• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.7-15
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• 2000

The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

• Journal of Korean Society of Steel Construction
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• v.9 no.3 s.32
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• pp.421-430
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• 1997

In this study, the static and the fatigue tests were performed with high tension bolted joints, of which the surfaces were spread with inorganic zinc-primer after shot-blast, and milling surface, and steel-natural surface, difference of friction surface condition were examined by comparing the esults of tests. From the result of synthetical investigation of this study. it is proper that using the torque management method in order to introduce design axial force to blots, and the provision of specifications that initial axial forces must be 110% of design axial forces is proper. Decreasing ratio of axial forces to initial force is proportional to common lorgarithms of time progress, it converge constant value after 20 hours, and decreasing ratio is little related to the roughness of friction surface. Sliding coefficient of milling, spreading inorganic zinc-primer, just producting is great in order and sliding forces are dependent on the applied axial forces, but if the applied axial forces are great, sliding coefficient become small by a loss of roughness. So it is confirmed that relation between the applied axial forces and the sliding forces are not proportional linearly. From the result of estimation on fatigue strength, all specimens satisfy the specifications with B-grade and milling surface is lower than the others about 14% in fatigue strength because in milling surface lose the function of friction-types joints at lower number of cycles. From the result of eximination for the distribution area of compressive force, friction area near to inside bolt is wider in the direction of stress than near to outside. It is guessed that this situation occurs because outside bolts firstly change from the friction connection to the bearing connection.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.406-406
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• 2011

결정질 태양전지에서 도핑(Doping)은 반도체(Semiconductor)의 PN 접합(Junction)을 형성하는 중요한 역할을 한다. 도핑은 반도체에 불순물(Dopant)을 주입하는 공정으로 고온에서 진행되며 온도는 중요한 변수(Parameter)로 작용한다. 본 연구에서는 여러 가지 에미터(emitter)층 형성방법 중에 가장 저가이면서 공정과정이 간단하며 대면적 도핑이 용의한 Spray 방법을 통해 효과적인 에미터 층 형성의 최적화를 위해 DI water에 각각 1%, 3%, 5% 7%로 희석된 H3PO4용액 으로 850$^{\circ}C$에서 열처리 시간을 가변해 가며 최적화된 면저항과 표면농도 특성을 분석하였다. 도핑소스가 웨이퍼(wafer) 각각의 표면에 흡착시킨 후 오븐에 넣어 150$^{\circ}C$에서 5분간 건조시킨 후 퍼니스(furance)에 넣어 시간을 가변해 가며 도핑시켰다. Spray 방식은 기존의 방식보다 저렴하고 In-line 공정에 적합하며 대용량으로 전환이 쉽다는 많은 장점을 가지고 있다. 도핑시 먼저 spray를 이용하여 웨이퍼 표면에 균일하게 용액을 흡착시킨 후 오븐에서 150$^{\circ}C$에서 5분간 건조 후 furnace에 넣어 850$^{\circ}C$에서 시간을 가변 해가며 실험하였다. H3PO4용액의 비율이 1%일 때는 2분 이상 열처리를 하였을 때 60${\Omega}/{\Box}$ 이하로 내려가지 않았다. 이는 최초 표면농도가 낮아 더 이상 확산되지 않음을 의미한다. 또한 H3PO4의 비율이 3% 이상일 때는 열처리 시간이 1분 이하일 때 면저항의 변화가 거의 없었으나 2분 이상일 때는 시간에 따라서 점차 낮아졌으며 균일도 역시 좋아졌다. 이는 H3PO4의 비율이 3% 이상일 때는 표면농도가 높아서 1분 이하의 열처리 시간에서는 확산해 들어가는 양이 거의 같음을 알 수 있었다.

• Journal of Chest Surgery
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• v.43 no.6
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• pp.635-641
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• 2010

Background: Radiofrequency endovenous ablation of incompetent saphenous vein has gaining popularity over the conventional ligation and stripping as a minimally invasive technique. The latest version of radiofrequency endovenous catheter, $VNUS^{\circledR}Colosure$ fast VNUS medical Technologies, San Jose, CA, adopted a segmental ablation system, instead of continous pullback, is designed to reduce treatment time in comparison with the previous model $VNUS^{\circledR}Colosure$ plus VNUS medical Technologies, San Jose, CA. The purpose of this study is to compare the difference between two endovenous radiofrequency ablation systems in terms of treatment efficacy and complication rates. We analyze the initial efficacy and complication rates of $VNUS^{\circledR}Colosure$ fast with $VNUS^{\circledR}Colosure$ plus. Material and Method: Between June 2006 and August 2009, $VNUS^{\circledR}Colosure$ plus was performed to treat varicose vein on 59 limbs in 41. patients and $VNUS^{\circledR}Colosure$ fast was performed on 76 limbs in 67 patients. We retrospectively compared in both group with sex, mean treatment time, mean treatment diameter, conjugated treatment, and complications after the procedure. Result: All patient were symptomatic and diagnosed as varicose vein and underwent level 2 clinical classification with color duplex scan. The mean treatment time for the great saphenous vein was significantly less with $VNUS^{\circledR}Colosure$ fast ($17.0{\pm}6.5min$) than $VNUS^{\circledR}Colosure$ plus ($62.7{\pm}9.8min$). There was no significant difference in 1 yr closure rate between groups (p=0.32). Minor complications such as skin burn, thrombophlebitis, ecchymosis, hematoma, cellulitis, tenderness, and there were not different between the groups. Conclusion: Both $VNUS^{\circledR}Colosure$ fast and $VNUS^{\circledR}Colosure$ plus are effective methods of endovenous saphenous ablation. $VNUS^{\circledR}Colosure$ fast is superior to the previous model with less treatment time preserving compatible efficacy and complications. The efficacy of $VNUS^{\circledR}Colosure$ fast for long term closure rate remains to be established.

