compound in the solution resulted in discoloration as time passed. It was also found that hydrolysis was developed on the Silicone rubber (VMQ) compound intentionally aged under acidic condition by means of TGA, SEM, and EDS analysis.

• KSCE Journal of Civil and Environmental Engineering Research
• /
• v.30 no.3A
• /
• pp.221-228
• /
• 2010

External bonding of carbon fiber reinforced polymer (CFRP) sheets has been widely accepted as a popular method for strengthening of deteriorated RC structures. The long-term behavior of CFRP-strengthened RC structure is often affected by that of the interface between CFRP sheets and concrete. This study aims at applying a viscoelastic model to describe the creep behaviour of the adhesive layer bonding CFRP sheet to concrete, the CFRP-concrete interface. Reviews of available models on concrete creep behavior have been first carried out and then new FE analysis model is proposed. The proposed FE analysis model based on the maxwell model has been verified by previous experimental results. It is shown that the creep effect of interfacial adhesive layer is very important on the long-term behavior of concrete structures strengthened with CFRP.

• The Journal of the Convergence on Culture Technology
• /
• v.4 no.3
• /
• pp.209-212
• /
• 2018

Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.23 no.3
• /
• pp.230-236
• /
• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• Explosives and Blasting
• /
• v.34 no.1
• /
• pp.19-28
• /
• 2016

The number of industrial structures that must be demolished due to functional and structural deterioration has been increased. There is an increasing application of explosive demolition or explosive demolition combined with mechanical demolition to minimize temporal and spatial environmental hazardous factors created during the process of demolition. In this case study, to demolish the turbine foundation structure, which is a large-section reinforced concrete structure, the parital explosive demolition thchnique was conducted. As a result of the partial explosive demolition, the overall crushing of the blasting sections of beam-column joints structure with haunched beams and second-floor columns about the turbine foundation was satifactory, and the explosive demolition was completed without causing any damage to surrounding facilities.

• Journal of Welding and Joining
• /
• v.8 no.1
• /
• pp.31-42
• /
• 1990

Arc must be stable during welding first of all other factors for obtaining sound weldment, especially in the automation of welding process. Arc stability is somewhat sophisticated phenomenon which is not clearly defined yet. In consumable electrode welding, the voltage and current variation due to metal transfer enables to assess arc stability. Recently, statistical analyses of the voltage and current waveform factors are performed to assess the degress of arc stability which is assessed and controlled by operator's own experience by now. But, considering the increasing need and the trend of automation of welding process, it is necessary to monitor arc stability in real-time. In this sutdy, the modified stability index composed of two voltage and current wvaeform factors (arc time and short circuit time) reduced from four factors (arc time, short circuit time, average arc current and average short circuit current) in Mita's index by the welding electrical circuit modeling is proposed and verified by experiments to be well estimating arc stability in the static sense. Also, the recursive calculation form estimating present arc stability in the dynamic sense is developed for real-time estimation. The results of applying the recursive index during welding show good estimation of arc stability in real-time. Therefore, the results of this study offers the mean for real-time control arc stability.

• Journal of Welding and Joining
• /
• v.21 no.1
• /
• pp.48-53
• /
• 2003

The object of this study is to examine the effect of short circuit time ratio (SCTR) and current rise delay time (Td) on the spatter generation at low and medium current range in $CO_2$ welding. The spatter was evaluated by the weight generated in the welding of bead-on-plate for 30 seconds (3 times). Td was varied by order of 0, 0.4, 0.8 and 1.2 msec. At each Td, the short circuit time ratio was varied by the output voltage of the welding power source. In the low current range, it was found that the optimum SCTR was 20~25%, and the minimum spatter generation weight was obtained in the case of Td=0.4msec and SCTR=22% even though the remarkable difference was not showed by the application of Td. In the medium current range, it was confirmed that the arc was stable though the SCTR was increased from 20% to 40% by the control of current wave. Spatter generation weight depended on the variation of Td, and the lowest value of spatter generation weight occurred at Td=0.8~1.2msec.

• Journal of the Korean Vacuum Society
• /
• v.10 no.2
• /
• pp.219-224
• /
• 2001

Pd/Ge/Ti/Pt ohmic contact to n-type InCaAs was investigated. Minimum specific contact resistivity of $3.7\times10^{-6}\; \Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $400^{\circ}C$ for 10 seconds. This was related to the formation of Pd-Ge compounds and the in-diffusion of Ge atoms to InGaAs surface. However, the specific contact resistivity increased slightly to $low-10^5\; \Omega\textrm{cm}^2$ in the case of longer annealing time. Superior ohmic contact and non-spiking planar interface between ohmic materials and InGaAs were maintained after annealing at high temperature. Therefore, this thermally stable ohmic contact system is a promising candidate for compound semiconductor devices.

• KIPS Transactions on Software and Data Engineering
• /
• v.4 no.5
• /
• pp.241-246
• /
• 2015

Although many different methods have been used to solve stereo correspondent problems, the deviation of accuracy is too big. Among those many methods, the one that uses segmentation information of input image has received high attention in academic field since it is very close to vision recognition. In this thesis, the existing method of acquiring a single value by using the segment information and initial disparity value was viewed in NP-hard problem to propose a new method. In order to verify the validity of the proposed method, well-known data were used for experiment and the resulted data was analyzed. Although there were some disadvantages in the time aspect, it showed somewhat useful results in the accuracy aspect.