• Journal of the Earthquake Engineering Society of Korea
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• v.14 no.3
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• pp.31-38
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• 2010

The purpose of this study is to evaluate the seismic performance of gravity-designed post tensioned (PT) flat plate frames with and without slab bottom reinforcement passing through the column. In low and moderate seismic regions, buildings are often designed considering only gravity loads. This study focuses on the seismic performance of gravity load designed PT flat plate frames. For this purpose, 3-, 6- and 9-story PT flat plate frames are designed considering only gravity loads. For reinforced concrete flat plate frames, continuous slab bottom reinforcement (integrity reinforcement) passing through the column should be placed to prevent progressive collapse; however, for the PT flat plate frames, the slab bottom reinforcement is often omitted since the requirement for the slab bottom reinforcement for PT flat plates is not clearly specified in ACI 318-08. This study evaluates the seismic performance of the model frames, which was evaluated by conducting nonlinear time history analyses. For conducting nonlinear time history analyses, six sets of ground motions are used as input ground motions, which represent two different hazard levels (return periods of 475 and 2475 years) and three different locations (Boston, Seattle, and L.A.). This study shows that gravity designed PT flat plate frames have some seismic resistance. In addition, the seismic performance of PT flat plate frames is significantly improved by the placement of slab bottom reinforcement passing through the column.

• 한국HCI학회:학술대회논문집
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• 2008.02a
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• pp.439-444
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• 2008

The techniques, which locate example motions in abstract parameter space and interpolate them to generate new motion with given parameters, are widely used in real-time animation system for its controllability and efficiency However, as the dimension of parameter space increases for more complex control, the number of example motions for parameterization increases exponentially. This paper proposes a method that uses two different parameter spaces to obtain decoupled control over upper-body and lower-body motion. At each frame time, each parameterized motion space produces a source frame, which satisfies the constraints involving the corresponding body part. Then, the target frame is synthesized by splicing the upper body of one source frame onto the lower body of the other. To generate corresponding source frames to each other, we present a novel scheme for time-warping. This decoupled parameterization alleviates the problems caused by dimensional complexity of the parameter space and provides users with layered control over the character. However, when the examples are parameterized based on their upper body's spatial properties, the parameters of the examples are varied individually with every change of its lower body. To handle this, we provide an approximation technique to change the positions of the examples rapidly in the parameter space.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.17-24
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• 2008

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• Journal of the Korean Magnetics Society
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• v.14 no.3
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• pp.99-104
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• 2004

We have studied to understand the barrier and interface qualities and structural changes through measuring temperature dependent spin-polarization as functions of plasma oxidation time and annealing time. Magnetic tunnel junctions consisting of SiO2$_2$/Ta 5/CoFe 17/IrMn 7.5/CoFe 5/Al 1.6-Ox/CoFe 5/Ta 5 (numbers in nm) were deposited and annealed when necessary. A 30 s,40 s oxidized sample showed the lowest spin-polarization values. It is presumed that tunneling electrons were depolarized and scattered by residual paramagnetic Al due to under-oxidation. On the contrary, a 60s, 70 s oxidized sample might have experienced over-oxidation, where partially oxidized magnetic dead layer was formed on top of the bottom CoFe electrode. The magnetic dead layer is known to increase the probability of spin-flip scattering. Therefore it showed a higher temperature dependence than that of the optimum sample (50 s oxidation). temperature dependence of 450 K annealed samples was improved when the as-deposited one compared. But the sample underwent 475 K and 500 K annealing exhibits inferior temperature dependence of spin-polarization, indicating that the over-annealed sample became microstucturally degraded.

• Restorative Dentistry and Endodontics
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• v.33 no.4
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• pp.405-412
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• 2008

This study was aimed to investigate whether an oxygen inhibition layer (OIL) is essential for the interfacial bonding between resin composite layers or not. A composite (Z-250, 3M ESPE) was filled in two layers using two aluminum plate molds with a hole of 3.7 mm diameter. The surface of first layer of cured composite was prepared by one of five methods as followings, thereafter second layer of composite was filled and cured: Group 1 - OIL is allowed to remain on the surface of cured composite; Group 2 - OIL was removed by rubbing with acetone-soaked cotton; Group 3 - formation of the OIL was inhibited using a Mylar strip; Group 4 - OIL was covered with glycerin and light-cured; Group 5 (control) - composite was bulk-filled in a layer. The interfacial shear bond strength between two layers was tested and the fracture modes were observed. To investigate the propagation of polymerization reaction from active area having a photo-initiator to inactive area without the initiator, a flowable composite (Aelite Flow) or an adhesive resin (Adhesive of ScotchBond Multipurpose) was placed over an experimental composite (Exp_Com) which does not include a photoinitiator and light-cured. After sectioning the specimen, the cured thickness of the Exp_Com was measured. The bond strength of group 2, 3 and 4 did not show statistically significant difference with group 1. Groups 3 and 4 were not statistically significant different with control group 5. The cured thicknesses of Exp_Com under the flowable resin and adhesive resin were 20.95 (0.90) urn and 42.13 (2.09), respectively.