• Journal of the Korean Vacuum Society
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• v.14 no.2
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• pp.91-96
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• 2005

The silicon-on-insulator (SOI) wafer fabrication technique has been developed by using ion-cut process, based on proton implantation and wafer bonding techniques. It has been shown by SRIM simulation that 65keV proton implantation is required for a SOI wafer (200nm SOI, 400nm BOX) fabrication. In order to investigate the optimum proton dose and primary annealing condition for wafer splitting, the surface morphologic change has been observed such as blistering and flaking. As a result, effective dose is found to be in the $6\~9\times10^{16}\;H^+/cm^2$ range, and the annealing at $550^{\circ}C$ for 30 minutes is expected to be optimum for wafer splitting. Direct wafer bonding is performed by joining two wafers together after creating hydrophilic surfaces by a modified RCA cleaning, and IR inspection is followed to ensure a void free bonding. The wafer splitting was accomplished by annealing at the predetermined optimum condition, and high temperature annealing was then performed at $1,100^{\circ}C$ for 60 minutes to stabilize the bonding interface. TEM observation revealed no detectable defect at the SOI structure, and the interface trap charge density at the upper interface of the BOX was measured to be low enough to keep 'thermal' quality.

• Journal of Yeungnam Medical Science
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• v.5 no.1
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• pp.23-32
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• 1988

Finger injuries are becoming more common with the increasing use of mechanical industrial and household appliances. Among the hand injuries, amputation is the serious disaster to the patient. Recently, application of microsurgical technique to the reattachment of ampuatated digits has been common clinical procedures. We performed microsurgical replantation to the 75 patients with 102 digits from march in 1986 to february in 1988. The following results were obtained. 1. The most common age distribution was third decade and male to female ratio was about 5:1. 2. The ratio of right to left hand was about 1:1 but the dominant to non-dominant hand was about 2:1. 3. The index finger was most commonly injured and the next was middle finger. 4. The most common type of the injuries was the crushing injury and the most common vector was a kind of pressor. 5. The anesthesia was performed in equal ratio between the general and regional anesthesia. 6. The survival rate of microreplantation to the injuries of the zone II was 77.8% and zone III was 80%. 7. The functional result after replantation at zone II was better than zone III. 8. Microreplantation was performed in any case of the type of the injury, the severity of crushing and the ischemic time, and the patients requirement was an important factor.

• Journal of Biomedical Engineering Research
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• v.19 no.5
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• pp.503-511
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• 1998

In this study, the stress distribution for different tibial components was observed In order to Investigate the load transfer and potential failure mechanism of the tibial components subjected to dynamic impact loading and also to evacuate the effect of bone-implant bonding conditions on the implant system. The 3-dimensional finite element models included an intact tibia, cemented metal-backed tibial component, uncemented metal-blocked tibial component, cemented all-polyethylene tibial component, and metal-backed component with a debonded bone/stem interface. The results showed that the cemented metal-hocked component Induced slightly higher peak stress at stem tip than the uncemented component. The peak stress of the all-polyethylene tibia1 component at stem trip showed about half thats of metal-backed tibial components. The all-polyethylene component showed a similar dynamic response to intact tibia. In case of debonded bone/stem interface, the peak stress below the metal tray was three times Higher than that of the fully bonded interface and unstable stress distribution at the stem tip was observed with time, which causes another adverse bone apposition and implant loosening. Thus, the all-polyethylene tibial component bonded fully to the surrounding bone might be most desirable system under an impact loading.