• Childhood Kidney Diseases
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• v.14 no.2
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• pp.166-173
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• 2010

Purpose : Genetic and clinical factors can influence the permeability of the peritoneal membrane. The peritoneal equilibration test (PET) is helpful in measuring peritoneal permeability in peritoneal dialysis (PD). We investigated the influence of genetic polymorphism of vascular endothelial growth factor (VEGF) on the PET parameters. Methods : Pediatric patients who underwent PET within 12 months of initiating PD at Seoul National University Children's Hospital and Samsung Medical Center were selected. The patients with positive history of peritonitis before PET were excluded. The VEGF -2578C/A, -14978T/C, -1154G/A, -634G/C, and +936C/T single-nucleotide polymorphisms were genotyped. Results : The mean 4-hour dialysate-to-plasma ratio for creatinine (D/P creatinine) and the mean 4-hour dialysate glucose to baseline dialysate glucose ratio (D/$D_0$ glucose) were $0.56{\pm}0.13$ and $0.43{\pm}0.11$, respectively. The patients with haplotype CTGGC showed higher 4-hour D/P creatinine ($0.67{\pm}0.12$ vs $0.50{\pm}0.09$, P=0.007) and lower 4-hour D/$D_0$ glucose ($0.35{\pm}0.12$ vs $0.47{\pm}0.08$, P=0.037) than those without haplotype CTGGC. Conclusion : The VEGF genetic polymorphism may influence the peritoneal solute transport.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.17-22
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• 2018

In this paper, the effects of solder joint aging on the reliability of embedded package solder joints were investigated using numerical analysis by finite element method. Solder joints were SAC305 with aging time 0, 60, 180 days. For reliability analysis, warpage of package and equivalent creep strain (ECS) and total strain energy density (TSED) of solder joint were analyzed. The analysis results show that the package warpage is decreased in the case of the embedded package compared to the non embedded package, and the reliability life of the solder joint is predicted to be high. Also, it was interpreted that the longer the aging time, the less the warpage of the embedded package, but the reliability life of the solder joint would be shortened.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2012.03a
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• pp.48-48
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• 2012

화학센서는 분석물질과 감응물질간의 화학적 반응을 통해 분석물질을 선택적으로 인지하고 이를 통하여 특정물질을 실시간으로 분석할 수 있는 기술이다. 최근 화학센서로 색소를 이용하여 음이온을 진단/감응하는 기술이 각광 받고 있으며, 더불어 음이온을 선택적으로 인지함에 있어 검출하고자 하는 특정 음이온에 대한 민감도를 높이기 위한 노력이 계속되고 있다. 감응물질로 이용되는 색소는 주로 분자 내 전하 이동형 색소(intramolecular charge transfer dye)로 주위 환경 변화에 민감하게 반응하며, 자극에 따른 변화를 흡수와 발광, 굴절률의 변화 등으로 나타낸다. 또한 다양한 음이온 중 분석물질로써 연구 가치가 큰 음이온에는 플루오린화물(fluoride)이 있다. 이는 플루오린화물이 치아 보호와 골다공증에 중요한 역할을 하는 순기능을 가지는 반면 고농도 상태에서는 불소증(fluorosis)을 비롯한 악영향을 잠재적으로 가지기 때문에 그 양을 인지하는 것이 중요하게 여겨지기 때문이다. 따라서 본 연구에서는 2-(3,5,5-trimethylcyclohex-2-enylidene)-malononitirle과 indole-3-carboxaldehyde를 통하여 분자 내 전하 이동형 색소를 합성하고, $^1H$ NMR, GC-mas, EA로 합성된 색소의 물성을 분석하였다. 우선 반응물인 2-(3,5,5-trimethylcyclohex-2-enylidene)-malononitirle을 합성하기 위해 dimethylfor mamide(DMF) 용매 하에서 isophorone과 malononitrile을 12시간 반응시키고, 얻어진 결과물을 정제한다. 이후 indole-3-carboxaldehyde와 10시간 환류시켜 색소를 얻는다. 합성된 색소는 F 이온 검출에 이용되며, UV-vis 분광법을 이용하여 분석물질에 따른 흡수 정도와 강도 변화를 살펴본다. 연구의 최종적인 목적은 비단 진단/감응 색소의 합성이 아니라 나노 섬유 소재와 색소의 접합을 통해 진단/감응형 나노 섬유를 개발하는 것으로 이를 위해 전기방사법이 이용된다.