• Korean Journal of Optics and Photonics
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• v.23 no.2
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• pp.64-70
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• 2012

We analyzed the changes in electrical and optical characteristics of 1 $mm^2$ multiple-quantum-well (MQW) blue LEDs grown on a c-plane sapphire substrate after a stress test. Experiments were performed by injecting 50 mA current for 200 hours to TO-CAN packaged sample chips. We selected the value of injection current for stress through the junction-temperature measurement by using the forward-voltage characteristics of a diode to maintain a sufficiently low junction temperature during the test. The junction temperature at the selected injection current of 50 mA was 308 K. Experiments were performed under the assumption that the average junction temperature of 308 K did not affect the characteristics of the ohmic contact and the GaN-based materials. Before and after the stress test, we measured and analyzed current-voltage, light-current, light distribution on the LED surface, wavelength spectrum and relative external quantum efficiency (EQE). After the stress test, it was observed experimentally that the optical power and the relative EQE decreased. We theoretically investigated and experimentally proved that these phenomena are due to the increased nonradiative recombination rate caused by the increased defect density.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.24-31
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• 1997

2매의 금속을 맞대어 그 한 쪽에 접촉면과 평행하게 고주파진동을 가하면 단 시간에 접합된다. 이공정을 초음파 용접이라고 하며 그 물리적인 본질은 아직 불분명 하지만, 첫째로는 강한 마찰에 의해 금속 자유면의 산화물층이 제거되기 때문이라는 점과 둘째로는 마찰에 의해 금속 표면이 강하게 가열되어 이에 따른 연화에 의해 접합 이 된다고 하는 점이다. 그러나 이와 같이 가열된다고 하더라도 가열은 표면부에만 국한되고 다른 부분은 가열되지 않는다. 따라서 초음파용접은 냉간접합이라고도 한다. 또 가압력과 진동에 의한 힘이 동시에 작용하기 때문에 용접할 면을 미리 청정하게 할 필요는 없고 용접전의 단계에서 자연적으로 청정화가 이루어진다고 하는 사실이 간접 적으로 증명되고 있다. 초음파 용접(Ultrasonic welding)의 특징을 요약하면 고상용접 의 일종으로서 용접중에 국부적으로 고주파 진동에너지와 압력을 가하여 용접하는 방법이다. 이 때 모재를 용융시키지 않고 건전한 야금학적 결합부가 얻어진다는 데에 큰 특징이 있다. 또한 초음파용접은 다른 용접법에 비해 경제성이 매우 높고, 초음파 용접에 필요한 출력이 전기아크 용접에 필요한 출력의 5 - 10%로 충분한 경우가 많다. 초음파 용접은 통상의 방법으로는 용접하기 어려운 동종 금속이나 이종 금속의 용접에 널리 사용된다. 이 용접법은 반도체, 미세회로, 전기 접점의 형성에 대한 생산기술 로서 사용되고 있는데 소형 모터, 알루미늄 박의 가공, 알루미늄 합금의 조립 등에 이용되고 있다. 한편 최근에는 자동차, 우주항공산업 분야의 구조제 용접용으로도 채용되고 있다.출함이 바람직하다.분비되는 배설-분비 항원의 자극과 깊은 관계가 있음을 알 수 있었다.넌트 명세서를 대한 XML DTD(Document Type Definition)를 정의하고, HTML 기반 검색 방법과 XML 기반 검색 방법에 대한 컴포넌트 검색 성능을 비교한다.따라 NO 생산 및 세포독성이 증가하였고. NO 생산을 저하시키는 약제들은 활성화된 복강 대식세포 및 RAW264.7 세포에 의한 질편모충에 대한 세포독성을 현저히 감소시키는 것으로 보아 NO는 질편모충에 대한 대식세포의 숙주 방어기전에서 중요한 역할을 감당할 것으로 생각된다.nction index) 와 최대개구시 동통의 정도는 시술전과 시술 4주후간에 유의한 차이가 관찰되었다.피부온도는 검사자간에는 특정부위에 따라 다소 차이가 있을 수 있으나 일반적으로 높은 재현성을 보여줌으로서 향후 교근 및 측두근의 임상연구 평가에 피부온도조사는 도움이 되리라 사료된다. lactobacilli의 양은 peroxidase system을 함유하거나(p < 0.01) 함유하지 않은(p < 0.05) 치약을 사용한 군 모두에서 양치전에 비해 유의성있게 감소하였다. 6. 양치후 30분에 채취한 구강건조증 환자의 자극성 전타액내 S. mutans 양은 peroxida system을 함유한 세치제를 사용한 군에서 대조군에 비해 유의성있게 낮았다(p < 0.05). 7. 양치후 30분에 채취한 구강건조증 환자의 자극성 전타액내 lactobacilli양은 peroxidase system을 함유한 세치제를 사용한 군에서 대조군에 비해 상대적으로 낮게 나타났으나(p = 0.067)

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.37-42
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• 2001

The concerns of the toxicity and health hazard of lead in solders have demanded the research to find suitable lead-free solder alloys. It was discussed that effect of the intermetallic formation and structure on the reliability of solder joints. In this study, lead-free solder alloys with compositions of Sn/3.5Ag/0.75Cu, Sn/2.0Ag/0.5Cu/2.0Bi were applied to the 48 $\mu$BGA packages. Also, the lead-free solder alloys compared with eutectic Sn/37Pb solder using shear test under various aging temperature. Common $\mu$BGA with solder components was aged at $130^{\circ}C$, $150^{\circ}C$ and $170^{\circ}C$. And the each temperature applied to 300, 600 and 900 hours. The thickness of the intermetallics was measured for each condition and the activation energy for their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS (Energy Dispersive Spectroscopy). These results for reliability of lead-free interconnections are discussed.